IRF5305PBF

IRF5305PbF
HEXFET
®
Power MOSFET
PD - 94788
Fifth Generation HEXFETs from International Rectifier
utilize advanced processing techniques to achieve
extremely low on-resistance per silicon area. This benefit,
combined with the fast switching speed and ruggedized
device design that HEXFET Power MOSFETs are well
known for, provides the designer with an extremely efficient
and reliable device for use in a wide variety of applications.
The TO-220 package is universally preferred for all
commercial-industrial applications at power dissipation
levels to approximately 50 watts. The low thermal resistance
and low package cost of the TO-220 contribute to its wide
acceptance throughout the industry.
Parameter Max. Units
I
D
@ T
C
= 25°C Continuous Drain Current, V
GS
@ -10V -31
I
D
@ T
C
= 100°C Continuous Drain Current, V
GS
@ -10V -22 A
I
DM
Pulsed Drain Current -110
P
D
@T
C
= 25°C Power Dissipation 110 W
Linear Derating Factor 0.71 W/°C
V
GS
Gate-to-Source Voltage ± 20 V
E
AS
Single Pulse Avalanche Energy 280 mJ
I
AR
Avalanche Current -16 A
E
AR
Repetitive Avalanche Energy 11 mJ
dv/dt Peak Diode Recovery dv/dt -5.0 V/ns
T
J
Operating Junction and -55 to + 175
T
STG
Storage Temperature Range
Soldering Temperature, for 10 seconds 300 (1.6mm from case )
°C
Mounting torque, 6-32 or M3 srew 10 lbf•in (1.1N•m)
Absolute Maximum Ratings
Parameter Typ. Max. Units
R
θJC
Junction-to-Case ––– 1.4
R
θCS
Case-to-Sink, Flat, Greased Surface 0.50 ––– °C/W
R
θJA
Junction-to-Ambient ––– 62
Thermal Resistance
V
DSS
= -55V
R
DS(on)
= 0.06
I
D
= -31A
T
O
-22
0
AB
Advanced Process Technology
Dynamic dv/dt Rating
175°C Operating Temperature
Fast Switching
P-Channel
Fully Avalanche Rated
Lead-Free
Description
10/31/03
S
D
G
IRF5305PbF
2 www.irf.com
Parameter Min. Typ. Max. Units Conditions
I
S
Continuous Source Current MOSFET symbol
(Body Diode)
––– –––
showing the
I
SM
Pulsed Source Current integral reverse
(Body Diode)
––– –––
p-n junction diode.
V
SD
Diode Forward Voltage ––– ––– -1.3 V T
J
= 25°C, I
S
= -16A, V
GS
= 0V
t
rr
Reverse Recovery Time ––– 71 110 ns T
J
= 25°C, I
F
= -16A
Q
rr
Reverse RecoveryCharge ––– 170 250 nC di/dt = -100A/µs
Source-Drain Ratings and Characteristics
Parameter Min. Typ. Max. Units Conditions
V
(BR)DSS
Drain-to-Source Breakdown Voltage -55 ––– –– V V
GS
= 0V, I
D
= -250µA
V
(BR)DSS
/T
J
Breakdown Voltage Temp. Coefficient ––– -0.034 –– V/°C Reference to 25°C, I
D
= -1mA
R
DS(on)
Static Drain-to-Source On-Resistance ––– –– 0.06 V
GS
= -10V, I
D
= -16A
V
GS(th)
Gate Threshold Voltage -2.0 ––– -4.0 V V
DS
= V
GS
, I
D
= -250µA
g
fs
Forward Transconductance 8.0 ––– ––– S V
DS
= -25V, I
D
= -16A
––– ––– -25
µA
V
DS
= -55V, V
GS
= 0V
––– ––– -250 V
DS
= -44V, V
GS
= 0V, T
J
= 150°C
Gate-to-Source Forward Leakage ––– ––– 100 V
GS
= 20V
Gate-to-Source Reverse Leakage ––– ––– -100
nA
V
GS
= -20V
Q
g
Total Gate Charge –– –– 63 I
D
= -16A
Q
gs
Gate-to-Source Charge ––– –– 13 nC V
DS
= -44V
Q
gd
Gate-to-Drain ("Miller") Charge ––– ––– 29 V
GS
= -10V, See Fig. 6 and 13
t
d(on)
Turn-On Delay Time ––– 14 –– V
DD
= -28V
t
r
Rise Time ––– 66 ––– I
D
= -16A
t
d(off)
Turn-Off Delay Time –– 39 ––– R
G
= 6.8
t
f
Fall Time ––– 63 ––– R
D
= 1.6Ω, See Fig. 10
Between lead,
––– –––
6mm (0.25in.)
from package
and center of die contact
C
iss
Input Capacitance ––– 1200 ––– V
GS
= 0V
C
oss
Output Capacitance ––– 520 ––– pF V
DS
= -25V
C
rss
Reverse Transfer Capacitance ––– 250 ––– ƒ = 1.0MHz, See Fig. 5
nH
Electrical Characteristics @ T
J
= 25°C (unless otherwise specified)
L
D
Internal Drain Inductance
L
S
Internal Source Inductance ––– –––
I
GSS
ns
4.5
7.5
I
DSS
Drain-to-Source Leakage Current
Repetitive rating; pulse width limited by
max. junction temperature. ( See fig. 11 )
I
SD
-16A, di/dt -280A/µs, V
DD
V
(BR)DSS
,
T
J
175°C
Notes:
V
DD
= -25V, starting T
J
= 25°C, L = 2.1mH
R
G
= 25, I
AS
= -16A. (See Figure 12)
Pulse width 300µs; duty cycle 2%.
-31
-110
A
S
D
G
S
D
G
IRF5305PbF
www.irf.com 3
Fig 4. Normalized On-Resistance
Vs. Temperature
Fig 2. Typical Output Characteristics
Fig 1. Typical Output Characteristics
Fig 3. Typical Transfer Characteristics
1
10
100
1000
0.1 1 10 100
D
DS
20µs PULSE WIDTH
T = 25°C
c
A
-I , Drain-to-Source Current (A)
-V , Drain-to-Source Voltage (V)
VGS
TOP - 15V
- 10V
- 8.0V
- 7.0V
- 6.0V
- 5.5V
- 5.0V
BOTTOM - 4.5V
-4.5V
1
10
100
1000
0.1 1 10 100
D
DS
A
-I , Drain-to-Source Current (A)
-V , Drain-to-Source Voltage (V)
VGS
TOP - 15V
- 10V
- 8.0V
- 7.0V
- 6.0V
- 5.5V
- 5.0V
BOTTOM - 4.5V
-4.5V
20µs PULSE WIDTH
T = 175°C
C
1
10
100
45678910
T = 25°C
J
T = 175°C
J
A
V = -25V
20µs PULSE WIDTH
DS
GS
-V , Gate-to-Source Voltage (V)
D
-I , Drain-to-Source Current (A)
0.0
0.5
1.0
1.5
2.0
-60 -40 -20 0 20 40 60 80 100 120 140 160 180
J
T , Junction Temperature (°C)
R , Drain-to-Source On Resistance
DS(on)
(Normalized)
A
I = -27A
V = -10V
D
GS
J
J

IRF5305PBF

Mfr. #:
Manufacturer:
Infineon Technologies
Description:
MOSFET MOSFT PCh -55V -31A 60mOhm 42nC
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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