Electrical characteristics
STF9HN65M2
4/13
DocID027606 Rev 2
2 Electrical characteristics
(T
C
= 25 °C unless otherwise specified).
Table 5: Static
Symbol Parameter Test conditions Min. Typ. Max. Unit
V
(BR)DSS
Drain-source
breakdown voltage
V
GS
= 0 V, I
D
= 1 mA 650
V
I
DSS
Zero gate voltage drain
current
V
GS
= 0 V, V
DS
= 650 V
1 µA
V
GS
= 0 V, V
DS
= 650 V,
T
C
= 125 °C
100 µA
I
GSS
Gate-body leakage
current
V
DS
= 0 V, V
GS
= ±25 V
±10 µA
V
GS(th)
Gate threshold voltage V
DS
= V
GS
, I
D
= 250 µA 2 3 4 V
R
DS(on)
Static drain-source on-
resistance
V
GS
= 10 V, I
D
= 2.5 A
0.71 0.82 Ω
Table 6: Dynamic
Symbol Parameter Test conditions Min. Typ. Max. Unit
C
iss
Input capacitance
V
DS
= 100 V, f = 1 MHz, V
GS
= 0 V
- 325 - pF
C
oss
Output capacitance - 16 - pF
C
rss
Reverse transfer
capacitance
- 0.85 - pF
C
oss eq.
(1)
Equivalent output
capacitance
V
DS
= 0 V to 520 V, V
GS
= 0 V - 109 - pF
R
G
Intrinsic gate
resistance
f = 1 MHz open drain - 5.6 - Ω
Q
g
Total gate charge
V
DD
= 520 V, I
D
= 5 A, V
GS
= 10 V
(see Figure 15: "Gate charge test
circuit")
- 11.5 - nC
Q
gs
Gate-source charge - 2.5 - nC
Q
gd
Gate-drain charge - 5 - nC
Notes:
(1)
C
oss eq.
is defined as a constant equivalent capacitance giving the same charging time as C
oss
when V
DS
increases from 0 to 80% V
DSS.
Table 7: Switching times
Symbol Parameter Test conditions Min. Typ. Max. Unit
t
d(on)
Turn-on delay time
V
DD
= 325 V, I
D
= 2.5 A R
G
= 4.7 Ω,
V
GS
= 10 V (see Figure 14:
"Switching times test circuit for
resistive load" and Figure 19:
"Switching time waveform")
- 7.5 - ns
t
r
Rise time - 4.6 - ns
t
d(off)
Turn-off-delay time - 24 - ns
t
f
Fall time - 14.5 - ns
STF9HN65M2
Electrical characteristics
DocID027606 Rev 2
5/13
Table 8: Source-drain diode
Symbol Parameter Test conditions Min. Typ. Max. Unit
I
SD
Source-drain current
-
5.5 A
I
SDM
(1)
Source-drain current
(pulsed)
-
22 A
V
SD
(2)
Forward on voltage V
GS
= 0 V, I
SD
= 5 A -
1.6 V
t
rr
Reverse recovery time
I
SD
= 5 A, di/dt = 100 A/µs,
V
DD
= 60 V (see Figure 16: " Test
circuit for inductive load switching
and diode recovery times")
- 268
ns
Q
rr
Reverse recovery
charge
- 1.7
µC
I
RRM
Reverse recovery
current
- 12.5
A
t
rr
Reverse recovery time
I
SD
= 5 A, di/dt = 100 A/µs,
V
DD
= 60 V, T
j
= 150 °C
(see Figure 16: " Test circuit for
inductive load switching and diode
recovery times")
- 408
ns
Q
rr
Reverse recovery
charge
- 2.6
µC
I
RRM
Reverse recovery
current
- 13
A
Notes:
(1)
Pulse width is limited by safe operating area.
(2)
Pulse test: pulse duration = 300 µs, duty cycle 1.5%.
Electrical characteristics
STF9HN65M2
6/13
DocID027606 Rev 2
2.1 Electrical characteristics (curves)
Figure 2: Safe operating area
Figure 3: Thermal impedance
Figure 4: Output characteristics
Figure 5: Transfer characteristics
Figure 6: Normalized gate threshold voltage
vs. temperature
Figure 7: Normalized V
(BR)DSS
vs. temperature

STF9HN65M2

Mfr. #:
Manufacturer:
STMicroelectronics
Description:
MOSFET N-channel 650 V, 0.71 Ohm typ., 5.5 A MDmesh M2 Power MOSFET in TO-220FP package
Lifecycle:
New from this manufacturer.
Delivery:
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