MT46H64M32L2CG-5 IT:A TR

PDF: 09005aef833913f1/Source: 09005aef833913d6 Micron Technology, Inc., reserves the right to change products or specifications without notice.
ddr_mobile_sdram_only_152b_omap_pop.fm - Rev. E 06/09 EN
10 ©2008 Micron Technology, Inc. All rights reserved.
152-Ball x32 Mobile LPDDR (only) PoP (TI-OMAP)
Package Dimensions
Package Dimensions
Figure 6: 152-Ball VFBGA Package, 1.0mm (Package Code: CG)
Notes: 1. All dimensions are in millimeters.
Ball A1 ID
0.6 ±0.1
Seating
plane
0.1 A
A
1.0 MAX
Ball A1 ID
0.65 TYP
13 CTR
14 ±0.1
Solder ball
material: SAC105.
Dimensions apply
to solder balls post-
reflow on Ø0.35
SMD ball pads.
152X Ø0.46
0.35 MIN
13 CTR
14 ±0.1
0.65 TYP
21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: 208-368-3900
www.micron.com/productsupport Customer Comment Line: 800-932-4992
Micron and the Micron logo are trademarks of Micron Technology, Inc.
All other trademarks are the property of their respective owners.
152-Ball x32 Mobile LPDDR (only) PoP (TI-OMAP)
Package Dimensions
PDF: 09005aef833913f1/Source: 09005aef833913d6 Micron Technology, Inc., reserves the right to change products or specifications without notice.
ddr_mobile_sdram_only_152b_omap_pop.fm - Rev. E 06/09 EN
11 ©2008 Micron Technology, Inc. All rights reserved.
Figure 7: 152-Ball VFBGA Package, 1.2mm (Package Code: KZ)
Notes: 1. All dimensions are in millimeters.
Ball A1 ID
0.78 ±0.1
Seating
plane
0.1 A
A
1.2 MAX
Ball A1 ID
0.65 TYP
0.65 TYP
13 CTR
Solder ball
material: SAC105.
Dimensions apply
to solder balls post-
reflow on Ø0.35
SMD ball pads.
152X Ø0.46
14 ±0.1
0.35 MIN
13
CTR
14 ±0.1
21 2019181716151413121110987654321
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
PDF: 09005aef833913f1/Source: 09005aef833913d6 Micron Technology, Inc., reserves the right to change products or specifications without notice.
ddr_mobile_sdram_only_152b_omap_pop.fm - Rev. E 06/09 EN
12 ©2008 Micron Technology, Inc. All rights reserved.
152-Ball x32 Mobile LPDDR (only) PoP (TI-OMAP)
Revision History
Revision History
Rev. E, Production. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6/09
Table 3, “Ball Assignments,on page 6: Deleted ball numbers.
Table 4, “Non-Device-Specific Ball Assignments,” on page 6: Deleted ball numbers.
Table 5, “Absolute Maximum Ratings,” on page 7: Added note.
Table 6, “Recommended Operating Conditions,” on page 7: Updated symbol for I/O
supply voltage.
Rev. D, Preliminary. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1/09
Added 4Gb option and updated these items to reflect the addition:
MT46HxxxMxxLxKZ” on page 1
Options” on page 1
Table 1, “Configuration Addressing,” on page 1, including note 1
Table 2, “152-Ball Production Marketing Part Numbers,” on page 3, part number
Figure 1: “Marketing Part Number Example,” on page 2
Figure 3: “152-Ball VFBGA Ball Assignments,” on page 5
Table 4, “Non-Device-Specific Ball Assignments,” on page 6
Added Figure 5: “152-Ball VFBGA Functional Block Diagram, Quad Die,” on page 9
Added Figure 7: “152-Ball VFBGA Package, 1.2mm (Package Code: KZ),” on page 11.
Removed references to reduced-page-size devices.
Figure 4: “152-Ball VFBGA Functional Block Diagram (non-Quad Die),” on page 8:
Added parenthetic comment to title.
Figure 6: “152-Ball VFBGA Package, 1.0mm (Package Code: CG),” on page 10 and
Figure 7: “152-Ball VFBGA Package, 1.2mm (Package Code: KZ),” on page 11: Added
package codes to figure titles.
Rev. C, Preliminary. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11/08
Updated template and standards.
Added Table 2, “152-Ball Production Marketing Part Numbers,” on page 3.
Rev. B, Preliminary. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5/08
Added reduced page-size options (LA and LG) to Table 1, “Configuration Addressing,
on page 1; Figure 1: “Marketing Part Number Example,” on page 2; “General Descrip-
tion” on page 4.
Rev. A, Preliminary. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4/08
•Initial release.

MT46H64M32L2CG-5 IT:A TR

Mfr. #:
Manufacturer:
Micron
Description:
IC DRAM 2G PARALLEL 152VFBGA
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union