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NCV8675DS50R4G

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P16
NCV8675
http://onsemi.com
13
EMC−Characteristics: Conducted Susceptibility
All EMC−Characteristics are based on limited samples
and no part of production test according to 47A/658/CD
IEC62132−4 (direct Power Injection).
Test Conditions
Supply Voltage V
in
= 12 V
Temperature T
A
= 23°C + −5°C
Load R
L
= 100 W
Direct power Injection
33d Bm (Note 1) forward power CW for global pin (Note 2)
17 dBm (Note 1) forward power CW for local pin (Note 3)
Acceptance Criteria
Amplitude Dev. max 4% of Output Voltage
Reset outputs remain in correct state + −1 V
1. dBm means dB milli−Watts, P
(dBm)
= 10 log
(P
(mW)
)
2. A global pin carries a signal or power which enters
or leaves the application board
3. A local pin carries a signal or power which does
not leave the application board. It remains on the
application board as a signal between two
components
Figure 39. Test Circuit
C6
47 nF
X8
D_HF
X7
D_DC
X6
VOUT_HF
C4
47 nF
X5
VOUT_DC
C5
22 mF
FERRITE
L3
FERRITE
L1
FERRITE
L2
FERRITE
L4
X4
RO_HF
X3
RO_DC
X2
VIN_HF
X1
VIN_DC
R1
4.99k
VOUT
1
2
5
4
3
RO
D
GND
NCV8675
U1
C2
15 mF
C1
100 nF
V
out
V
in
V
out
NCV8675
http://onsemi.com
14
40
30
20
10
0
V
in
Pass 33 dBm
(dBm)
FREQUENCY (MHz)
Figure 40. Typical V
in
Pin Susceptibility
1 10 100 1000
FREQUENCY (MHz)
Figure 41. Typical V
out
Pin Susceptibility
1 10 100 100
0
(dBm)
40
30
20
10
0
V
out
Pass 33 dBm
25
20
15
10
5
0
(dBm)
FREQUENCY (MHz)
Figure 42. Typical R
O
Pin Susceptibility
1 10 100 1000
R
O
Pass 17 dBm
(dBm)
FREQUENCY (MHz)
Figure 43. Typical Delay Pin Susceptibility
25
20
15
10
5
0
1 10 100 100
0
Delay Pass 17 dBm
ORDERING INFORMATION
Device Output Voltage Package Shipping
†
NCV8675DS50G
5.0 V
D
2
PAK
(Pb−Free)
50 Units / Rail
NCV8675DS50R4G 800 / Tape & Reel
NCV8675DT50RKG DPAK
(Pb−Free)
2500 / Tape & Reel
NCV8675DS33G
3.3 V
D
2
PAK
(Pb−Free)
50 Units / Rail
NCV8675DS33R4G 800 / Tape & Reel
NCV8675DT33RKG DPAK
(Pb−Free)
2500 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
NCV8675
http://onsemi.com
15
PACKAGE DIMENSIONS
DPAK−5, CENTER LEAD CROP
CASE 175AA−01
ISSUE A
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
D
A
K
B
R
V
S
F
L
G
5 PL
M
0.13 (0.005) T
E
C
U
J
H
−T−
SEATING
PLANE
Z
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A 0.235 0.245 5.97 6.22
B 0.250 0.265 6.35 6.73
C 0.086 0.094 2.19 2.38
D 0.020 0.028 0.51 0.71
E 0.018 0.023 0.46 0.58
F 0.024 0.032 0.61 0.81
G 0.180 BSC 4.56 BSC
H 0.034 0.040 0.87 1.01
J 0.018 0.023 0.46 0.58
K 0.102 0.114 2.60 2.89
L 0.045 BSC 1.14 BSC
R 0.170 0.190 4.32 4.83
S 0.025 0.040 0.63 1.01
U 0.020 −−− 0.51 −−−
V 0.035 0.050 0.89 1.27
Z 0.155 0.170 3.93 4.32
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
R1 0.185 0.210 4.70 5.33
R1
1234 5
6.4
0.252
0.8
0.031
10.6
0.417
5.8
0.228
SCALE 4:1
ǒ
mm
inches
Ǔ
0.34
0.013
5.36
0.217
2.2
0.086
SOLDERING FOOTPRINT*
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P16

NCV8675DS50R4G

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Manufacturer:
ON Semiconductor
Description:
LDO Voltage Regulators NCV8675
Lifecycle:
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