IRF7421D1TRPBF

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Parameter Maximum Units
I
D
@ T
A
= 25°C Continuous Drain Current, V
GS
@10VÃ 5.8 A
I
D
@ T
A
= 70°C 4.6
I
DM
Pulsed Drain Current À 46
P
D
@T
A
= 25°C Power Dissipation à 2.0 W
P
D
@T
A
= 70°C 1.3
Linear Derating Factor 16 W/°C
V
GS
Gate-to-Source Voltage ± 20 V
dv/dt Peak Diode Recovery dv/dt Á -5.0 V/ns
T
J,
T
STG
Junction and Storage Temperature Range -55 to +150 °C
IRF7421D1PbF
FETKY
ä
MOSFET / Schottky Diode
Notes:
À Repetitive rating; pulse width limited by maximum junction temperature (see figure 11)
Á I
SD
4.1A, di/dt 110A/µs, V
DD
V
(BR)DSS
, T
J
150°C
 Pulse width 300µs; duty cycle 2%
à Surface mounted on FR-4 board, t 10sec.
Parameter Maximum Units
R
θJA
Junction-to-Ambient à 62.5 °C/W
Absolute Maximum Ratings (T
A
= 25°C unless otherwise noted)
Thermal Resistance Ratings
10/13/04
The FETKY family of co-packaged HEXFETs and Schottky diodes offer
the designer an innovative board space saving solution for switching
regulator applications. Generation 5 HEXFETs utilize advanced processing
techniques to achieve extremely low on-resistance per silicon area. Combining
this technology with International Rectifier's low forward drop Schottky
rectifiers results in an extremely efficient device suitable for use in a wide
variety of portable electronics applications.
The SO-8 has been modified through a customized leadframe for enhanced
thermal characteristics. The SO-8 package is designed for vapor phase,
infrared or wave soldering techniques.
Description
l Co-packaged HEXFET
®
Power
MOSFET and Schottky Diode
l Ideal For Synchronous Regulator
Applications
l Generation V Technology
l SO-8 Footprint
l Lead-Free
V
DSS
= 30V
R
DS(on)
= 0.035
Schottky Vf = 0.39V
8
1
2
3
4
5
6
7
D
D
D
DG
S
A
S
A
A
Top View
SO-8
TM
PD- 95304
IRF7421D1PbF
2 www.irf.com
Parameter Min. Typ. Max. Units Conditions
V
(BR)DSS
Drain-to-Source Breakdown Voltage 30 V V
GS
= 0V, I
D
= 250µA
R
DS(on)
Static Drain-to-Source On-Resistance 0.026 0.035 V
GS
= 10V, I
D
= 4.1A
0.040 0.060 V
GS
= 4.5V, I
D
= 2.1A
V
GS(th)
Gate Threshold Voltage 1.0 V V
DS
= V
GS
, I
D
= 250µA
g
fs
Forward Transconductance 4.6 S V
DS
= 15V, I
D
= 2.1A
I
DSS
Drain-to-Source Leakage Current 1.0 V
DS
= 24V, V
GS
= 0V
——25 V
DS
= 24V, V
GS
= 0V, T
J
= 125°C
I
GSS
Gate-to-Source Forward Leakage -100 V
GS
= -20V
Gate-to-Source Reverse Leakage 100 V
GS
= 20V
Q
g
Total Gate Charge 18 27 I
D
= 4.1A
Q
gs
Gate-to-Source Charge 2.2 3.3 nC V
DS
= 24V
Q
gd
Gate-to-Drain ("Miller") Charge 5.9 8.9 V
GS
= 10V (see figure 10) Â
t
d(on)
Turn-On Delay Time 6.7 V
DD
= 15V
t
r
Rise Time 27 I
D
= 4.1A
t
d(off)
Turn-Off Delay Time 20 R
G
= 6.2
t
f
Fall Time 16 R
D
= 3.7 Â
C
iss
Input Capacitance 510 V
GS
= 0V
C
oss
Output Capacitance 200 pF V
DS
= 25V
C
rss
Reverse Transfer Capacitance 84 ƒ = 1.0MHz (see figure 9)
MOSFET Electrical Characteristics @ T
J
= 25°C (unless otherwise specified)
µA
nA
ns
Parameter Min. Typ. Max. Units Conditions
I
S
Continuous Source Current (Body Diode) 3.1 A
I
SM
Pulsed Source Current (Body Diode) 33
V
SD
Body Diode Forward Voltage 1.0 V T
J
= 25°C, I
S
= 4.1A, V
GS
= 0V
t
rr
Reverse Recovery Time (Body Diode) 57 86 ns T
J
= 25°C, I
F
= 4.1A
Q
rr
Reverse Recovery Charge 93 140 nC di/dt = 100A/µs
Â
MOSFET Source-Drain Ratings and Characteristics
2
Parameter Max. Units. Conditions
I
F(av)
Max. Average Forward Current 1.7 50% Duty Cycle. Rectangular Wave, T
A
= 25°C
1.2 T
A
= 70°C
I
SM
Max. peak one cycle Non-repetitive 120 5µs sine or 3µs Rect. pulse Following any rated
Surge current 11 10ms sine or 6ms Rect. pulse load condition &
with V
RRM
applied
A
A
Schottky Diode Maximum Ratings
Parameter Max. Units Conditions
V
FM
Max. Forward voltage drop 0.50 I
F
= 1.0A, T
J
= 25°C
0.62 I
F
= 2.0A, T
J
= 25°C
0.39 I
F
= 1.0A, T
J
= 125°C
0.57 I
F
= 2.0A, T
J
= 125°C .
I
RM
Max. Reverse Leakage current 0.06 V
R
= 30V T
J
= 2C
16 T
J
= 125°C
C
t
Max. Junction Capacitance 110 pF V
R
= 5Vdc ( 100kHz to 1 MHz) 25°C
dv/dt Max. Voltage Rate of Charge 3600 V/ µs Rated V
R
Schottky Diode Electrical Specifications
V
mA
IRF7421D1PbF
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2
Fig 3. Typical Transfer Characteristics
Fig 2. Typical Output Characteristics
Fig 1. Typical Output Characteristics
Power Mosfet Characteristics
1
10
100
0.1 1 10
20µs PULSE WIDTH
T = 25°C
A
J
DS
V , Drain-to-Source Voltage (V)
3.0V
VGS
TOP 15V
10V
7.0V
5.5V
4.5V
4.0V
3.5V
BOTTOM 3.0V
D
I , Drain-to-Source Current (A)
1
10
100
0.1 1 10
A
DS
D
I , Drain-to-Source Current (A)
20µs PULSE WIDTH
T = 150°C
J
3.0V
VGS
TOP 15V
10V
7.0V
5.5V
4.5V
4.0V
3.5V
BOTTOM 3.0V
V , Drain-to-Source Voltage (V)
1
10
100
3.0 3.5 4.0 4.5 5.0 5.5 6.0
T = 25°C
J
GS
V , Gate-to-Source Voltage (V)
D
I , Drain-to-Source Current (A)
A
V = 10V
20µs PULSE WIDTH
T = 150°C
DS
J
Fig 4. Typical Source-Drain Diode
Forward Voltage
1
10
100
0.4 0.8 1.2 1.6 2.0 2.4
T = 25°C
J
V = 0V
GS
V , Source-to-Drain Voltage (V)
I , Reverse Drain Current (A)
SD
SD
A
T = 15C
J

IRF7421D1TRPBF

Mfr. #:
Manufacturer:
Infineon / IR
Description:
MOSFET MOSFT w/Schttky 30V 5.8A 35mOhm 18nC
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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