1
Features
Single-voltage Operation
–5V Read
5V Reprogramming
Fast Read Access Time - 55 ns
Internal Program Control and Timer
Sector Architecture
One 16K Byte Boot Block with Programming Lockout
Two 8K Byte Parameter Blocks
Two Main Memory Blocks (96K, 128K Bytes)
Fast Erase Cycle Time - 10 seconds
Byte-by-byte Programming - 10 µs/Byte Typical
Hardware Data Protection
DATA Polling for End of Program Detection
Low Power Dissipation
50 mA Active Current
100 µA CMOS Standby Current
Typical 10,000 Write Cycles
Description
The AT49F002(N)(T) is a 5-volt only in-system reprogrammable Flash memory. Its 2
megabits of memory is organized as 262,144 words by 8 bits. Manufactured with
Atmels advanced nonvolatile CMOS technology, the device offers access times to 55
ns with power dissipation of just 275 mW over the commercial temperature range.
Rev. 1017D10/99
2-megabit
(256K x 8)
5-volt Only
Flash Memory
AT49F002
AT49F002N
AT49F002T
AT49F002NT
Pin Configurations
Pin Name Function
A0 - A17 Addresses
CE
Chip Enable
OE
Output Enable
WE Write Enable
RESET
RESET
I/O0 - I/O7 Data Inputs/Outputs
DC Dont Connect
DIP Top View
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
* RESET
A16
A15
A12
A7
A6
A5
A4
A3
A2
A1
A0
I/O0
I/O1
I/O2
GND
VCC
WE
A17
A14
A13
A8
A9
A11
OE
A10
CE
I/O7
I/O6
I/O5
I/O4
I/O3
PLCC Top View
5
6
7
8
9
10
11
12
13
29
28
27
26
25
24
23
22
21
A7
A6
A5
A4
A3
A2
A1
A0
I/O0
A14
A13
A8
A9
A11
OE
A10
CE
I/O7
4
3
2
1
32
31
30
14
15
16
17
18
19
20
I/O1
I/O2
GND
I/O3
I/O4
I/O5
I/O6
A12
A15
A16
RESET *
VCC
WE
A17
(continued)
VSOP Top View (8 x 14 mm) or
TSOP Top View (8 x 20 mm)
Type 1
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
A11
A9
A8
A13
A14
A17
WE
VCC
* RESET
A16
A15
A12
A7
A6
A5
A4
OE
A10
CE
I/O7
I/O6
I/O5
I/O4
I/O3
GND
I/O2
I/O1
I/O0
A0
A1
A2
A3
*Note: This pin is a DC on the AT49F002(N)(T).
AT49F002(N)(T)
2
When the device is deselected, the CMOS standby current
is less than 100 µA. For the AT49F002N(T) pin 1 for the
DIP and PLCC packages and pin 9 for the TSOP package
are dont connect pins.
To allow for simple in-system reprogrammability, the
AT49F002(N)(T) does not require high input voltages for
programming. Five-volt-only commands determine the read
and programming operation of the device. Reading data
out of the device is similar to reading from an EPROM; it
has standard CE
, OE, and WE inputs to avoid bus conten-
tion. Reprogramming the AT49F002(N)(T) is performed by
erasing a block of data and then programming on a byte by
byte basis. The byte programming time is a fast 50 µs. The
end of a program cycle can be optionally detected by the
DATA
polling feature. Once the end of a byte program
cycle has been detected, a new access for a read or pro-
gram can begin. The typical number of program and erase
cycles is in excess of 10,000 cycles.
The device is erased by executing the erase command
sequence; the device internally controls the erase opera-
tions. There are two 8K byte parameter block sections and
two main memory blocks.
The device has the capability to protect the data in the boot
block; this feature is enabled by a command sequence.
The 16K-byte boot block section includes a reprogramming
lock out feature to provide data integrity. The boot sector is
designed to contain user secure code, and when the fea-
ture is enabled, the boot sector is protected from being
reprogrammed.
In the AT49F002(N)(T), once the boot block programming
lockout feature is enabled, the contents of the boot block
are permanent and cannot be changed. In the
AT49F002(T), once the boot block programming lockout
feature is enabled, the contents of the boot block cannot be
changed with input voltage levels of 5.5 volts or less.
Block Diagram
CONTROL
LOGIC
Y DECODER
PARAMETER
BLOCK 1
(8K BYTES)
BOOT BLOCK
(16K BYTES)
OE
WE
CE
RESET
ADDRESS
INPUTS
VCC
GND
AT49F002(N)
DATA INPUTS/OUTPUTS
I/O7 - I/O0
8
X DECODER
PARAMETER
BLOCK 2
(8K BYTES)
MAIN MEMORY
BLOCK 1
(96K BYTES)
MAIN MEMORY
BLOCK 2
(128K BYTES)
PROGRAM
DATA LATCHES
Y-GATING
INPUT/OUTPUT
BUFFERS
3FFFF
20000
1FFFF
08000
07FFF
06000
05FFF
04000
03FFF
00000
PARAMETER
BLOCK 1
(8K BYTES)
BOOT BLOCK
(16K BYTES)
AT49F002(N)T
DATA INPUTS/OUTPUTS
I/O7 - I/O0
8
PARAMETER
BLOCK 2
(8K BYTES)
MAIN MEMORY
BLOCK 1
(96K BYTES)
MAIN MEMORY
BLOCK 2
(128K BYTES)
PROGRAM
DATA LATCHES
Y-GATING
INPUT/OUTPUT
BUFFERS
3FFFF
3C000
3BFFF
3A000
39FFF
38000
37FFF
20000
1FFFF
00000
AT49F002(N)(T)
3
Device Operation
READ: The AT49F002(N)(T) is accessed like an EPROM.
When CE
and OE are low and WE is high, the data stored
at the memory location determined by the address pins is
asserted on the outputs. The outputs are put in the high
impedance state whenever CE
or OE is high. This dual-line
control gives designers flexibility in preventing bus conten-
tion.
COMMAND SEQUENCES: When the device is first pow-
ered on it will be reset to the read or standby mode
depending upon the state of the control line inputs. In order
to perform other device functions, a series of command
sequences are entered into the device. The command
sequences are shown in the Command Definitions table.
The command sequences are written by applying a low
pulse on the WE
or CE input with CE or WE low (respec-
tively) and OE
high. The address is latched on the falling
edge of CE
or WE, whichever occurs last. The data is
latched by the first rising edge of CE
or WE. Standard
microprocessor write timings are used. The address loca-
tions used in the command sequences are not affected by
entering the command sequences.
RESET: A RESET
input pin is provided to ease some sys-
tem applications. When RESET
is at a logic high level, the
device is in its standard operating mode. A low level on the
RESET
input halts the present device operation and puts
the outputs of the device in a high impedance state. If the
RESET
pin makes a high to low transition during a program
or erase operation, the operation may not be successfully
completed and the operation will have to be repeated after
a high level is applied to the RESET
pin. When a high level
is reasserted on the RESET
pin, the device returns to the
read or standby mode, depending upon the state of the
control inputs. By applying a 12V
± 0.5V input signal to the
RESET
pin, the boot block array can be reprogrammed
even if the boot block lockout feature has been enabled
(see Boot Block Programming Lockout Override section).
The RESET feature is not available for the AT49F002N(T).
ERASURE: Before a byte can be reprogrammed, the main
memory block or parameter block which contains the byte
must be erased. The erased state of the memory bits is a
logical 1. The entire device can be erased at one time by
using a 6-byte software code. The software chip erase
code consists of 6-byte load commands to specific address
locations with a specific data pattern (please refer to the
Chip Erase Cycle Waveforms).
After the software chip erase has been initiated, the device
will internally time the erase operation so that no external
clocks are required. The maximum time needed to erase
the whole chip is t
EC
. If the boot block lockout feature has
been enabled, the data in the boot sector will not be
erased.
CHIP ERASE: If the boot block lockout has been enabled,
the Chip Erase function will erase Parameter Block 1,
Parameter Block 2, Main Memory Block 1, and Main Mem-
ory Block 2 but not the boot block. If the Boot Block Lockout
has not been enabled, the Chip Erase function will erase
the entire chip. After the full chip erase the device will
return back to read mode. Any command during chip erase
will be ignored.
SECTOR ERASE: As an alternative to a full chip erase, the
device is organized into sectors that can be individually
erased. There are two 8K-byte parameter block sections
and two main memory blocks. The 8K-byte parameter
block sections can be independently erased and repro-
grammed. The two main memory sections are designed to
be used as alternative memory sectors. That is, whenever
one of the blocks has been erased and reprogrammed, the
other block should be erased and reprogrammed before
the first block is again erased. The Sector Erase command
is a six bus cycle operation. The sector address is latched
on the falling WE
edge of the sixth cycle while the 30H data
input command is latched at the rising edge of WE
. The
sector erase starts after the rising edge of WE
of the sixth
cycle. The erase operation is internally controlled; it will
automatically time to completion.
BYTE PROGRAMMING: Once the memory array is
erased, the device is programmed (to a logical 0) on a
byte-by-byte basis. Please note that a data 0 cannot be
programmed back to a 1; only erase operations can con-
vert 0s to 1s. Programming is accomplished via the
internal device command register and is a 4 bus cycle
operation (please refer to the Command Definitions table).
The device will automatically generate the required internal
program pulses.
The program cycle has addresses latched on the falling
edge of WE
or CE, whichever occurs last, and the data
latched on the rising edge of WE
or CE, whichever occurs
first. Programming is completed after the specified t
BP
cycle
time. The DATA
polling feature may also be used to indicate
the end of a program cycle.
BOOT BLOCK PROGRAMMING LOCKOUT: The device
has one designated block that has a programming lockout
feature. This feature prevents programming of data in the
designated block once the feature has been enabled. The
size of the block is 16K bytes. This block, referred to as the
boot block, can contain secure code that is used to bring up
the system. Enabling the lockout feature will allow the boot
code to stay in the device while data in the rest of the
device is updated. This feature does not have to be acti-
vated; the boot blocks usage as a write protected region is
optional to the user. The address range of the boot block is
00000 to 03FFF for the AT49F002(N) while the address

AT49F002T-90PI

Mfr. #:
Manufacturer:
Description:
IC FLASH 2M PARALLEL 32DIP
Lifecycle:
New from this manufacturer.
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