MC100LVEL30DWR2G

MC100LVEL30
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Table 6. AC CHARACTERISTICS (V
CC
= 3.3 V; V
EE
= 0.0 V or V
CC
= 0.0 V; V
EE
= 3.3 V (Note 1))
40°C 25°C 85°C
Symbol Characteristic Min Typ Max Min Typ Max Min Typ Max Unit
f
max
Maximum Toggle Frequency 1.2 1.2 1.2 GHz
t
PLH
t
PHL
Propagation Delay to Output
CLK, S, R
550 800 570 820 590 840
ps
t
S
t
H
Setup Time
Hold Time
150
200
0
100
150
200
0
100
150
200
0
100
ps
t
RR
Set/Reset Recovery 400 200 400 200 400 200 ps
t
PW
Minimum Pulse Width
CLK
Set, Reset
400
650
400
650
400
650
ps
t
JITTER
Cycle-to-Cycle Jitter TBD TBD TBD ps
t
r
t
f
Output Rise/Fall Times Q (20%80%) 280 550 280 450 550 280 550 ps
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
1. V
EE
can vary ±0.3 V.
Figure 2. Typical Termination for Output Driver and Device Evaluation
(See Application Note AND8020/D
Termination of ECL Logic Devices)
Driver
Device
Receiver
Device
QD
Q D
Z
o
= 50 W
Z
o
= 50 W
50 W 50 W
V
TT
V
TT
= V
CC
2.0 V
Resource Reference of Application Notes
AN1405/D ECL Clock Distribution Techniques
AN1406/D Designing with PECL (ECL at +5.0 V)
AN1503/D ECLinPS I/O SPiCE Modeling Kit
AN1504/D Metastability and the ECLinPS Family
AN1568/D Interfacing Between LVDS and ECL
AN1672/D The ECL Translator Guide
AND8001/D Odd Number Counters Design
AND8002/D Marking and Date Codes
AND8020/D Termination of ECL Logic Devices
AND8066/D Interfacing with ECLinPS
AND8090/D AC Characteristics of ECL Devices
MC100LVEL30
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PACKAGE DIMENSIONS
SOIC20 WB
DW SUFFIX
CASE 751D05
ISSUE H
20
1
11
10
b20X
H
c
L
18X
A1
A
SEATING
PLANE
q
h X 45
_
E
D
M
0.25
M
B
M
0.25
S
A
S
B
T
e
T
B
A
DIM MIN MAX
MILLIMETERS
A 2.35 2.65
A1 0.10 0.25
b 0.35 0.49
c 0.23 0.32
D 12.65 12.95
E 7.40 7.60
e 1.27 BSC
H 10.05 10.55
h 0.25 0.75
L 0.50 0.90
q 0 7
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION
SHALL BE 0.13 TOTAL IN EXCESS OF B
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
__
11.00
20X
0.52
20X
1.30
1.27
DIMENSIONS: MILLIMETERS
1
PITCH
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
RECOMMENDED
10
20 11
MC100LVEL30
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MC100LVEL30DWR2G

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Description:
Flip Flops 3.3V/5V ECL Triple D-Type
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