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May 25, 2004 V.1
Chip Resistor Surface Mount
8
9
SERIES
RT
(Pb Free)
TYPE TEST METHOD ACCEPTANCE STANDARD
Moisture
Resistance
Place the specimen in the test chamber and subject to 42 damp heat cycles. Each
one of which consists of the steps 1 to 7 as figure 13. The total length of test is
1,000 hours. Have the specimen stabilized at room temperature for 24 hours after
testing.
Measure the resistance to determine R/R(%).Δ
±(0.5%+0.05Ω)
No visible damage
High stability, ±0.1% or ±0.25%
on Request
Life
Place the specimen in the oven at 70±2°C. Apply the rated voltage to the specimen at
the 1.5 hours on and 0.5 hour off cycle. The total length of test is 1,000 hours. Have
the specimen stabilized at room temperature for one hour minimum after testing.
Measure the R/R(%).Δ
±(0.5%+0.05Ω)
High stability, ±0.1% or ±0.25%
on Request
Solderabilit
Immerse the specimen in the solder pot at 245±5°C for 5 sec.
At least 95% solder coverage on
the termination
Bending
Strength
Mount the specimen on a test board as
shown in the figure 12. Slowly apply the force
till the board is bent for 5±1 sec.
Measure the R/R(%) at this position.Δ
±(0.25%+0.05Ω)
No visible damage
High stability, ±0.1% on Request
75
initial drying
24 hours
90 − 98% RH
80 − 98%
RH
temperature
tolerance
±2 °C (±3.6 °F)
unless otherwise
specified
initial measurements
as specified in 2.2
0
STEP1 STEP3STEP2
prior to first
cycle only
STEP4
one cycle 24 hours; repeat as specified in 2.5
voltage applied as specified in 2.4
circulation of conditioning air shall be at a
minimum cubic rate per minute equivalent to
10 times the volume of the chamber
STEP6 STEP7
HBK073
STEP5
51015
end of final cycle;
measurements
as specified in 2.7
optional sub-cycle if specified
(2.3); sub-cycle performed during
any 5 of the first 9 cycles; humidity
uncontrolled during sub-cycle
20
time [h]
temperature
[°C]
25
50
25
0
90 − 98% RH 90 − 98% RH
+10 °C (+18 °F)
−2 °C (−3.6 °F)
80 − 98%
RH
rate of change of temperature is unspecified,
however, specimens shall not be subjected to
radiant heating from chamber conditioning processes
Fig. 13 Conditions by change of temperature
Fig. 12 Principle of the bending
test
