Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Pressure Sensor/PS(ADP4), PF(ADP1)
Amplifier circuit unit
Constant current
circuit unit
Pressure
sensor
OP
AMP
OP
AMP
OP
AMP
When the pressure is high
（196.1 kPa to 980.7 kPa）
When the pressure is low
（4.9k Pa to 98.1 kPa）
PC board
PC board
O-ring
Pressure
inlet pipe
Tube
If a tube is used as the pressure inlet pipe,
it may become disengaged. Use a sturdy
tube and secure it using O-rings.
Preheating
With in 60 sec.
With in
10 sec.
230 °C
150 °C
446 °F
302 °F
Main heating
Temperature
Time
NOTES
APPLICATION CIRCUIT DIAGRAM (EXAMPLE)
MOUNTING METHOD
■ Mounting
Use the land of the printed-circuit board on which the sensor is
securely fixed.
■ Soldering
Avoid the external thermal influence as the product has a limited
thermal capacity due to its compact structure. Heat deformation
may damage the sensor or deteriorate its performance. Use the
non-corrosive rosin flux. Prevent the flux from entering into the
inside of the product as the sensor is exposed to the atmosphere.
1) Manual soldering
• Raise the temperature of the soldering tip between 260 and
300 °C
500 and 572 °F (30 W) and solder within 5 seconds.
• The sensor output may vary if the load is applied on the
terminal during soldering.
• Keep the soldering tip clean.
2) DIP soldering (DIP Terminal)
• Keep the temperature of the DIP solder tank below 260 °C
500 °F and solder within 5 seconds.
• To avoid heat deformation, do not perform DIP soldering
when mounting on the circuit board which has a small
thermal capacity.
3) Reflow soldering (SMD Terminal)
• The recommended reflow temperature profile conditions are
given below.
• We recommend the screen solder printing method as the
method of cream.
• Please refer to the recommended PC board specification
diagram for the PC board foot pattern.
• Self alignment may not always work as expected, therefore,
please carefully the position of the terminals and pattern.
• The temperature of the profile is assumed to be a value
measured with the printed wiring board of the terminal
neighborhood.
• Please evaluate solderbility under the actual mounting
conditions since welding and deformation of the pressure
inlet port may occur due to heat stress depending on
equipments or conditions.
4) Rework soldering
• Complete rework at a time.
• Use a flattened soldering tip when performing rework on the
solder bridge. Do not add the flux.
• Keep the soldering tip below the temperature described in
the specifications.
5) Avoid drop and rough handling as excessive force may deform
the terminal and damage soldering characteristics.
6) Keep the circuit board warpage within 0.05 mm of the full width
of the sensor.
7) After soldering, do not apply stress on the soldered part when
cutting or bending the circuit board.
8) Prevent human hands or metal pieces from contacting with the
sensor terminal.
Such contact may cause anomalous outlets as the terminal is
exposed to the atmosphere.
9) After soldering, prevent chemical agents from adhering to the
sensor when applying coating to avoid insulation deterioration of
the circuit board.
10
) Please consult us concerning leadfree soldering.
■ Cleaning
• Prevent cleaning liquid from enteringthe inside of the product as
the sensor isexposed to the atmosphere.
• Do not perform ultrasonic cleaning in order to prevent
damages to the product.
■ Environment
1) Avoid use and storage in the corrosive gas (organic solvent,
sulfurous acid and hydrogen sulfide gases) which negatively
affects the product.
2) Avoid use in a place where these products come in contact
with water as the sensor does not have a splash-proof
construction.
3) Avoid use in an environment where these products cause dew
condensation.
When water attached to the sensor chip freezes, the sensor
output may be fluctuated or damaged.
4) Due to the structure of the pressure sensor chip, the output
varies under light.
Do not expose the sensor chip to light when applying a voltage
by using a transparent tube.
5) Do not apply high-frequency oscillation, such as ultrasonic
waves, to the product.
■ Quality check under actual use conditions
These specifications are for individual components.
Before use, carefully check the performance and quality
under actual use conditions to enhance stability.
■ Other precautions
1) The wrong mounting method and the pressure range may invite
the risk of accidents.
2) Only applicable pressure medium is dry air. Avoid use in the
corrosive gas (organic solvent, sulfurous acid and hydrogen
sulfide gases) or other mediums containing moisture or foreign
substances. Such mediums may damage or break the product.
3) The pressure sensor chip is located inside the pressure
introduction port. Do not insert foreign substances, such as
wires, into the port as those substances may damage the chip
and close the port. Do not block the atmosphere introduction
port.
4) Use electric power within the rated power range. Use beyond
the range may damage the product.
5) Follow below instructions as static electricity may damage the
product:
(1)
For Storage, short the circuit between terminals by using
conductive substances or wrap the whole chip with aluminum
foil. For storage and transportation, avoid plastic containers
which are easily electrified.
(2) Before use, connect electrified materials on desk and
operators to the ground in order to safely discharge static
electricity.
6) Carefully select and fix tubes, introduction pipes and products based
on the working voltage. Please contact us for any inquires.
The general method of air pressure transmission varies depending
on the low/high pressure condition.
• Usage note
(1) Select a study pressure introduction pipe to avoid pressure leak.
(2) Securely fix the pressure introduction pipe to avoid pressure leak.
(3) Do not block the pressure introduction pipe.
The pressure sensor converts a voltage by constant
current drive and if necessary, amplifies the voltage.
The circuit on the right is a typical use example.
Methods
of transmitting
air pressures
Jul. 201500
