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AT29BV020-15TC

P1-P3P4-P6P7-P9P10-P12P13-P15
4
AT29BV020
0402D–FLASH–05/02
OPTIONAL CHIP ERASE MODES: The entire device may be erased by using a 6-byte soft-
ware code. Please see Software Chip Erase application note for details.
BOOT BLOCK PROGRAMMING LOCKOUT: The AT29BV020 has two designated memory
blocks that have a programming lockout feature. This feature prevents programming of data in
the designated block once the feature has been enabled. Each of these blocks consists of 8K
bytes; the programming lockout feature can be set independently for either block. While the
lockout feature does not have to be activated, it can be activated for either or both blocks.
These two 8K memory sections are referred to as
boot blocks
. Secure code which will bring up
a system can be contained in a boot block. The AT29BV020 blocks are located in the first 8K
bytes of memory and the last 8K bytes of memory. The boot block programming lockout fea-
ture can therefore support systems that boot from the lower addresses of memory or the
higher addresses. Once the programming lockout feature has been activated, the data in that
block can no longer be erased or programmed; data in other memory locations can still be
changed through the regular programming methods. To activate the lockout feature, a series
of seven program commands to specific addresses with specific data must be performed.
Please see Boot Block Lockout Feature Enable Algorithm.
If the boot block lockout feature has been activated on either block, the chip erase function will
be disabled.
BOOT BLOCK LOCKOUT DETECTION: A software method is available to determine
whether programming of either boot block section is locked out. See Software Product Identifi-
cation Entry and Exit sections. When the device is in the software product identification mode,
a read from location 00002H will show if programming the lower address boot block is locked
out while reading location 3FFF2H will do so for the upper boot block. If the data is FE, the cor-
responding block can be programmed; if the data is FF, the program lockout feature has been
activated and the corresponding block cannot be programmed. The software product identifi-
cation exit mode should be used to return to standard operation.
Absolute Maximum Ratings*
Temperature Under Bias................................ -55°Cto+125°C
*NOTICE: Stresses beyond those listed under “Absolute
Maximum Ratings” may cause permanent dam-
age to the device. This is a stress rating only and
functional operation of the device at these or any
other conditions beyond those indicated in the
operational sections of this specification is not
implied. Exposure to absolute maximum rating
conditions for extended periods may affect
device reliability.
Storage Temperature ..................................... -65°Cto+150°C
All Input Voltages (Including NC Pins)
with Respect to Ground ...................................-0.6V to +6.25V
All Output Voltages
with Respect to Ground .............................-0.6V to V
CC
+0.6V
Voltage on A9 (Including NC Pins)
with Respect to Ground ...................................-0.6V to +13.5V
5
AT29BV020
0402D–FLASH–05/02
.
Notes: 1. After power is applied and V
CC
is at the minimum specified datasheet value, the system should wait 20 ms before an opera-
tional mode is started.
Notes: 1. X can be V
IL
or V
IH
.
2. Refer to AC Programming Waveforms.
3. V
H
= 12.0V ± 0.5V.
4. Manufacturer Code is 1F. The Device Code is BA.
5. See details under Software Product Identification Entry/Exit.
DC and AC Operating Range
AT29BV020-12 AT29BV020-15 AT29BV020-25 AT29BV020-35
Operating
Temperature (Case)
Com. 0°C-70°C0°C-70°C
0°C-70°C 0°C-70°C
Ind. -40°C-85°C-40°C-85°C
-40°C-85°C -40°C-85°C
V
CC
Power Supply
(1)
2.7V to 3.6V 2.7V to 3.6V 2.7V to 3.6V 2.7V to 3.6V
2.
Not recommended for New Designs.
Operating Modes
Mode CE OE WE Ai I/O
Read V
IL
V
IL
V
IH
Ai D
OUT
Program
(2)
V
IL
V
IH
V
IL
Ai D
IN
Standby/Write Inhibit V
IH
X
(1)
XXHighZ
Program Inhibit X X V
IH
Program Inhibit X V
IL
X
Output Disable X V
IH
XHighZ
Product Identification
Hardware V
IL
V
IL
V
IH
A1 - A17 = V
IL
,A9=V
H
(3)
,A0=V
IL
Manufacturer Code
(4)
A1 - A17 = V
IL
,A9=V
H
(3)
,A0=V
IH
Device Code
(4)
Software
(5)
A0 = V
IL,
A1 - A17 = V
IL
Manufacturer Code
(4)
A0 = V
IH,
A1 - A17 = V
IL
Device Code
(4)
DC Characteristics
Symbol Parameter Condition Min Max Units
I
LI
Input Load Current V
IN
=0VtoV
CC
1µA
I
LO
Output Leakage Current V
I/O
=0VtoV
CC
1µA
I
SB1
V
CC
Standby Current CMOS CE =V
CC
-0.3VtoV
CC
Com. 40 µA
Ind. 50 µA
I
SB2
V
CC
Standby Current TTL CE =2.0VtoV
CC
1mA
I
CC
V
CC
Active Current f = 5 MHz; I
OUT
=0mA;V
CC
=3.6V 15 mA
V
IL
Input Low Voltage 0.6 V
V
IH
Input High Voltage 2.0 V
V
OL
Output Low Voltage I
OL
=1.6mA;V
CC
=3.0V 0.45 V
V
OH
Output High Voltage I
OH
=-100µA; V
CC
=3.0V 2.4 V
6
AT29BV020
0402D–FLASH–05/02
AC Read Waveforms
Notes: 1. CE may be delayed up to t
ACC
-t
CE
after the address transition without impact on t
ACC
.
2. OE
may be delayed up to t
CE
-t
OE
after the falling edge of CE without impact on t
CE
or by t
ACC
-t
OE
after an address change
without impact on t
ACC
.
3. t
DF
is specified from OE or CE whichever occurs first (CL = 5 pF).
4. This parameter is characterized and is not 100% tested.
AC Read Characteristics
Symbol Parameter
AT29BV020-12 AT29BV020-15
AT29BV020-25 AT29BV020-35
UnitsMin Max Min Max
Min Max Min Max
t
ACC
Address to Output Delay 120 150 250 350 ns
t
CE
(1)
CE to Output Delay 120 150 250 350 ns
t
OE
(2)
OE to Output Delay 0 50 0 70 0 120 0 150 ns
t
DF
(3)(4)
CE or OE toOutputFloat 0300400 60 0 75 ns
t
OH
Output Hold from OE,CEor
Address, Whichever Occurred First
000 0 ns
Note:
Not recommended for New Designs.
P1-P3P4-P6P7-P9P10-P12P13-P15

AT29BV020-15TC

Mfr. #:
Buy AT29BV020-15TC
Manufacturer:
Microchip Technology / Atmel
Description:
NOR Flash 2M(256Kx8) 2.7V- 150NS COM TEMP
Lifecycle:
New from this manufacturer.
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