7
FN4071.12
September 20, 2006
FIGURE 10. SFDR vs CLOCK FREQUENCY FIGURE 11. SFDR vs CLOCK FREQUENCY
FIGURE 12. SFDR vs f
OUT
FIGURE 13. SFDR vs f
OUT
FIGURE 14. SFDR vs f
OUT
FIGURE 15. HARMONIC DISTORTION vs CLOCK FREQUENCY
Typical Performance Curves (Continued)
50
f
CLK
(MSPS)
90
85
80
75
70
65
60
(dBc)
60 70 80 90 10040302010
f
OUT
= (
1
/
10
) f
CLK
50
f
CLK
(MSPS)
90
85
80
75
70
65
60
(dBc)
60 70 80 9010040302010
f
OUT
= (
1
/
5
) f
CLK
f
OUT
(MSPS)
82
80
76
68
66
64
62
(dBc)
1051
74
72
70
f
CLK
= 50 MSPS
f
OUT
(MHz)
82
80
76
68
66
64
62
(dBc)
1051
74
72
70
15
f
CLK
= 75 MSPS
78
f
OUT
(MHz)
80
78
76
68
66
64
62
(dBc)
1051
74
72
70
15
f
CLK
= 100 MSPS
20
50
f
CLK
(MSPS)
-72
-74
-76
-78
-80
-82
-86
(dBc)
60 70 80 9010040302010
-84
f
OUT
= 2.03MHz
3RD HARMONIC
2ND HARMONIC
HI5741
8
FN4071.12
September 20, 2006
FIGURE 16. TYPICAL MTPR PERFORMANCE
FIGURE 17. SFDR WITHIN A WINDOW
FIGURE 18. TYPICAL SETTLING TIME PERFORMANCE FIGURE 19. TYPICAL GLITCH ENERGY
Pin Descriptions
PIN NO. PIN NAME PIN DESCRIPTION
1-14 D13 (MSB) thru D0 (LSB) Digital Data Bit 13, the Most Significant Bit through Digital Data Bit 0, the Least Significant Bit.
15 CLK Data Clock Pin 100kHz to 100 MSPS.
16 DV
CC
Digital Logic Supply +5V.
17, 28 DGND Digital Ground.
18 DV
EE
-5.2V Logic Supply.
23 R
SET
External Resistor to set the full scale output current. I
FS
= 16 x (V
REFOUT
/R
SET
). Typically 976.
27 AGND Analog Ground Supply current return pin.
19 ARTN Analog Signal Return for the R/2R ladder.
21 I
OUT
Current Output Pin.
20 I
OUT
Complementary Current Output pin.
22 AV
EE
-5.2V Analog Supply.
24 CTRL AMP IN Input to the current source base rail. Typically connected to CTRL AMP OUT and a 0.1F capacitor to AV
EE
.
Allows external control of the current sources.
25 CTRL AMP OUT Control amplifier out. Provides precision control of the current sources when connected to CTRL AMP IN
such that I
FS
= 16 x (V
REFOUT
/R
SET
).
26 REF OUT -1.23V (typical) bandgap reference voltage output. Can sink up to 500A or be overdriven by an external
reference capable of delivering up to 2mA.
Typical Performance Curves (Continued)
START 1.900MHz
S
STOP 3.100MHz
10dB/
C
f
CLK
= 20 MSPS
MTPR = 75.17dBc
CENTER 26.637MHz
S
SPAN 2.000MHz
10dB/
C
f
CLK
= 100 MSPS
f
OUT
= 26.6MHz
SFDR = 77.5dBc
1
CH1 1.00mV
~ M 5.0ns CH1 -16.9mV
SETTLING TIME
~10ns
: 240V
@: -30.96mV
12-BIT WINDOW
1
CH1 1.00mV M 5.0ns CH1 -109mV
GLITCH = (0.5) • (300V) • (3.3ns)
= 0.495pV/s
: 300V
@: -124.1mV
HI5741
9
FN4071.12
September 20, 2006
Detailed Description
The HI5741 is a 14-bit, current out D/A converter. The DAC
can convert at 100 MSPS and runs on +5V and -5.2V
supplies. The architecture is an R/2R and segmented
switching current cell arrangement to reduce glitch. Laser
trimming is employed to tune linearity to true 14-bit levels.
The HI5741 achieves its low power and high speed
performance from an advanced BiCMOS process. The
HI5741 consumes 650mW (typical) and has an improved
hold time of only 0.25ns (typical). The HI5741 is an excellent
converter for use in communications applications and high
performance video systems.
Digital Inputs
The HI5741 is a TTL/CMOS compatible D/A. Data is latched
by a Master register. Once latched, data inputs D0 (LSB)
through D13 (MSB) are internally translated from TTL to ECL.
The internal latch and switching current source controls are
implemented in ECL technology to maintain high switching
speeds and low noise characteristics.
Decoder/Driver
The architecture employs a split R/2R ladder and segmented
current source arrangement. Bits D0 (LSB) through D9 directly
drive a typical R/2R network to create the binary weighted
current sources. Bits D10 through D13 (MSB) pass through a
“thermometer” decoder that converts the incoming data into 15
individual segmented current source enables. This split
architecture helps to improve glitch, thus resulting in a
more constant glitch characteristic across the entire output
transfer function.
Clocks and Termination
The internal 14-bit register is updated on the rising edge of the
clock. Since the HI5741 clock rate can run to 100 MSPS, to
minimize reflections and clock noise into the part, proper
termination should be used. In PCB layout clock runs should
be kept short and have a minimum of loads. To guarantee
consistent results from board to board, controlled impedance
PCBs should be used with a characteristic line impedance Z
O
of 50.
To terminate the clock line, a shunt terminator to ground is
the most effective type at a 100 MSPS clock rate. A typical
value for termination can be determined by the equation:
for the termination resistor. For a controlled impedance board
with a Z
O
of 50, the R
T
= 50. Shunt termination is best
used at the receiving end of the transmission line or as close
to the HI5741 CLK pin as possible.
Rise and Fall times and propagation delay of the line will be
affected by the shunt terminator. The terminator should be
connected to DGND.
Noise Reduction
To reduce power supply noise, separate analog and digital
power supplies should be used with 0.1F and 0.01F
ceramic capacitors placed as close to the body of the
HI5741 as possible on the analog (AV
EE
) and digital (DV
EE
)
supplies. The analog and digital ground returns should be
connected together back at the device to ensure proper
operation on power up. The V
CC
power pin should also be
decoupled with a 0.1F capacitor.
Reduction of digital noise (caused by high slew rates on the bit
inputs to the HI5741) can be accomplished through the use of
series termination resistors. The use of serial resistors, which
combine with the input capacitance of the HI5741 to induce a
low pass filter characteristic, keeps the noise generated by high
slew rate digital signals from corrupting the high accuracy
analog data. Refer to Application Note AN9619 “Optimizing
setup conditions for high accuracy measurements of the
HI5741” for further details on selecting the proper value of
series termination to meet application specific needs.
Reference
The internal reference of the HI5741 is a -1.23V (typical)
bandgap voltage reference with 50V/°C of temperature drift
(typical). The internal reference is connected to the Control
Amplifier which in turn drives the segmented current cells.
Reference Out (REF OUT) is internally connected to the
Control Amplifier. The Control Amplifier Output (CTRL OUT)
should be used to drive the Control Amplifier Input (CTRL IN)
and a 0.1F capacitor to analog V
EE
. This improves settling
time by providing an AC ground at the current source base
node. The Full Scale Output Current is controlled by the REF
OUT pin and the set resistor (R
SET
). The ratio is:
I
OUT
(Full Scale) = (V
REF OUT
/R
SET
) x 16.
The internal reference (REF OUT) can be overdriven with a
more precise external reference to provide better
performance over temperature. Figure 21 illustrates a typical
external reference configuration.
R
T
Z
O
=
R
T
= 50
HI5741
DAC
CLK
Z
O
= 50
FIGURE 20. HI5741 CLOCK LINE TERMINATION
FIGURE 21. EXTERNAL REFERENCE CONFIGURATION
(26) REF OUT
HI5741
R
-5.2V
-1.25V
HI5741

HI5741BIBZ

Mfr. #:
Manufacturer:
Renesas / Intersil
Description:
Digital to Analog Converters - DAC 28 INDTEMP D/A 14 BIT 100 MHZ -5 2V
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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