TMP05/TMP06 Data Sheet
Rev. C | Page 8 of 28
ABSOLUTE MAXIMUM RATINGS
Table 4.
Parameter Rating
V
to GND –0.3 V to +7 V
Digital Input Voltage to GND
Maximum Output Current (OUT) ±10 mA
Operating Temperature Range
–40°C to +150°C
Storage Temperature Range –65°C to +160°C
Maximum Junction Temperature, T
max 150°C
Power Dissipation
2
W
= (T
max – T
3
)/θ
Thermal Impedance
θ
, Junction-to-Ambient (Still Air) 240°C/W
5-Lead SC-70 (KS-5)
Power Dissipation
2
W
= (T
max – T
3
)/θ
Thermal Impedance
4
θ
, Junction-to-Ambient 534.7°C/W
θ
, Junction-to-Case 172.3°C/W
IR Reflow Soldering
Peak Temperature 220°C (0°C/5°C)
Time at Peak Temperature 10 sec to 20 sec
Ramp-Down Rate −6°C/s
Time 25°C to Peak Temperature 6 minutes max
IR Reflow Soldering (Pb-Free Package)
Peak Temperature 260°C (0°C)
Time at Peak Temperature 20 sec to 40 sec
Ramp-Up Rate 3°C/sec max
Ramp-Down Rate –6°C/sec max
Time 25°C to Peak Temperature 8 minutes max
1
It is not recommended to operate the device at temperatures above 125°C
for more than a total of 5% (5,000 hours) of the lifetime of the device. Any
exposure beyond this limit affects device reliability.
2
SOT-23 values relate to the package being used on a 2-layer PCB and SC-70
values relate to the package being used on a 4-layer PCB. See Figure 4 for a
plot of maximum power dissipation vs. ambient temperature (T
A
).
3
T
A
= ambient temperature.
4
Junction-to-case resistance is applicable to components featuring a
preferential flow direction, for example, components mounted on a heat
sink. Junction-to-ambient resistance is more useful for air-cooled PCB
mounted components.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
0.9
0
03340-0-040
TEMPERATURE (°C)
MAXIMUM POWER DISSIPATION (W)
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
150
140
130
120
110
100
90
80
70
60
50
40
30
20
10
0
–10
–20
–30
–40
SC-70
SOT-23
Figure 4. Maximum Power Dissipation vs. Ambient Temperature
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD
protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
