Detailed description and application hints LNBP8L - LNBP9L - LNBP10L - LNBP11L
10/21
protection. When an overload occurs the device limits the output current for the
time T
ON
depending on the C
EXT
value (see Figure 24 and Figure 25). When T
ON
has elapsed, the output goes low for a time of T
OFF
= 12 x T
ON
. This keeps the
power dissipated by the device low in overload conditions, and avoids the need for
an oversized heat sink in this condition. For the IPPAK package, when the
overload or the short-circuit occurs, the device clamps the output current in a
range between 550 mA and 850 mA.
7. EXTM modulates the V
OUT
by means of a capacitor connected in series (see Figure 6).
The following equation is used to calculate the peak-to-peak voltage of V
OUT
:
V
OUT
(AC) = V
EXTM
(AC) x G
EXTM
where V
OUT
(AC) and V
EXTM
(AC) are, respectively, the peak-to-peak voltage of V
OUT
and
V
EXTM
. G
EXTM
is the external modulation gain.
6.1 Input voltage protection
In some cases two or more receivers share the same coaxial cable, rendering their outputs
hard-paralleled, so the same voltage is present at the outputs of the receivers. If a receiver
is not disconnected at the mains, a current will flow from the OUTPUT to the V
CC1
or V
CC2
pins, depending the EN/VSEL pin setting. To avoid this, two diodes (only one for the IPPAK
package) in series are recommended at input pins V
CC1
and V
CC2
(see Figure 3). These
diodes do not cause a change at V
OUT
, but only a voltage drop, which can be minimized by
using Schottky diodes. Diodes used in Figure 4 and Figure 5 must withstand a continuous
current of almost 1 A and a breakdown voltage of 30 V (suggested type is 1N4001 or
BYV10-30). Be aware that the minimum voltage needed at the V
CC
pins must be respected,
considering the voltage drop across the input diodes).
Figure 6. EXTM application circuit
VCC
EN/VSEL (Tristate)
OUTPUT
GND
EXTM
D1
1N4001
Vextm
23V
LNBP8/9L
C2
220nF
C1
10µF
LNB OUTPUT
C3
100nF
D2
1N5818
C4
F
LNBP8L - LNBP9L - LNBP10L - LNBP11L Detailed description and application hints
11/21
6.2 Single supply for the DFN package
If only one power supply source is available, the V
CC1
and V
CC2
pins can be powered by the
same power source without affecting the performance of other circuits, at the cost of higher
power losses in the device and higher heat sink surface. Also, in order to reduce the power
dissipation in the device, an appropriate-value resistor can be inserted in series with the
V
CC1
line (see Figure 5). This resistor must be dimensioned considering that the minimum
voltage on the V
CC1
pin must be >= 16 V (15 V if LLC is not used).
For example, with I
OUT
= 500 mA:
Where V
f
is the forward voltage of the input diode D1 (see Figure 5).
Power dissipated in this resistor is:
It is recommended to bypass the V
CC1
and V
CC2
pins using 220 nF electrolytic capacitors.
6.3 IPPAK mounting and thermal considerations
First, it should be noted that the tab is directly connected to the GND pin, so care must be
taken when the device is connected to a heat-sink. If the heat sink is at a different voltage
than the ground, an electrical insulator must be added between the tab and the heat sink at
the cost of an increase in the thermal resistance. For better thermal performance, an
isolated heat sink or connection to ground is recommended.
12 Ω
--
10x500
16)(23
-3
f
V
R
12 Ω
--
10x500
16)(23
-3
f
V
R
()
I
OUT
RP
D
3 W10*500*12*
2
32
===
-
()
I
OUT
RP
D
3 W10*500*12*
2
32
===
-
Detailed description and application hints LNBP8L - LNBP9L - LNBP10L - LNBP11L
12/21
Several clips can be used depending on the heat sink type:
Saddle clips (Figure 7) for slim heat sinks
U-clips (Figure 8) for thick heat sinks
Dedicated clips for special shaped heat sinks
Note that the thickness of the IPPAK package (2.3 +/- 0.1 mm) is similar to that of the SOT-
32 and SOT-82 (2.55 +/- 0.15 mm). The same clips can also be used for these packages.
The junction-to-ambient thermal resistance for the IPPAK can be calculated as follows:
R
TH-JA
= R
TH-JC
+ R
TH-CH
+ R
TH-HA
where: R
TH-JC
is the junction-to-case thermal resistance of the IPPAK (see Ta bl e 4 : T h er m a l
data
), R
TH-CH
is the case-to-heat sink thermal resistance and the R
TH-HA
is the heat sink-to-
air thermal resistance.
Figure 7. IPPAK mounted with a saddle clip.
Figure 8. IPPAK mounted with a U-clip.

LNBP10LPUR

Mfr. #:
Manufacturer:
STMicroelectronics
Description:
IC REG CONV RECVRS 1OUT 8DFN
Lifecycle:
New from this manufacturer.
Delivery:
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