LTC3868-1
22
38681fd
APPLICATIONS INFORMATION
The following list summarizes the four possible connec-
tions for EXTV
CC
:
1. EXTV
CC
Left Open (or Grounded). This will cause INTV
CC
to be powered from the internal 5.1V regulator result-
ing in an effi ciency penalty of up to 10% at high input
voltages.
2. EXTV
CC
Connected Directly to V
OUT
. This is the normal
connection for a 5V to 14V regulator and provides the
highest effi ciency.
3. EXTV
CC
Connected to an External Supply. If an external
supply is available in the 5V to 14V range, it may be
used to power EXTV
CC
. Ensure that EXTV
CC
< V
IN
.
4. EXTV
CC
Connected to an Output-Derived Boost Network.
For 3.3V and other low voltage regulators, effi ciency
gains can still be realized by connecting EXTV
CC
to an
output-derived voltage that has been boosted to greater
than 4.7V. This can be done with the capacitive charge
pump shown in Figure 8. Ensure that EXTV
CC
< V
IN
.
and the BOOST pin follows. With the topside MOSFET
on, the boost voltage is above the input supply: V
BOOST
=
V
IN
+ V
INTVCC
. The value of the boost capacitor, C
B
, needs
to be 100 times that of the total input capacitance of the
topside MOSFET(s). The reverse breakdown of the external
Schottky diode must be greater than V
IN(MAX)
.
When adjusting the gate drive level, the fi nal arbiter is the
total input current for the regulator. If a change is made
and the input current decreases, then the effi ciency has
improved. If there is no change in input current, then there
is no change in effi ciency.
Fault Conditions: Current Limit and Current Foldback
When the output current hits the current limit, the output
voltage begins to drop. If the output voltage falls below
70% of its nominal output level, then the maximum sense
voltage is progressively lowered to about one-half of its
maximum selected value. Under short-circuit conditions
with very low duty cycles, the LTC3868-1 will begin cycle
skipping in order to limit the short-circuit current. In this
situation the bottom MOSFET will be dissipating most of
the power but less than in normal operation. The short-
circuit ripple current is determined by the minimum on-
time, t
ON(MIN)
, of the LTC3868-1 (≈90ns), the input voltage
and inductor value:
ΔI
L(SC)
= t
ON(MIN)
V
IN
L
The resulting average short-circuit current is:
I
SC
=
50% I
LIM(MAX)
R
SENSE
1
2
ΔI
L(SC)
Fault Conditions: Overvoltage Protection (Crowbar)
The overvoltage crowbar is designed to blow a system
input fuse when the output voltage of the regulator rises
much higher than nominal levels. The crowbar causes huge
currents to fl ow, that blow the fuse to protect against a
shorted top MOSFET if the short occurs while the control-
ler is operating.
A comparator monitors the output for overvoltage condi-
tions. The comparator detects faults greater than 10%
Figure 8. Capacitive Charge Pump for EXTV
CC
EXTV
CC
V
IN
TG1
SW
BG1
PGND
1/2 LTC3868-1
R
SENSE
V
OUT
VN2222LL
C
OUT
38681 F08
MBOT
MTOP
C
IN
L
D
BAT85 BAT85
BAT85
Topside MOSFET Driver Supply (C
B
, D
B
)
External bootstrap capacitors, C
B
, connected to the BOOST
pins supply the gate drive voltages for the topside MOSFETs.
Capacitor C
B
in the Functional Diagram is charged though
external diode D
B
from INTV
CC
when the SW pin is low.
When one of the topside MOSFETs is to be turned on, the
driver places the C
B
voltage across the gate-source of the
desired MOSFET. This enhances the top MOSFET switch
and turns it on. The switch node voltage, SW, rises to V
IN
LTC3868-1
23
38681fd
APPLICATIONS INFORMATION
Figure 9. Relationship Between Oscillator Frequency
and Resistor Value at the FREQ Pin
above the nominal output voltage. When this condition
is sensed, the top MOSFET is turned off and the bottom
MOSFET is turned on until the overvoltage condition is
cleared. The bottom MOSFET remains on continuously
for as long as the overvoltage condition persists; if V
OUT
returns to a safe level, normal operation automatically
resumes.
A shorted top MOSFET will result in a high current condition
which will open the system fuse. The switching regulator
will regulate properly with a leaky top MOSFET by altering
the duty cycle to accommodate the leakage.
Phase-Locked Loop and Frequency Synchronization
The LTC3868-1 has an internal phase-locked loop (PLL)
comprised of a phase frequency detector, a lowpass fi lter,
and a voltage-controlled oscillator (VCO). This allows the
turn-on of the top MOSFET of controller 1 to be locked to
the rising edge of an external clock signal applied to the
PLLIN/MODE pin. The turn-on of controller 2’s top MOSFET
is thus 180 degrees out of phase with the external clock.
The phase detector is an edge sensitive digital type that
provides zero degrees phase shift between the external
and internal oscillators. This type of phase detector does
not exhibit false lock to harmonics of the external clock.
If the external clock frequency is greater than the internal
oscillators frequency, f
OSC
, then current is sourced continu-
ously from the phase detector output, pulling up the VCO
input. When the external clock frequency is less than f
OSC
,
current is sunk continuously, pulling down the VCO input.
If the external and internal frequencies are the same but
exhibit a phase difference, the current sources turn on for
an amount of time corresponding to the phase difference.
The voltage at the VCO input is adjusted until the phase
and frequency of the internal and external oscillators are
identical. At the stable operating point, the phase detector
output is high impedance and the internal fi lter capacitor,
C
LP
, holds the voltage at the VCO input.
Typically, the external clock (on the PLLIN/MODE pin)
input high threshold is 1.6V, while the input low threshold
is 1.1V.
Rapid phase locking can be achieved by using the FREQ
pin to set a free-running frequency near the desired
synchronization frequency. The VCO’s input voltage is
prebiased at a frequency corresponding to the frequency
set by the FREQ pin. Once prebiased, the PLL only needs
to adjust the frequency slightly to achieve phase lock
and synchronization. Although it is not required that the
free-running frequency be near external clock frequency,
doing so will prevent the operating frequency from passing
through a large range of frequencies as the PLL locks.
Note that the LTC3868-1 can only be synchronized to an
external clock whose frequency is within range of the
LTC3868-1’s internal VCO, which is nominally 55kHz
to 1MHz. This is guaranteed to be between 75kHz and
850kHz.
Table 2 summarizes the different states in which the FREQ
pin can be used.
Table 2
FREQ PIN PLLIN/MODE PIN FREQUENCY
0V DC Voltage 350kHz
INTV
CC
DC Voltage 535kHz
Resistor DC Voltage 50kHz–900kHz
Any of the Above External Clock PhaseLocked to
External Clock
FREQ PIN RESISTOR (k)
15
FREQUENCY (kHz)
600
800
1000
35 45 5525
38681 F09
400
200
500
700
900
300
100
0
65 75 85 95 105 115
125
LTC3868-1
24
38681fd
APPLICATIONS INFORMATION
Minimum On-Time Considerations
Minimum on-time, t
ON(MIN)
, is the smallest time dura-
tion that the LTC3868-1 is capable of turning on the top
MOSFET. It is determined by internal timing delays and the
gate charge required to turn on the top MOSFET. Low duty
cycle applications may approach this minimum on-time
limit and care should be taken to ensure that:
t
ON(MIN)
<
V
OUT
V
IN
f
()
If the duty cycle falls below what can be accommodated
by the minimum on-time, the controller will begin to skip
cycles. The output voltage will continue to be regulated,
but the ripple voltage and current will increase.
The minimum on-time for the LTC3868-1 is approximately
95ns. However, as the peak sense voltage decreases the
minimum on-time gradually increases up to about 130ns.
This is of particular concern in forced continuous applica-
tions with low ripple current at light loads. If the duty cycle
drops below the minimum on-time limit in this situation,
a signifi cant amount of cycle skipping can occur with cor-
respondingly larger current and voltage ripple.
Effi ciency Considerations
The percent effi ciency of a switching regulator is equal to
the output power divided by the input power times 100%.
It is often useful to analyze individual losses to determine
what is limiting the effi ciency and which change would
produce the most improvement. Percent effi ciency can
be expressed as:
%Effi ciency = 100% – (L1 + L2 + L3 + ...)
where L1, L2, etc. are the individual losses as a percent-
age of input power.
Although all dissipative elements in the circuit produce
losses, four main sources usually account for most of
the losses in LTC3868-1 circuits: 1) IC V
IN
current, 2)
INTV
CC
regulator current, 3) I
2
R losses, 4) topside MOSFET
transition losses.
1. The V
IN
current is the DC input supply current given
in the Electrical Characteristics table, which excludes
MOSFET driver and control currents. V
IN
current typi-
cally results in a small (<0.1%) loss.
2. INTV
CC
current is the sum of the MOSFET driver and
control currents. The MOSFET driver current results
from switching the gate capacitance of the power
MOSFETs. Each time a MOSFET gate is switched from
low to high to low again, a packet of charge, dQ, moves
from INTV
CC
to ground. The resulting dQ/dt is a current
out of INTV
CC
that is typically much larger than the
control circuit current. In continuous mode, I
GATECHG
= f(Q
T
+ Q
B
), where Q
T
and Q
B
are the gate charges of
the topside and bottom side MOSFETs.
Supplying INTV
CC
from an output-derived power source
through EXTV
CC
will scale the V
IN
current required
for the driver and control circuits by a factor of (Duty
Cycle)/(Effi ciency). For example, in a 20V to 5V applica-
tion, 10mA of INTV
CC
current results in approximately
2.5mA of V
IN
current. This reduces the midcurrent loss
from 10% or more (if the driver was powered directly
from V
IN
) to only a few percent.
3. I
2
R losses are predicted from the DC resistances of the
fuse (if used), MOSFET, inductor, current sense resis-
tor, and input and output capacitor ESR. In continuous
mode the average output current fl ows through L and
R
SENSE
, but is chopped between the topside MOSFET
and the synchronous MOSFET. If the two MOSFETs have
approximately the same R
DS(ON)
, then the resistance
of one MOSFET can simply be summed with the resis-
tances of L, R
SENSE
and ESR to obtain I
2
R losses. For
example, if each R
DS(ON)
= 30m, R
L
= 50m, R
SENSE
= 10m and R
ESR
= 40m (sum of both input and
output capacitance losses), then the total resistance
is 130m. This results in losses ranging from 3% to
13% as the output current increases from 1A to 5A for
a 5V output, or a 4% to 20% loss for a 3.3V output.
Effi ciency varies as the inverse square of V
OUT
for the
same external components and output power level. The
combined effects of increasingly lower output voltages
and higher currents required by high performance digital
systems is not doubling but quadrupling the importance
of loss terms in the switching regulator system!

LTC3868IUFD-1#TRPBF

Mfr. #:
Manufacturer:
Analog Devices / Linear Technology
Description:
Switching Voltage Regulators 24Vin, Low IQ, Dual, 2-Phase Synchronous Step-Down Controller
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union