TMP05/TMP06 Data Sheet
Rev. C | Page 16 of 28
START
PULSE
#1 TEMP MEASUREMENT #2 TEMP MEASUREMENT #N TEMP MEA
SUREMENT
T
0
TIME
03340-008
Figure 27. Daisy-Chain Signal at Input to the Microcontroller
TMP05 OUTPUT
The TMP05 has a push-pull CMOS output (Figure 28) and
provides rail-to-rail output drive for logic interfaces. The rise
and fall times of the TMP05 output are closely matched so that
errors caused by capacitive loading are minimized. If load
capacitance is large (for example, when driving a long cable),
an external buffer could improve accuracy.
An internal resistor is connected in series with the pull-up
MOSFET when the TMP05 is operating in one shot mode.
TMP05
V+
OUT
03340-011
Figure 28. TMP05 Digital Output Structure
TMP06 OUTPUT
The TMP06 has an open-drain output. Because the output
source current is set by the pull-up resistor, output capacitance
should be minimized in TMP06 applications. Otherwise,
unequal rise and fall times skew the pulse width and introduce
measurement errors.
OUT
TMP06
03340-012
Figure 29. TMP06 Digital Output Structure
Data Sheet TMP05/TMP06
Rev. C | Page 17 of 28
APPLICATION HINTS
THERMAL RESPONSE TIME
The time required for a temperature sensor to settle to a
specified accuracy is a function of the sensor’s thermal mass
and the thermal conductivity between the sensor and the object
being sensed. Thermal mass is often considered equivalent to
capacitance. Thermal conductivity is commonly specified using
the symbol Q and can be thought of as thermal resistance. It is
usually specified in units of degrees per watt of power transferred
across the thermal joint. Thus, the time required for the TMP05/
TMP06 to settle to the desired accuracy is dependent on the
package selected, the thermal contact established in that
particular application, and the equivalent power of the heat
source. In most applications, the settling time is probably best
determined empirically.
SELF-HEATING EFFECTS
The temperature measurement accuracy of the TMP05/TMP06
can be degraded in some applications due to self-heating. Errors
are introduced from the quiescent dissipation and power dissipated
when converting, that is, during T
L
. The magnitude of these
temperature errors depends on the thermal conductivity of the
TMP05/TMP06 package, the mounting technique, and the
effects of airflow. Static dissipation in the TMP05/TMP06 is
typically 10 µW operating at 3.3 V with no load. In the 5-lead
SC-70 package mounted in free air, this accounts for a
temperature increase due to self-heating of
ΔT = P
DISS
× θ
JA
= 10 µW × 534.7°C/W = 0.0053°C (5)
In addition, power is dissipated by the digital output, which is
capable of sinking 800 µA continuously (TMP05). Under an
800 µA load, the output can dissipate
P
DISS
= (0.4 V)(0.8 mA)((T
L
)/T
H
+ T
L
)) (6)
For example, with T
L
= 80 ms and T
H
= 40 ms, the power
dissipation due to the digital output is approximately 0.21 mW.
In a free-standing SC-70 package, this accounts for a tempera-
ture increase due to self-heating of
ΔT = P
DISS
× θ
JA
= 0.21 mW × 534.7°C/W = 0.112°C (7)
This temperature increase directly adds to that from the
quiescent dissipation and affects the accuracy of the TMP05/
TMP06 relative to the true ambient temperature.
It is recommended that current dissipated through the device be
kept to a minimum because it has a proportional effect on the
temperature error.
SUPPLY DECOUPLING
The TMP05/TMP06 should be decoupled with a 0.1 µF ceramic
capacitor between V
DD
and GND. This is particularly important
if the TMP05/TMP06 are mounted remotely from the power
supply. Precision analog products such as the TMP05/TMP06
require a well filtered power source. Because the parts operate
from a single supply, simply tapping into the digital logic power
supply could appear to be a convenient option. Unfortunately,
the logic supply is often a switch-mode design, which generates
noise in the 20 kHz to 1 MHz range. In addition, fast logic gates
can generate glitches hundreds of mV in amplitude due to
wiring resistance and inductance.
If possible, the TMP05/TMP06 should be powered directly
from the system power supply. This arrangement, shown in
Figure 30, isolates the analog section from the logic switching
transients. Even if a separate power supply trace is not available,
generous supply bypassing reduces supply-line-induced errors.
Local supply bypassing consisting of a 0.1 µF ceramic capacitor
is critical for the temperature accuracy specifications to be
achieved. This decoupling capacitor must be placed as close as
possible to the TMP05/TMP06 V
DD
pin. A recommended
decoupling capacitor is Phicomps 100 nF, 50 V X74.
It is important to keep the capacitor package size as small as
possible because ESL (equivalent series inductance) increases
with increasing package size. Reducing the capacitive value
below 100 nF increases the ESR (equivalent series resistance).
Using a capacitor with an ESL of 1 nH and an ESR of 80 mΩ is
recommended.
0.1µF
TMP05/
TMP06
TTL/CMOS
LOGIC
CIRCUITS
POWER
SUPPLY
03340-013
Figure 30. Use Separate Traces to Reduce Power Supply Noise
TMP05/TMP06 Data Sheet
Rev. C | Page 18 of 28
LAYOUT CONSIDERATIONS
Digital boards can be electrically noisy environments and
glitches are common on many of the signals in the system.
The likelihood of glitches causing problems to the TMP05/
TMP06 OUT pin is very minute. The typical impedance of the
TMP05/TMP06 OUT pin when driving low is 55. When
driving high, the TMP05 OUT pin is similar. This low imped-
ance makes it very difficult for a glitch to break the V
IL
and V
IH
thresholds. There is a slight risk that a sizeable glitch could
cause problems. A glitch can only cause problems when the
OUT pin is low during a temperature measurement. If a glitch
occurs that is large enough to fool the master into believing that
the temperature measurement is over, the temperature read
would not be the actual temperature. In most cases, the master
spots a temperature value that is erroneous and can request
another temperature measurement for confirmation. One area
that can cause problems is if this very large glitch occurs near
the end of the low period of the mark-space waveform, and the
temperature read back is so close to the expectant temperature
that the master does not question it.
One layout method that helps in reducing the possibility of a
glitch is to run ground tracks on either side of the OUT line.
Use a wide OUT track to minimize inductance and reduce noise
pickup. A 10 mil track minimum width and spacing is
recommended. Figure 31 shows how glitch protection traces
could be laid out.
GND
OUT
GND
10 MIL
10 MIL
10 MIL
10 MIL
10 MIL
03340-043
Figure 31. Use Separate Traces to Reduce Power Supply Noise
Another method that helps reduce the possibility of a glitch is to
use a 50 ns glitch filter on the OUT line. The glitch filter
eliminates any possibility of a glitch getting through to the
master or being passed along a daisy chain.
TEMPERATURE MONITORING
The TMP05/TMP06 are ideal for monitoring the thermal
environment within electronic equipment. For example, the
surface-mounted package accurately reflects the exact thermal
conditions that affect nearby integrated circuits.
The TMP05/TMP06 measure and convert the temperature at
the surface of their own semiconductor chip. When the
TMP05/TMP06 are used to measure the temperature of a
nearby heat source, the thermal impedance between the heat
source and the TMP05/TMP06 must be considered. Often, a
thermocouple or other temperature sensor is used to measure
the temperature of the source, while the TMP05/TMP06
temperature is monitored by measuring T
H
and T
L
. Once the
thermal impedance is determined, the temperature of the heat
source can be inferred from the TMP05/TMP06 output.
One example of using the TMP05/TMP06’s unique properties is
in monitoring a high power dissipation microprocessor. Each
TMP05/TMP06 part, in a surface-mounted package, is
mounted directly beneath the microprocessor’s pin grid array
(PGA) package. In a typical application, the TMP05/TMP06
output is connected to an ASIC, where the pulse width is
measured. The TMP05/TMP06 pulse output provides a
significant advantage in this application because it produces a
linear temperature output while needing only one I/O pin and
without requiring an ADC.
DAISY-CHAIN APPLICATION
This section provides an example of how to connect two
TMP05s in daisy-chain mode to a standard 8052 microcon-
troller core. The ADuC812 is the microcontroller used and the
core processing engine is the 8052. Figure 31 shows how to
interface to the 8052 core device. The TMP05 Program Code
Example 1 section shows how to communicate from the
ADuC812 to two daisy-chained TMP05s. This code can also be
used with the ADuC831 or any microprocessor running on an
8052 core.
TIMER T0
STARTS
TEMPSEGMENT = 1 TEMPSEGMENT = 2 TEMPSEGMENT = 3
TEMP_HIGH2TEMP_HIGH1
TEMP_LOW0 TEMP_LOW1
TEMP_HIGH0
INTO
INTO INTO
03340-035
Figure 32. Reference Diagram for Software Variables
in the TMP05 Program Code Example 1
Figure 32 is a diagram of the input waveform into the ADuC812
from the TMP05 daisy chain. It illustrates how the codes variables
are assigned and it should be referenced when reading the
TMP05 Program Code Example 1. Application notes showing
the TMP05 working with other types of microcontrollers are
available from Analog Devices at www.analog.com.
Figure 33 shows how the three devices are hardwired together.
Figure 34 to Figure 36 are flow charts for this program.

TMP06ARTZ-500RL7

Mfr. #:
Manufacturer:
Analog Devices Inc.
Description:
Board Mount Temperature Sensors IC +/-0.5 Deg/C Accurate PWM
Lifecycle:
New from this manufacturer.
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