LTC2461/LTC2463
16
24613fa
Figure 12. LTC2463 Input Signal Attentuation vs Frequency Figure 13. LTC2463 Input Signal Attenuation
vs Frequency (Low Frequencies)
APPLICATIONS INFORMATION
INPUT SIGNAL FREQUENCY (MHz)
0
INPUT SIGNAL ATTENUATION (dB)
–40
0
1.00 1.25 1.50
24613 F12
–60
–80
–20
–100
2.5
5.0 7.5
V
CC
= 5V
T
A
= 25°C
INPUT SIGNAL FREQUENCY (Hz)
0
INPUT SIGNAL ATTENUATIOIN (dB)
–20
–10
0
480
24613 F13
–30
–40
–25
–15
–5
–35
–45
–50
12060
240180
360 420 540
300
600
V
CC
= 5V
T
A
= 25°C
Figure 10. Measured INL vs Input Voltage (C
IN
= 0.1µF)
Figure 11. Measured INL vs Input Voltage (C
IN
= 0)
DIFFERENTIAL INPUT VOLTAGE (V)
–1.25 –0.75 –0.25
INL (LSB)
1
3
24613 F10
–1
0
2
–2
–3
0.25 0.75
1.25
C
IN
= 0.1µF
V
CC
= 5V
T
A
= 25°C
R
S
= 10k
R
S
= 1k
R
S
= 0k
DIFFERENTIAL INPUT VOLTAGE (V)
–1.25 –0.75 –0.25
INL (LSB)
1
3
24613 F11
–1
0
2
–2
–3
0.25 0.75
1.25
C
IN
= 0
V
CC
= 5V
T
A
= 25°C
R
S
= 10k
R
S
= 1k
R
S
= 0k
LTC2461/LTC2463
17
24613fa
PACKAGE DESCRIPTION
DD Package
12-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1725 Rev A)
3.00 ±0.10
(4 SIDES)
NOTE:
1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD AND TIE BARS SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
0.40 ± 0.10
BOTTOM VIEW—EXPOSED PAD
1.65 ± 0.10
0.75 ±0.05
R = 0.115
TYP
16
127
PIN 1
TOP MARK
(SEE NOTE 6)
0.200 REF
0.00 – 0.05
(DD12) DFN 0106 REV A
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
0.23 ± 0.05
0.25 ± 0.05
2.25 REF
2.38 ±0.05
1.65 ±0.05
2.10 ±0.05
0.70 ±0.05
3.50 ±0.05
PACKAGE
OUTLINE
PIN 1 NOTCH
R = 0.20 OR
0.25 × 45°
CHAMFER
2.38 ±0.10
2.25 REF
0.45 BSC
0.45 BSC
LTC2461/LTC2463
18
24613fa
PACKAGE DESCRIPTION
MS Package
12-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1668 Rev Ø)
MSOP (MS12) 1107 REV Ø
0.53 ± 0.152
(.021 ± .006)
SEATING
PLANE
0.18
(.007)
1.10
(.043)
MAX
0.22 – 0.38
(.009 – .015)
TYP
0.86
(.034)
REF
0.650
(.0256)
BSC
12 11 10 9 8 7
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
0.254
(.010)
0° – 6° TYP
DETAIL “A”
DETAIL “A”
GAUGE PLANE
5.23
(.206)
MIN
3.20 – 3.45
(.126 – .136)
0.889 ± 0.127
(.035 ± .005)
RECOMMENDED SOLDER PAD LAYOUT
0.42 ± 0.038
(.0165 ± .0015)
TYP
0.65
(.0256)
BSC
4.039 ± 0.102
(.159 ± .004)
(NOTE 3)
0.1016 ± 0.0508
(.004 ± .002)
1 2 3 4 5 6
3.00 ± 0.102
(.118 ± .004)
(NOTE 4)
0.406 ± 0.076
(.016 ± .003)
REF
4.90 ± 0.152
(.193 ± .006)

LTC2463CDD#TRPBF

Mfr. #:
Manufacturer:
Analog Devices Inc.
Description:
Analog to Digital Converters - ADC 16-Bit I2C 60Hz Differential Delta Sigma ADC with Internal Reference
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union