8
Electrical Specifications (Cont.)
Unless otherwise noted, for sinusoidal waveform input and reference resistor R
ref
= 24 kΩ, all typical values are at T
A
=
25°C, V
CC1
= 5 V, V
CC2
= 5 V; all Minimum/Maximum specifications are at Recommended Operating Conditions.
Transmitter
Parameter Symbol Min. Typ. Max. Unit Test Condition Fig. Note
Transmit Enable Threshold
Voltage
Set-up Time (Tx-PD-out)
V
th
, T
x-en
t
s
, T
x
0.8
10
2.4 V
µs V
Tx-en
= 5 V, I
Tx-in
= 250 µA
PP
, f
= 132 kHz,
Tx-PD-out no load
21 1
AGC Settling Time t
AGC
180 µs 2
Tx Photodetector Output
Voltage (Tx-PD-out)
2.8 3.3 3.6 V V
Tx-en
= 5 V, I
Tx-in
= 250 µA
PP
, f
= 132 kHz, T
A
= 25°C
7, 8, 9
2nd Harmonic Distortion
Tx-PD-out)
HD2
TxPD
-50 dB V
Tx-en
= 5 V, I
Tx-in
= 250 µA
PP
, f
= 132 kHz, Tx-PD-out load
1 kΩ
10, 22
3rd Harmonic Distortion
(Tx-PD-out)
HD3
TxPD
-62 dB
Bandwidth (Tx-PD-out) BW
TxPD
1 MHz V
Tx-en
= 5 V, I
Tx-in
= 250µA
PP
Tx Photodetector Output
Impedance (Tx-PD-out)
Z
O
,
TxPD
1
Ω
V
Tx-en
= 5 V, f = 132 kHz
Line Driver (LD)
Power Supply (V
CC2
)
Rejection Ratio
PSRR 55 dB 50 Hz ripple,
V
ripple
= 200 mV
PP
Input Impedance Z
I, LD
10 kΩ V
Tx-en
= 5 V, f = 132 kHz
DC Biased Voltage V
Bias
, LD 2.27 V V
Tx-en
= 5 V
Gain G
T2
1.8 2 2.2 V/V V
Tx-en
= 5 V, f = 132 kHz, Tx-
out no load
11
2nd Harmonic Distortion
(Tx-out)
HD2
LD
-65 -60 dB V
Tx-en
= 5 V, V
Tx-out
= 3.6 V
PP
,
f = 132 kHz, Tx-out load 50
Ω, T
A
= 25°C
12, 13,
14, 15,
16, 23
3rd Harmonic Distortion
(Tx-out)
HD3
LD
-75 -65 dB
Output Impedance (Tx-out) Z
O, LD
0.5
Ω
V
Tx-en
= 5 V, f = 132 kHz
7.5 kΩ V
Tx-en
= 0 V, f = 132 kHz
Short-Circuit Output Current I
OS
2 A
PP
V
Tx-en
= 5 V,
V
Tx-LD-in
= 1.8 V
PP
,
f = 132 kHz, t
P
≤ 50 µs
3, 4
Notes:
1. Time from transmit is enabled (V
Tx-en
is set to logic high) until output (Tx-PD-out) is available. See Figure 26 in the Application Information
section.
2. Time from output (Tx-PD-out) is available until Tx-PD-out signal reaches 66% of its steady state level. See Figure 26 in the Application
Information section.
3. To keep the junction temperature as close to the ambient temperature as possible, pulse testing method is used. The device is transmit-
enabled within the pulse duration time, t
P
. Thermal effects must be considered separately.
4. Maximum power dissipation in Control side and Line side IC’s needs to be limited to ensure that their respective junction temperature is less
than 125°C. The maximum permissible power dissipation is dependent on the thermal impedance and the ambient temperature. Details on
the typical thermal impedances are given in the Package Characteristics. Further details on applying this to an actual application can be
found in the Application Information section under Thermal Considerations.
