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CPC1927J

P1-P3P4-P6P7-P7
I
NTEGRATED
C
IRCUITS
D
IVISION
DS-CPC1927-R06 www.ixysic.com 1
e
3
Characteristics
Features
• 6.7A
rms
Load Current with 5°C/W Heat Sink
• Low 0.2 On-Resistance
• 250V
P
Blocking Voltage
• 2500V
rms
Input/Output Isolation
• Low Thermal Resistance:
JC
=
0.3 °C/W
• Isolated, Low Thermal Impedance Ceramic Pad for
Heat Sink Applications
• Low Drive Power Requirements
• Arc-Free With No Snubbing Circuits
• No EMI/RFI Generation
• Machine Insertable, Wave Solderable
Applications
• Industrial Controls / Motor Control
• Robotics
• Medical Equipment—Patient/Equipment Isolation
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Meters (Watt-Hour, Water, Gas)
• Transportation Equipment
• Aerospace/Defense
Approvals
• UL 508 Certified Component: File E69938
Pin Configuration
Description
IXYS Integrated Circuits Division and IXYS have
combined to bring OptoMOS® technology, reliability
and compact size to a new family of high-power Solid
State Relays.
As part of this family, the CPC1927 single-pole
normally open (1-Form-A) Solid State Power Relay is
rated for up to 6.7A
rms
continuous load current with a
5°C/W heat sink.
The CPC1927 employs optically coupled MOSFET
technology to provide 2500V
rms
of input to output
isolation. The optically coupled outputs, that use
patented OptoMOS architecture, are controlled by a
highly efficient infrared LED. The combination of low
on-resistance and high load current handling
capability makes this relay suitable for a variety of high
performance switching applications.
The unique ISOPLUS-264 package pioneered by
IXYS enables Solid State Relays to achieve the
highest load current and power ratings. This package
features a unique IXYS process where the silicon
chips are soft soldered onto the Direct Copper Bond
(DCB) substrate instead of the traditional copper
leadframe. The DCB ceramic, the same substrate
used in high power modules, not only provides
2500V
rms
isolation but also very low junction-to-case
thermal resistance (0.3 °C/W).
Ordering Information
Switching Characteristics
Parameter Rating Units
Blocking Voltage 250
V
P
Load Current, T
A
=25°C:
With 5°C/W Heat Sink 6.7
A
rms
/ A
DC
No Heat Sink 2.7
On-Resistance (max) 0.2
Thermal Resistance,
Junction-to-Case,
JC
0.3 °C/W
Part Description
CPC1927J ISOPLUS-264 Package (25 per tube)
Form-A
I
F
I
LOAD
10%
90%
t
on
t
off
CPC1927
250V Single-Pole, Normally Open
Power Relay
I
NTEGRATED
C
IRCUITS
D
IVISION
R06 www.ixysic.com 2
CPC1927
1 Specifications
1.1 Absolute Maximum Ratings @ 25°C
Absolute maximum ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
1.2 Electrical Characteristics @ 25°C
1
Higher load currents possible with proper heat sinking.
2
Measurement taken within 1 second of on-time.
3
For applications requiring high temperature operation (T
C
> 60ºC) an LED drive current of 20mA is recommended.
Symbol Ratings Units
Blocking Voltage 250
V
P
Reverse Input Voltage 5
V
Input Control Current 100
mA
Peak (10ms) 1
A
Input Power Dissipation 150
mW
Isolation Voltage, Input to Output 2500 V
rms
Operational Temperature -40 to +85 °C
Storage Temperature -40 to +125
°C
Parameter Conditions Symbol Minimum Typical Maximum Units
Output Characteristics
Load Current
1
Peak t10ms
I
L
--
25
A
P
Continuous No Heat Sink
2.7
Continuous
T
C
=25°C
15
A
rms
/ A
DC
Continuous
T
C
=99°C
I
L(99)
3.25
On-Resistance
2
I
F
=10mA, I
L
=1A
R
ON
-0.150.2
Off-State Leakage Current
V
L
=250V
P
I
LEAK
--1 A
Switching Speeds
Tu r n - O n
I
F
=20mA, V
L
=10V
t
on
-1225
ms
Tu r n - O f f t
off
-0.2210
Output Capacitance
V
L
=25V, f=1MHz
C
out
- 1100 - pF
Input Characteristics
Input Control Current to Activate
3
I
L
=1A
I
F
--10 mA
Input Control Current to Deactivate - I
F
0.6 - - mA
Input Voltage Drop
I
F
=5mA
V
F
0.9 1.2 1.4 V
Reverse Input Current
V
R
=5V
I
R
--10 A
Input/Output Characteristics
Capacitance, Input-to-Output -
C
I/O
-1- pF
I
NTEGRATED
C
IRCUITS
D
IVISION
3 www.ixysic.com R06
CPC1927
2 Thermal Characteristics
2.1 Thermal Management
Device high current characterization was performed using Kunze heat sink KU 1-159, phase change thermal interface
material KU-ALC 5, and transistor clip KU 4-499/1. This combination provided an approximate junction-to-ambient
thermal resistance of 12.5°C/W.
2.2 Heat Sink Calculation
Higher load currents are possible by using lower thermal resistance heat sink combinations.
Parameter Conditions Symbol Rating Units
Thermal Resistance (Junction to Case) -
JC
0.3 °C/W
Thermal Resistance (Junction to Ambient) Free Air
JA
33 °C/W
Junction Temperature (Operating) -
T
J
-40 to +100 °C
T
J
= Junction Temperature (°C), T
J
≤ 100°C *
T
A
= Ambient Temperature (°C)
I
L(99)
= Load Current with Case Temperature @ 99°C (A
DC
)
I
L
= Desired Operating Load Current (A
DC
), I
L
≤ I
L(MAX)
θ
JC
= Thermal Resistance, Junction to Case (°C/W) = 0.3°C/W
θ
CA
= Thermal Resistance of Heat Sink & Thermal Interface Material , Case to Ambient (°C/W)
P
D(99)
= Maximum power dissipation with case temperature held at 99ºC = 3.33W
* Elevated junction temperature reduces semiconductor lifetime.
NOTE: The exposed surface of the DCB substrate is not to be soldered.
Heat Sink Rating
θ
CA
=
- θ
JC
(T
J
- T
A
) I
L(99)
2
I
L
2
• P
D(99)
P1-P3P4-P6P7-P7

CPC1927J

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Solid State Relays - PCB Mount SP, NO ISOPLUS-264
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