NXP Semiconductors
PESD5V0V2BMB
Very low capacitance bidirectional ESD protection diodes
PESD5V0V2BMB All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved
Product data sheet 17 August 2015 6 / 12
10. Application information
The device is designed for the protection of up to two bidirectional data lines from surge
pulses and ESD damage.
Fig. 11. Application diagram
006aab332
DUT
GND
signal lines
Circuit board layout and protection device placement
Circuit board layout is critical for the suppression of ESD, Electrical Fast Transient (EFT)
and surge transients. The following guidelines are recommended:
1. Place the device as close to the input terminal or connector as possible.
2. Minimize the path length between the device and the protected line.
3. Keep parallel signal paths to a minimum.
4. Avoid running protected conductors in parallel with unprotected conductors.
5. Minimize all Printed-Circuit Board (PCB) conductive loops including power and
ground loops.
6. Minimize the length of the transient return path to ground.
7. Avoid using shared transient return paths to a common ground point.
8. Use ground planes whenever possible. For multilayer PCBs, use ground vias.
11. Test information
11.1 Quality information
This product has been qualified in accordance with the Automotive Electronics Council
(AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is
suitable for use in automotive applications.
NXP Semiconductors
PESD5V0V2BMB
Very low capacitance bidirectional ESD protection diodes
PESD5V0V2BMB All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved
Product data sheet 17 August 2015 7 / 12
12. Package outline
References
Outline
version
European
projection
Issue date
IEC JEDEC JEITA
SOT883B
sot883b_po
11-11-02
12-01-03
Unit
mm
max
nom
min
0.40
0.37
0.34
0.04 0.55
0.50
0.47
0.65
0.60
0.55
1.05
1.00
0.95
0.65
0.30
0.25
0.22
A
(1)
Dimensions
Note
1. Including plating thickness
Leadless ultra small plastic package; 3 solder lands; body 1.0 x 0.6 x 0.37 mm SOT883B
A
1
b
0.20
0.15
0.12
b
1
D E e
0.35
e
1
L
0.30
0.25
0.22
L
1
scale
L (2x)
E
2
3
1
b (2x)
b
1
A
1
A
D
L
1
0 0.5 1 mm
e
1
e
Fig. 12. Package outline DFN1006B-3 (SOT883B)
NXP Semiconductors
PESD5V0V2BMB
Very low capacitance bidirectional ESD protection diodes
PESD5V0V2BMB All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved
Product data sheet 17 August 2015 8 / 12
13. Soldering
1.3
0.3
0.6
0.7
0.4
0.9
0.3
(2x)
0.4
(2x)
0.25
(2x)
R0.05 (8x)
0.7
Footprint information for reflow soldering SOT883B
sot883b_fr
occupied area
solder land
solder resist
solder land plus solder paste
solder paste deposit
Dimensions in mm
Fig. 13. Reflow soldering footprint for DFN1006B-3 (SOT883B)

PESD5V0V2BMBYL

Mfr. #:
Manufacturer:
Nexperia
Description:
TVS Diodes / ESD Suppressors Low Capacitance ESD Bidirectional Diode
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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