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CPC1927J

P1-P3P4-P6P7-P7
I
NTEGRATED
C
IRCUITS
D
IVISION
R06 www.ixysic.com 4
CPC1927
3 Performance Data @ 25°C (Unless Otherwise Noted)
Unless otherwise specified, all performance data was acquired without the use of a heat sink.
The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the
written specifications, please contact our application department.
35
30
25
20
15
10
5
0
1.30 1.31 1.32 1.33 1.34
Device Count (N)
Typical LED Forward Voltage Drop
(N=50, I
F
=10mA, I
L
=1A
DC
)
LED Forward Current (V)
35
30
25
20
15
10
5
0
9.5 10.5 11.5 13.512.5 14.5
Device Count (N)
Typical Turn-On Time
(N=50, I
F
=20mA, I
L
=1A
DC
)
Turn-On (ms)
0.20 0.22 0.240.19 0.21 0.23
Device Count (N)
25
20
15
10
5
0
Typical Turn-Off Time
(N=50, I
F
=20mA, I
L
=1A
DC
)
Turn-Off (ms)
35
30
25
20
15
10
5
0
0.138 0.142 0.146 0.150 0.154 0.158
Device Count (N)
On-Resistance (Ω)
Typical On-Resistance Distribution
(N=50, I
F
=10mA, I
L
=1A
DC
)
35
30
25
20
15
10
5
0
274 276 278 280286
Device Count (N)
284282
Typical Blocking Voltage
Distribution
Blocking Voltage (V
P
)
1.8
1.6
1.4
1.2
1.0
0.8
-40 -20 0 20 40 60 80 120100
I
F
=50mA
Typical LED Forward Voltage Drop
vs. Temperature
Temperature (ºC)
I
F
=10mA
I
F
=20mA
LED Forward Voltage Drop (V)
LED Forward Current (mA)
0
5 1015202530354045
60
50
40
30
20
0
50
10
Typical Turn-On Time
vs. LED Forward Current
(I
L
=1A
DC
)
Turn-On (ms)
LED Forward Current (mA)
0
5 1015202530354045
0.45
0.40
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0.00
50
Turn-Off (ms)
Typical Turn-Off Time
vs. LED Forward Current
(I
L
=1A
DC
)
LED Current (mA)
-40
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
-20 0 20 40 60 80 100
Typical I
F
for Switch Operation
vs. Temperature
(I
L
=1A
DC
)
Temperature (ºC)
-40
35
30
25
20
15
10
5
0
-20 0 20 40 60 80 100
I
F
=10mA
Typical Turn-On Time vs. Temperature
(I
L
=1A
DC
)
Temperature (ºC)
Turn-On (ms)
I
F
=20mA
-40
0.45
0.40
0.35
0.30
0.25
0.20
0.15
0.10
-20 0 20 40 60 80 100
I
F
=20mA
Typical Turn-Off Time vs. Temperature
(I
L
=1A
DC
)
Turn-Off (ms)
I
F
=10mA
Temperature (ºC)
I
NTEGRATED
C
IRCUITS
D
IVISION
5 www.ixysic.com R06
CPC1927
Unless otherwise specified, all performance data was acquired without the use of a heat sink.
The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the
written specifications, please contact our application department.
Temperature (ºC)
020406080 100
Load Current (A
rms
)
0
2
4
6
8
10
12
14
16
Maximum Load Current
vs. Temperature with Heat Sink
(I
F
=20mA)
1ºC/W
Free Air
10ºC/W
5ºC/W
-40
295
290
285
280
275
270
265
260
255
-20 0 20 40 60 80 100
Blocking Voltage vs. Temperature
Blocking Voltage (V
P
)
Temperature (ºC)
-40
0.14
0.12
0.10
0.08
0.06
0.04
0.02
0
-20 0 20 40 60 80 100
Leakage (μA)
Typical Leakage vs. Temperature
Measured Across Pins 1&2
(V
L
=250V
P
)
Temperature (ºC)
30
25
20
15
10
5
0
1ms10µs 100µs 100ms 10s10ms 1s 100s
Energy Rating Curve
Free Air, No Heat Sink
Load Current (A
P
)
Time
-40
0.45
0.40
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0
-20 0 20 40 60 80 100
Temperature (ºC)
On-Resistance (Ω)
Typical On-Resistance
vs. Temperature
(I
F
=10mA, I
L
=1A
DC
)
I
NTEGRATED
C
IRCUITS
D
IVISION
R06 www.ixysic.com 6
CPC1927
4 Manufacturing Information
4.1 Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the
latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee
proper operation of our devices when handled according to the limitations and information in that standard as well as
to any limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to
the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
4.2 ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard
JESD-625.
4.3 Soldering Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of
J-STD-020 must be observed.
NOTE: The exposed surface of the DCB substrate is not to be soldered.
4.4 Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an
optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a
wash is used after solder reflow processes. Chlorine-based or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
Device Moisture Sensitivity Level (MSL) Rating
CPC1927J MSL 1
Device Maximum Temperature x Time
CPC1927J 245°C for 30 seconds
e
3
P1-P3P4-P6P7-P7

CPC1927J

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Solid State Relays - PCB Mount SP, NO ISOPLUS-264
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