NXP Semiconductors
MF1P(H)x1y1
MIFARE Plus EV1
MF1P(H)x1y1 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2018. All rights reserved.
Product short data sheet Rev. 3.0 — 23 July 2018
COMPANY PUBLIC 366930 4 / 27
5 Ordering information
Table 2. Ordering information
Package ConfigurationType number
Name Description Version EEPROM Cap. UID
MF1P2101DA4/02 MOA4 Plastic leadless module carrier package
[1]
SOT500-2 2k byte 17 pF 7-byte
MF1P2131DA4/02 MOA4 Plastic leadless module carrier package
[1]
SOT500-2 2k byte 17 pF 4-byte NUID
MF1P4101DA4/02 MOA4 Plastic leadless module carrier package
[1]
SOT500-2 4k byte 17 pF 7-byte
MF1P4131DA4/02 MOA4 Plastic leadless module carrier package
[1]
SOT500-2 4k byte 17 pF 4-byte NUID
MF1P2101DA6/02 MOB6 Plastic leadless module carrier package
[1]
SOT500-3 2k byte 17 pF 7-byte
MF1P2131DA6/02 MOB6 Plastic leadless module carrier package
[1]
SOT500-3 2k byte 17 pF 4-byte NUID
MF1P4101DA6/02 MOB6 Plastic leadless module carrier package
[1]
SOT500-3 4k byte 17 pF 7-byte
MF1P4131DA6/02 MOB6 Plastic leadless module carrier package
[1]
SOT500-3 4k byte 17 pF 4-byte NUID
MF1P2101DUD/02 FFC 8-inch wafer (Sawn, 120 µm thickness)
[2]
- 2k byte 17 pF 7-byte
MF1P2131DUD/02 FFC 8-inch wafer (Sawn, 120 µm thickness)
[2]
- 2k byte 17 pF 4-byte NUID
MF1P4101DUD/02 FFC 8-inch wafer (Sawn, 120 µm thickness)
[2]
- 4k byte 17 pF 7-byte
MF1P4131DUD/02 FFC 8-inch wafer (Sawn, 120 µm thickness)
[2]
- 4k byte 17 pF 4-byte NUID
MF1P2101DUF/02 FFC 8-inch wafer (Sawn, 75 µm thickness)
[2]
- 2k byte 17 pF 7-byte
MF1P2131DUF/02 FFC 8-inch wafer (Sawn, 75 µm thickness)
[2]
- 2k byte 17 pF 4-byte NUID
MF1P4101DUF/02 FFC 8-inch wafer (Sawn, 75 µm thickness)
[2]
- 4k byte 17 pF 7-byte
MF1P4131DUF/02 FFC 8-inch wafer (Sawn, 75 µm thickness)
[2]
- 4k byte 17 pF 4-byte NUID
MF1PH2101DA4/02 MOA4 Plastic leadless module carrier package
[1]
SOT500-2 2k byte 70 pF 7-byte
MF1PH2131DA4/02 MOA4 Plastic leadless module carrier package
[1]
SOT500-2 2k byte 70 pF 4-byte NUID
MF1PH4101DA4/02 MOA4 Plastic leadless module carrier package
[1]
SOT500-2 4k byte 70 pF 7-byte
MF1PH4131DA4/02 MOA4 Plastic leadless module carrier package
[1]
SOT500-2 4k byte 70 pF 4-byte NUID
MF1PH2101DA6/02 MOB6 Plastic leadless module carrier package
[1]
SOT500-3 2k byte 70 pF 7-byte
MF1PH2131DA6/02 MOB6 Plastic leadless module carrier package
[1]
SOT500-3 2k byte 70 pF 4-byte NUID
MF1PH4101DA6/02 MOB6 Plastic leadless module carrier package
[1]
SOT500-3 4k byte 70 pF 7-byte
MF1PH4131DA6/02 MOB6 Plastic leadless module carrier package
[1]
SOT500-2 4k byte 70 pF 4-byte NUID
MF1PH2101DUD/02 FFC 8-inch wafer (Sawn, 120 µm thickness)
[2]
- 2k byte 70 pF 7-byte
MF1PH2131DUD/02 FFC 8-inch wafer (Sawn, 120 µm thickness)
[2]
- 2k byte 70 pF 4-byte NUID
MF1PH4101DUD/02 FFC 8-inch wafer (Sawn, 120 µm thickness)
[2]
- 4k byte 70 pF 7-byte
MF1PH4131DUD/02 FFC 8-inch wafer (Sawn, 120 µm thickness)
[2]
- 4k byte 70 pF 4-byte NUID
MF1PH2101DUF/02 FFC 8-inch wafer (Sawn, 75 µm thickness)
[2]
- 2k byte 70 pF 7-byte
MF1PH2131DUF/02 FFC 8-inch wafer (Sawn, 75 µm thickness)
[2]
- 2k byte 70 pF 4-byte NUID
MF1PH4101DUF/02 FFC 8-inch wafer (Sawn, 75 µm thickness)
[2]
- 4k byte 70 pF 7-byte
MF1PH4131DUF/02 FFC 8-inch wafer (Sawn, 75 µm thickness)
[2]
- 4k byte 70 pF 4-byte NUID
[1] Plastic lead-less module carrier package; 35 mm wide tape
[2] 8-inch wafer (Sawn; on film frame carrier; electronic fail die marking according to SECS-II format), see Ref. 1
