© Semiconductor Components Industries, LLC, 2007
December, 2007 - Rev. 0
1 Publication Order Number:
NTHS4166N/D
NTHS4166N
Power MOSFET
30 V, 8.2 A, Single N-Channel,
ChipFETt Package
Features
•Trench Technology
•Low R
DS(on)
to Minimize Conduction Losses
•Leadless ChipFET Package has 40% Smaller Footprint than TSOP-6
•Excellent Thermal Capabilities
•This is a Pb-Free Device
Applications
•Load Switching
•DC-DC Converters
•Low Side Switching
MAXIMUM RATINGS (T
J
= 25°C unless otherwise noted)
Parameter
Symbol Value Unit
Drain-to-Source Voltage V
DSS
30 V
Gate-to-Source Voltage V
GS
±20 V
Continuous Drain
Current R
q
JA
(Note 1)
Steady
State
T
A
= 25°C
I
D
6.6
A
T
A
= 85°C 4.8
Power Dissipation
R
q
JA
(Note 1)
T
A
= 25°C P
D
1.5 W
Continuous Drain
Current R
q
JA
(Note 2)
T
A
= 25°C
I
D
4.9
A
T
A
= 85°C 3.6
Power Dissipation
R
q
JA
(Note 2)
T
A
= 25°C P
D
0.8 W
Continuous Drain
Current R
q
JA
, t v 5 s
(Note 1)
Steady
State
T
A
= 25°C
I
D
8.2
A
T
A
= 85°C 5.9
Power Dissipation
R
q
JA
(Note 1)
T
A
= 25°C P
D
2.2 W
Pulsed Drain Current TA = 25°C,
t
p
= 10 ms
I
DM
32 A
Operating Junction and Storage Temperature T
J
,
T
STG
-55 to
150
°C
Source Current (Body Diode) R
q
JF
I
S
2.6 A
Single Pulse Drain-to-Source Avalanche
Energy T
J
= 25°C, V
DD
= 50 V, V
GS
= 10 V,
I
L
= 20 A
pk
, L = 0.1 mH, R
G
= 25 W
EAS 20 mJ
Lead Temperature for Soldering Purposes
(1/8” from case for 10 s)
T
L
260 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface Mounted on FR4 Board using 1 in sq. pad, 1 oz Cu.
2. Surface Mounted on FR4 Board using the minimum recommended pad size.
ChipFET
CASE 1206A
STYLE 1
MARKING DIAGRAM
AND PIN ASSIGNMENT
http://onsemi.com
466 M
G
466 = Specific Device Code
M = Month Code
G = Pb-Free Package
1
8
30 V
27 mW @ 4.5 V
22 mW @ 10 V
R
DS(on)
Max
8.2 A
I
D
MaxV
(BR)DSS
N-Channel MOSFET
D
S
G
Device Package Shipping
†
ORDERING INFORMATION
NTHS4166NT1G ChipFET
(Pb-Free)
3000/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
DDD
S
DDD
G
1
