D
2
PAK−3 (TO−263, 3−LEAD)
CASE 418AJ
ISSUE B
DATE 08 OCT 2013
SCALE 1:1
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
D 0.330 0.380 8.38 9.65
E 0.380 0.420 9.65 10.67
A 0.160 0.190 4.06 4.83
b 0.020 0.039 0.51 0.99
c2 0.045 0.065 1.14 1.65
e 0.100 BSC 2.54 BSC
A1 0.000 0.010 0.00 0.25
c 0.012 0.029 0.30 0.74
L 0.070 0.110 1.78 2.79
H 0.575 0.625 14.60 15.88
L2 −−−− 0.070 −−−− 1.78
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCHES.
3. CHAMFER OPTIONAL
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH. MOLD FLASH SHALL NOT EXCEED 0.005
PER SIDE. THESE DIMENSIONS ARE MEASURED
AT THE OUTERMOST EXTREMES OF THE
PLASTIC BODY AT DATUM H.
5. THERMAL PAD CONTOUR IS OPTIONAL WITHIN
DIMENSIONS E, L1, D1 AND E1.
6. OPTIONAL MOLD FEATURE
E1 0.245 −−−− 6.22 −−−−
L1 −−−− 0.066 −−−− 1.68
D1 0.260 −−−− 6.60 −−−−
L3 0.010 BSC 0.25 BSC
M 08 08°° °°
E
D
H
L1
b
e
A1
B
H
L
M
DETAIL C
SEATING
PLANE
A
2X
M
A
M
0.10 B
c2
c
A
B
SEATING
PLANE
DETAIL C
VIEW A−A
SIDE VIEW
TOP VIEW
E2
L2
A
A
VIEW A−A
E1
D1
L1
OPTIONAL CONSTRUCTIONS
L3
GAUGE
PLANE
NOTE 3
M
A
M
0.10 B
XX
XXXXXXXXX
AWLYWWG
GENERIC MARKING DIAGRAMS*
XXXXXX = Specific Device Code
A = Assembly Location
WL = Wafer Lot
Y = Year
WW = Work Week
W = Week Code (SSG)
M = Month Code (SSG)
G = Pb−Free Package
AKA = Polarity Indicator
IC Standard
XXXXXXXXG
AYWW
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
Rectifier
AYWW
XXXXXXXXG
AKA
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
RECOMMENDED
0.366
0.100
DIMENSIONS: INCHES
PITCH
2X
0.653
0.063
2X
0.436
0.169
SOLDERING FOOTPRINT*
NOTE 6
SSG
XXXXXX
XXYMW
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
http://onsemi.com
1
© Semiconductor Components Industries, LLC, 2002
October, 2002 − Rev. 0
Case Outline Number:
XXX
DOCUMENT NUMBER:
STATUS:
NEW STANDARD:
DESCRIPTION:
98AON56370E
ON SEMICONDUCTOR STANDARD
D
2
PAK−3 (TO−263, 3−LEAD)
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
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