IRFS4010TRLPBF

07/07/11
www.irf.com 1
HEXFET
®
Power MOSFET
Benefits
l Improved Gate, Avalanche and Dynamic dV/dt
Ruggedness
l Fully Characterized Capacitance and Avalanche
SOA
l Enhanced body diode dV/dt and dI/dt Capability
l Lead-Free
Applications
l High Efficiency Synchronous Rectification in SMPS
l Uninterruptible Power Supply
l High Speed Power Switching
l Hard Switched and High Frequency Circuits
S
D
G
PD - 96186A
IRFS4010PbF
IRFSL4010PbF
GDS
Gate Drain Source
D
S
G
D
2
Pak
IRFS4010PbF
S
D
G
D
TO-262
IRFSL4010PbF
V
DSS
100V
R
DS(on)
typ.
3.9m
max.
4.7m
I
D
180A
Absolute Maximum Ratings
Symbol
Parameter
Units
I
D
@ T
C
= 25°C
Continuous Drain Current, V
GS
@ 10V
I
D
@ T
C
= 100°C Continuous Drain Current, V
GS
@ 10V
A
I
DM
Pulsed Drain Current
P
D
C
= 25°C
Maximum Power Dissipation
W
Linear Derating Factor
W/°C
V
GS
Gate-to-Source Voltage
V
dv/dt
Peak Diode Recovery
V/ns
T
J
Operating Junction and
T
STG
Storage Temperature Range
Soldering Temperature, for 10 seconds
(1.6mm from case)
Avalanche Characteristics
E
AS (Thermally limited)
Single Pulse Avalanche Energy
mJ
I
AR
Avalanche Current
A
E
AR
Repetitive Avalanche Energy
mJ
Thermal Resistance
Symbol
Parameter
Typ.
Max.
Units
R
θ
JC
Junction-to-Case
–––
0.40
R
θJA
Junction-to-Ambient (PCB Mount)
––– 40
Max.
180
127
720
375
31
-55 to + 175
± 20
2.5
°C/W
°C
318
See Fig. 14, 15, 22a, 22b,
300
IRFS/SL4010PbF
2 www.irf.com
Notes:
Repetitive rating; pulse width limited by max. junction
temperature.
Limited by T
Jmax
, starting T
J
= 25°C, L = 0.057mH
R
G
= 25Ω, I
AS
= 106A, V
GS
=10V. Part not recommended for use
above this value .
I
SD
106A, di/dt 1319A/μs, V
DD
V
(BR)DSS
, T
J
175°C.
Pulse width 400μs; duty cycle 2%.
S
D
G
C
oss
eff. (TR) is a fixed capacitance that gives the same charging time
as C
oss
while V
DS
is rising from 0 to 80% V
DSS
.
C
oss
eff. (ER) is a fixed capacitance that gives the same energy as
C
oss
while V
DS
is rising from 0 to 80% V
DSS
.
When mounted on 1" square PCB (FR-4 or G-10 Material). For recom
mended footprint and soldering echniques refer to application note #AN-994.
R
θ
is measured at T
J
approximately 90°C
R
θJC
value shown is at time zero
Static @ T
J
= 25°C (unless otherwise specified)
Symbol
Parameter
Min.
Typ.
Max.
Units
V
(BR)DSS
Drain-to-Source Breakdown Voltage
100
–––
–––
V
Δ
V
(BR)DSS
/
Δ
T
J
Breakdown Voltage Temp. Coefficient
–––
0.10
–––
V/°C
R
DS(on)
Static Drain-to-Source On-Resistance
–––
3.9
4.7
m
Ω
V
GS(th)
Gate Threshold Voltage
2.0
–––
4.0
V
I
DSS
Drain-to-Source Leakage Current
–––
–––
20
–––
–––
250
I
GSS
Gate-to-Source Forward Leakage
–––
–––
100
Gate-to-Source Reverse Leakage
–––
–––
-100
R
G(int)
Internal Gate Resistance ––– 2.0 –––
Ω
Dynamic @ T
J
= 25°C (unless otherwise specified)
Symbol
Parameter
Min.
Typ.
Max.
Units
gfs
Forward Transconductance
189
–––
–––
S
Q
g
Total Gate Charge
–––
143
215
Q
gs
Gate-to-Source Charge
–––
38
–––
Q
gd
Gate-to-Drain ("Miller") Charge
–––
50
–––
Q
sync
Total Gate Charge Sync. (Q
g
- Q
gd
)
–––
93
–––
t
d(on)
Turn-On Delay Time
–––
21
–––
t
r
Rise Time
–––
86
–––
t
d(off)
Turn-Off Delay Time
–––
100
–––
t
f
Fall Time
–––
77
–––
C
iss
Input Capacitance
–––
9575
–––
C
oss
Output Capacitance
–––
660
–––
C
rss
Reverse Transfer Capacitance
–––
270
–––
C
oss
eff. (ER)
Effective Output Capacitance (Energy Related)
–––
757
–––
C
oss
eff. (TR)
Effective Output Capacitance (Time Related)
–––
1112
–––
Diode Characteristics
Symbol
Parameter
Min.
Typ.
Max.
Units
I
S
Continuous Source Current
(Body Diode)
I
SM
Pulsed Source Current
(Body Diode)
V
SD
Diode Forward Voltage
–––
–––
1.3
V
t
rr
Reverse Recovery Time
–––
72
–––
T
J
= 25°C
V
R
= 85V,
–––
81
–––
T
J
= 125°C
I
F
= 106A
Q
rr
Reverse Recovery Charge
–––
210
–––
T
J
= 25°C
di/dt = 100A/μs
–––
268
–––
T
J
= 125°C
I
RRM
Reverse Recovery Current
–––
5.3
–––
A
T
J
= 25°C
t
on
Forward Turn-On Time
Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)
Conditions
V
DS
= 25V, I
D
= 106A
I
D
= 106A
V
GS
= 20V
V
GS
= -20V
MOSFET symbol
showing the
V
DS
= 50V
Conditions
V
GS
= 10V
V
GS
= 0V
V
DS
= 50V
ƒ = 1.0MHz See Fig.5
V
GS
= 0V, V
DS
= 0V to 80V See Fig.11
V
GS
= 0V, V
DS
= 0V to 80V
T
J
= 25°C, I
S
= 106A, V
GS
= 0V
integral reverse
p-n junction diode.
Conditions
V
GS
= 0V, I
D
= 250μA
Reference to 25°C, I
D
= 5mA
V
GS
= 10V, I
D
= 106A
V
DS
= V
GS
, I
D
= 250μA
V
DS
= 100V, V
GS
= 0V
V
DS
= 100V, V
GS
= 0V, T
J
= 125°C
I
D
= 106A
R
G
= 2.7
Ω
V
GS
= 10V
V
DD
= 65V
I
D
= 106A, V
DS
=0V, V
GS
= 10V
pF
A
––– –––
––– –––
μA
nA
nC
ns
ns
nC
180
720
IRFS/SL4010PbF
www.irf.com 3
Fig 1. Typical Output Characteristics
Fig 3. Typical Transfer Characteristics
Fig 4. Normalized On-Resistance vs. Temperature
Fig 2. Typical Output Characteristics
Fig 6. Typical Gate Charge vs. Gate-to-Source VoltageFig 5. Typical Capacitance vs. Drain-to-Source Voltage
0.1 1 10 100
V
DS
, Drain-to-Source Voltage (V)
0.1
1
10
100
1000
I
D
,
D
r
a
i
n
-
t
o
-
S
o
u
r
c
e
C
u
r
r
e
n
t
(
A
)
VGS
TOP 15V
10V
8.0V
7.0V
5.0V
4.5V
4.3V
BOTTOM 4.0V
60μs PULSE WIDTH
Tj = 25°C
4.0V
0.1 1 10 100
V
DS
, Drain-to-Source Voltage (V)
10
100
1000
I
D
,
D
r
a
i
n
-
t
o
-
S
o
u
r
c
e
C
u
r
r
e
n
t
(
A
)
4.0V
60μs PULSE WIDTH
Tj = 175°C
VGS
TOP 15V
10V
8.0V
7.0V
5.0V
4.5V
4.3V
BOTTOM 4.0V
2 3 4 5 6 7
V
GS
, Gate-to-Source Voltage (V)
0.1
1
10
100
1000
I
D
,
D
r
a
i
n
-
t
o
-
S
o
u
r
c
e
C
u
r
r
e
n
t
(
A
)
T
J
= 25°C
T
J
= 175°C
V
DS
= 50V
60μs PULSE WIDTH
-60 -40 -20 0 20 40 60 80 100120140160180
T
J
, Junction Temperature (°C)
0.5
1.0
1.5
2.0
2.5
R
D
S
(
o
n
)
,
D
r
a
i
n
-
t
o
-
S
o
u
r
c
e
O
n
R
e
s
i
s
t
a
n
c
e
(
N
o
r
m
a
l
i
z
e
d
)
I
D
= 106A
V
GS
= 10V
1 10 100 1000
V
DS
, Drain-to-Source Voltage (V)
100
1000
10000
100000
C
,
C
a
p
a
c
i
t
a
n
c
e
(
p
F
)
V
GS
= 0V, f = 1 MHZ
C
iss
= C
gs
+ C
gd
, C
ds
SHORTED
C
rss
= C
gd
C
oss
= C
ds
+ C
gd
C
oss
C
rss
C
iss
0 25 50 75 100 125 150 175 200 225
Q
G
,
Total Gate Charge (nC)
0.0
2.0
4.0
6.0
8.0
10.0
12.0
14.0
V
G
S
,
G
a
t
e
-
t
o
-
S
o
u
r
c
e
V
o
l
t
a
g
e
(
V
)
V
DS
= 80V
V
DS
= 50V
I
D
= 106A

IRFS4010TRLPBF

Mfr. #:
Manufacturer:
Infineon / IR
Description:
MOSFET MOSFT 100V 180A 4.7mOhm 143nC Qg
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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