NCV6324BMTAAWTBG Datasheet NCV6324BMTAATBG, NCV6324CMTAATBG, NCV6324BMTAAWTBG | P1-P3

November, 2016 − Rev. 4

1 Publication Order Number:

NCP6324/D

NCP6324, NCV6324

3 MHz, 2 A Synchronous

Buck Converter

High Efficiency, Low Ripple, Adjustable

Output Voltage

The NCP/NCV6324, a family of synchronous buck converters,

which is optimized to supply different sub systems of portable

applications powered by one cell Li−ion or three cell Alkaline/NiCd/

NiMH batteries. The devices are able to deliver up to 2 A on an

external adjustable voltage. Operation with 3 MHz switching

frequency allows employing small size inductor and capacitors. Input

supply voltage feedforward control is employed to deal with wide

input voltage range. Synchronous rectification and automatic

PWM/PFM power save mode offer improved system efficiency. The

NCP/NCV6324 is in a space saving, low profile 2.0 x 2.0 x 0.75 mm

WDFN−8 package or a WDFNW8 wettable flank package.

Features

• 2.5 V to 5.5 V Input Voltage Range

• External Adjustable Voltage

• Up to 2 A Output Current

• 3 MHz Switching Frequency

• Synchronous Rectification

• Automatic Power Save (NCx6324B) or External Mode Selection

(NCx6324C)

• Enable Input

• Power Good Output Option (NCx6324B)

• Soft Start

• Over Current Protection

• Active Discharge When Disabled

• Thermal Shutdown Protection

• WDFN−8, 2 x 2 mm, 0.5 mm Pitch Package and

WDFNW8, 2 x 2 mm, 0.5 mm Pitch Package with Wettable Flanks

• Maximum 0.8mm Height for Super Thin Applications

• NCV Prefix for Automotive and Other Applications Requiring

Unique Site and Control Change Requirements; AEC−Q100

Qualified and PPAP Capable

• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS

Compliant

Typical Applications

• Cellular Phones, Smart Phones, and PDAs

• Portable Media Players

• Digital Still Cameras

• Wireless and DSL Modems

• USB Powered Devices

• Point of Load

• Game and Entertainment System

This document contains information on some products that are still under development.

ON Semiconductor reserves the right to change or discontinue these products without

notice.

WDFN8

CASE 511BE

MARKING

DIAGRAM

www.onsemi.com

XX = Specific Device Code

M = Date Code

G = Pb−Free Package

XX MG

(Note: Microdot may be in either location)

PINOUT

4FB

3AGND

5EN

AVIN

MODE/P

1PGND

8 PVIN

(Top View)

See detailed ordering, marking and shipping information on

page 2 of this data sheet.

ORDERING INFORMATION

WDFNW8

CASE 511CL

NCP6324, NCV6324

www.onsemi.com

1uH

Vo = 0.6V to Vin

Cout

10uF

PGND

PVIN

AGND

AVIN

Cin

10uF

Rpg

Vin = 2.5V to 5.5V

Power Good

Enable

Cfb

NCx6324B

1uH

Vo = 0.6V to Vin

Cout

10uF

PGND

PVIN

AGND

AVIN

MODE

Cin

10uF

Vin = 2.5V to 5.5V

Mode

Enable

Cfb

NCx6324C

(a) Power Good Output Option

(NCx6324B)

(b) External Mode Selection

(NCx6324C)

Figure 1. Typical Application Circuits

PIN DESCRIPTION

Pin Name Type Description

1 PGND Power

Ground

Power Ground for power, analog blocks. Must be connected to the system ground.

2 SW Power

Output

Switch Power pin connects power transistors to one end of the inductor.

3 AGND Analog

Ground

Analog Ground analog and digital blocks. Must be connected to the system ground.

4 FB Analog

Input

Feedback Voltage from the buck converter output. This is the input to the error amplifier. This pin

is connected to the resistor divider network between the output and AGND.

5 EN Digital

Input

Enable of the IC. High level at this pin enables the device. Low level at this pin disables the de-

vice.

6 PG/MODE Digital

Output

PG pin is for NCx6324B with Power Good option. It is open drain output. Low level at this pin indi-

cates the device is not in power good, while high impedance at this pin indicates the device is in

power good.

MODE pin is for NCx6324C with mode external selection option. High level at this pin forces the

device to operate in forced PWM mode. Low level at this pin enables the device to operate in

automatic PFM/PWM mode for power saving function.

7 AVIN Analog

Input

Analog Supply. This pin is the analog and the digital supply of the device. An optional 1 mF or lar-

ger ceramic capacitor bypasses this input to the ground. This capacitor should be placed as close

as possible to this input.

8 PVIN Power

Input

Power Supply Input. This pin is the power supply of the device. A 10 mF or larger ceramic capacit-

or must bypass this input to the ground. This capacitor should be placed as close a possible to

this input.

9 PAD Exposed

Pad

Exposed Pad. Must be soldered to system ground to achieve power dissipation performances.

This pin is internally unconnected

ORDERING INFORMATION

Device Marking Package Shipping

†

NCP6324BMTAATBG 4A

WDFN8

(Pb−Free)

3000 / Tape & Reel

NCV6324BMTAATBG* CE

NCP6324CMTAATBG C4

NCV6324CMTAATBG* HA

NCV6324BMTAAWTBG*

(In development)

AX WDFNW8 with Wettable Flanks

(Pb−Free)

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging

Specifications Brochure, BRD8011/D.

*NCV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP

Capable.

NCP6324, NCV6324

www.onsemi.com

PWM / PFM

Control

Reference

Voltage

Cout

1uH

10uF

Logic Control

Current Limit

Thermal

Shutdown

Cin

10uF

Rpg

UVLO

Vin

Power Good

Enable

PVIN

PGND

MODE/PG

AVIN

AGND

Cfb

MODE

Error

Amp

Figure 2. Functional Block Diagram

MAXIMUM RATINGS

Rating Symbol

Value

Unit

Min Max

Input Supply Voltage to GND V

PVIN

, V

AVIN

−0.3 7.0 V

Switch Node to GND V

−0.3 7.0 V

EN, PG/MODE to GND V

, V

−0.3 7.0 V

FB to GND V

−0.3 7.0 V

Human Body Model (HBM) ESD Rating are (Note 1) ESD HBM 2000 V

Machine Model (MM) ESD Rating (Note 1) ESD MM 200 V

Latchup Current (Note 2) I

−100 100 mA

Operating Junction Temperature Range (Note 3) T

−40 125 °C

Operating Ambient Temperature Range NCP6324

NCV6324

−40

125

°C

Storage Temperature Range T

STG

−55 150 °C

Thermal Resistance Junction−to−Top Case (Note 4)

12 °C/W

Thermal Resistance Junction−to−Board (Note 4)

30 °C/W

Thermal Resistance Junction−to−Ambient (Note 4)

62 °C/W

Power Dissipation (Note 5) P

1.6 W

Moisture Sensitivity Level (Note 6) MSL 1 −

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality

should not be assumed, damage may occur and reliability may be affected.

1. This device series contains ESD protection and passes the following tests:

Human Body Model (HBM) ±2.0 kV per JEDEC standard: JESD22−A114.

Machine Model (MM) ±200 V per JEDEC standard: JESD22−A115.

2. Latchup Current per JEDEC standard: JESD78 Class II.

3. The thermal shutdown set to 150°C (typical) avoids potential irreversible damage on the device due to power dissipation.

4. The thermal resistance values are dependent of the PCB heat dissipation. The board used to drive this data was an 80x50 mm NCP6324EVB

board. It is a multilayer board with 1 ounce internal power and ground planes and 2−1 ounce copper traces on top and bottom of the board.

If the copper traces of top and bottom are 1 ounce too, R

= 11°C/W, R

= 30°C/W, and R

= 72°C/W.

5. The maximum power dissipation (PD) is dependent on input voltage, maximum output current and external components selected.

6. Moisture Sensitivity Level (MSL): 1 per IPC/JEDEC standard: J−STD−020A.

P1-P3 P4-P6 P7-P9 P10-P12 P13-P15

NCV6324BMTAAWTBG

Mfr. #:

Buy NCV6324BMTAAWTBG

Manufacturer:

ON Semiconductor

Description:

Switching Voltage Regulators DCDC BUCK CONVERTER WITH

Lifecycle:

New from this manufacturer.

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NCV6324BMTAAWTBG

NCV6324BMTAAWTBG

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