PRELIMINARY
I
NTEGRATED
C
IRCUITS
D
IVISION
CPC75282
16 PRELIMINARY R00E
increases. If the device temperature rises sufficiently,
the temperature shutdown mechanism will activate
and the device will enter the All-Off state.
2.10 Thermal Shutdown
The thermal shutdown mechanism activates when the
device die temperature reaches a minimum of 110°C,
placing the device in the All-Off state regardless of
logic input. During thermal shutdown events the T
SDx
pin will output a logic low with a nominal 0V level. A
logic high is output from the T
SDx
pin during normal
operation with a typical output level equal to V
DD
.
If presented with a short duration transient, such as a
lightning event, the thermal shutdown feature will
typically not activate. But in an extended power-cross
event, the device temperature will rise and the thermal
shutdown mechanism will activate forcing the switches
to the All-Off state. At this point the current measured
into T
LINE
or R
LINE
will drop to zero. Once the device
enters thermal shutdown, it will remain in the All-Off
state until the temperature of the device drops below
the de-activation level of the thermal shutdown circuit.
This permits the device to autonomously return to
normal operation. If the transient has not passed,
current will again flow up to the value allowed by the
dynamic DC current limiting of the switches and
heating will resume, reactivating the thermal shutdown
mechanism. This cycle of entering and exiting the
thermal shutdown mode will continue as long as the
fault condition persists. If the magnitude of the fault
condition is great enough, the external secondary
protector will activate, shunting the fault current to
ground.
2.11 External Protection Elements
The CPC75282 requires only over-voltage secondary
protection on the loop side of the device. The
integrated protection feature described above negates
the need for additional external protection on the SLIC
side. The secondary protector must limit voltage
transients to levels that do not exceed the breakdown
voltage or input-output isolation barrier of the
CPC75282. A foldback or crowbar type protector is
recommended to minimize stresses on the
CPC75282.
Consult IXYS Integrated Circuits Division’s application
note, AN-100, “Designing Surge and Power Fault
Protection Circuits for Solid State Subscriber Line
Interfaces,” for equations related to the specifications
of external secondary protectors, fused resistors, and
PTCs.
PRELIMINARY
I
NTEGRATED
C
IRCUITS
D
IVISION
CPC75282
R00E PRELIMINARY 17
3. Typical Performance Characteristics
3.1 Figure 1: Protection Circuit
3.2 Figure 2: Switches 1-3
3.3 Figure 3: Switch 4
3.4 Figure 4: Switches 5-6
DC Current Limit
(of Break Switches)
DC Current Limit
(Break Switches)
3V
V
BAT
<1μA
V
BAT
-3
I
SW
V
SW
V
MAX
I
LIM1
-I
LIM1
2/3 R
ON
-I
LIM2
I
LIM2
-V
MAX
-V
2
-V
1
-1.5
V
2
V
1
1.5
R
ON
-V
OS
+V
OS
-V
+V
+I
-I
R
ON
+I
-I
+V
-V
I
LIMIT
I
LIMIT
R
ON
R
ON
-1.5V
1.5V
2/3 R
ON
2/3 R
ON
PRELIMINARY
I
NTEGRATED
C
IRCUITS
D
IVISION
CPC75282
18 PRELIMINARY R00E
4. Manufacturing Information
4.1 Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the
latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee
proper operation of our devices when handled according to the limitations and information in that standard as well as
to any limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to
the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
4.2 ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard
JESD-625.
4.3 Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of
J-STD-020 must be observed.
4.4 Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable, and the use of a short drying bake may be necessary. Chlorine-based or
Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be
used.
Device Moisture Sensitivity Level (MSL) Rating
CPC75282KA MSL 1
Device Maximum Temperature x Time
CPC75282KA 260°C for 30 seconds
e
3
Pb

CPC75282KATR

Mfr. #:
Manufacturer:
IXYS Integrated Circuits
Description:
Switch ICs - Various 6-pole SOIC LCAS
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

Products related to this Datasheet