BUK7528-55A All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 02 — 21 April 2011 3 of 13
NXP Semiconductors
BUK7528-55A
N-channel TrenchMOS standard level FET
V
GS
5 V
Fig 1. Normalized total power dissipation as a
function of mounting base temperature
Fig 2. Normalized continuous drain current as a
function of mounting base temperature
T
mb
= 25 °C; I
DM
is single pulse
I
D
= 75 A
Fig 3. Safe operating area; continuous and peak drain
currents as a function of drain-source voltage
Fig 4. Normalised drain-source non-repetitive
avalanche energy as a function of
mounting-base temperature
40
60
20
80
100
P
der
(%)
0
T
mb
(°C)
0 20015050 100
003aaf455
40
60
20
80
100
I
D
(%)
0
T
mb
(°C)
0 20015050 100
003aaf456
V
DS
(V)
110
3
10
2
10
003aaf457
10
2
10
10
3
I
D
(A)
1
D.C.
10 ms
100 ms
1 ms
100 μs
tp = 10 μs
R
DS(on)
= V
DS
/ I
D
40
60
20
80
100
W
DSS
(%)
0
T
mb
(°C)
20 18014060 100
003aaf470
BUK7528-55A All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 02 — 21 April 2011 4 of 13
NXP Semiconductors
BUK7528-55A
N-channel TrenchMOS standard level FET
5. Thermal characteristics
Table 5. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
R
th(j-mb)
thermal resistance from junction to mounting
base
--1.5K/W
R
th(j-a)
thermal resistance from junction to ambient in free air - 60 - K/W
Fig 5. Transient thermal impedance from junction to mounting base as a function of pulse duration
003aaf458
t
p
(s)
10
6
10
4
10
2
10
4
110
2
1
10
1
10
Z
th(j-mb)
(K/W)
10
2
t
p
t
p
T
P
t
T
δ =
δ = 0.5
0.2
0.1
0.05
0.02
0
BUK7528-55A All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 02 — 21 April 2011 5 of 13
NXP Semiconductors
BUK7528-55A
N-channel TrenchMOS standard level FET
6. Characteristics
Table 6. Characteristics
Symbol Parameter Conditions Min Typ Max Unit
Static characteristics
V
(BR)DSS
drain-source breakdown
voltage
I
D
= 0.25 mA; V
GS
=0V; T
j
=25°C 55--V
I
D
= 0.25 mA; V
GS
=0V; T
j
= -55 °C 50 - - V
V
GS(th)
gate-source threshold
voltage
I
D
=1mA; V
DS
=V
GS
; T
j
=-55°C --4.4V
I
D
=1mA; V
DS
=V
GS
; T
j
=25°C 234V
I
D
=1mA; V
DS
=V
GS
; T
j
= 175 °C 1 - - V
I
DSS
drain leakage current V
DS
=55V; V
GS
=0V; T
j
= 25 °C - 0.05 10 µA
V
DS
=55V; V
GS
=0V; T
j
= 175 °C - - 500 µA
I
GSS
gate leakage current V
GS
=20V; V
DS
=0V; T
j
= 25 °C - 2 100 nA
V
GS
=-20V; V
DS
=0V; T
j
= 25 °C - 2 100 nA
R
DSon
drain-source on-state
resistance
V
GS
=10V; I
D
=25A; T
j
= 175 °C - - 56 m
V
GS
=10V; I
D
=25A; T
j
= 25 °C - 23.8 28 m
Dynamic characteristics
C
iss
input capacitance V
GS
=0V; V
DS
=25V; f=1MHz;
T
j
=2C
- 874 1165 pF
C
oss
output capacitance - 218 261 pF
C
rss
reverse transfer capacitance - 137 188 pF
t
d(on)
turn-on delay time V
DS
=30V; R
L
=1.2; V
GS
=5V;
R
G(ext)
=10; T
j
=2C
- 1421ns
t
r
rise time - 68 102 ns
t
d(off)
turn-off delay time - 83 116 ns
t
f
fall time - 4360ns
L
D
internal drain inductance measured from drain lead 6 mm from
package to centre of die ; T
j
=2C
-4.5-nH
measured from contact screw on tab
to centre of die ; T
j
=2C
-3.5-nH
L
S
internal source inductance measured from source lead to source
bond pad ; T
j
=2C
-7.5-nH
Source-drain diode
V
SD
source-drain voltage I
S
=41A; V
GS
=0V; T
j
=2C - 1.1 - V
I
S
=25A; V
GS
=0V; T
j
= 25 °C - 0.85 1.2 V
t
rr
reverse recovery time I
S
=20A; dI
S
/dt = -100 A/µs;
V
GS
=-10V; V
DS
=30V; T
j
=2C
- 4550ns
Q
r
recovered charge - 88 96 nC

BUK7528-55A,127

Mfr. #:
Manufacturer:
Nexperia
Description:
IGBT Transistors MOSFET RAIL PWR-MOS
Lifecycle:
New from this manufacturer.
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