7
FN6881.1
August 28, 2012
Absolute Maximum Ratings Thermal Information
Supply Voltage (PVCC, VCC) . . . . . . . . . . . . . . . . . . . -0.3V to 6.7V
Input Voltage (V
EN_PH
, V
PWM,
V
SYNC
) . . . . . -0.3V to VCC + 0.3V
BOOT Voltage (V
BOOT-GND
). . . -0.3V to 27V (DC) or 36V (<200ns)
BOOT To PHASE Voltage (V
BOOT-PHASE
). . . . . . -0.3V to 7V (DC)
-0.3V to 9V (<10ns)
PHASE Voltage . . . . . . . . . . . . . . . . . . . . . GND - 0.3V to 27V (DC)
GND -8V (<20ns Pulse Width, 10µJ) to 30V (<100ns)
UGATE Voltage . . . . . . . . . . . . . . . . V
PHASE
- 0.3V (DC) to V
BOOT
V
PHASE
- 5V (<20ns Pulse Width, 10µJ) to V
BOOT
LGATE Voltage . . . . . . . . . . . . . . . GND - 0.3V (DC) to VCC + 0.3V
GND - 2.5V (<20ns Pulse Width, 5µJ) to VCC + 0.3V
Thermal Resistance (Typical) θ
JA
(°C/W) θ
JC
(°C/W)
QFN Package (Notes 4, 5) . . . . . . . . 44 7
Ambient Temperature Range. . . . . . . . . . . . . . . . . .-40°C to +125°C
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . +150°C
Maximum Storage Temperature Range. . . . . . . . . .-65°C to +150°C
Pb-Free Reflow Profile. . . . . . . . . . . . . . . . . . . . . . . . .see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
Recommended Operating Conditions
Ambient Temperature
ISL6611ACRZ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to +70°C
ISL6611AIRZ . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to +85°C
Maximum Operating Junction Temperature. . . . . . . . . . . . . +125°C
Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5V ±10%
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and
result in failures not covered by warranty
NOTES:
4. θ
JA
is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See
Tech Brief TB379.
5. For θ
JC
, the “case temp” location is the center of the exposed metal pad on the package underside.
Electrical Specifications These specifications apply for recommended ambient temperature, unless otherwise noted. Parameters with
MIN and/or MAX limits are 100% tested at +25°C, unless otherwise specified. Temperature limits established
by characterization and are not production tested.
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
SUPPLY CURRENT (Note 6)
Bias Supply Current I
VCC+PVCC
PWM pin floating, V
VCC
= V
PVCC
= 5V,
EN_PH = 5V
-1.25- mA
PWM pin floating, V
VCC
= V
PVCC
= 5V,
EN_PH = 0V
-1.20- mA
F
PWM
= 600kHz, V
VCC
= V
PVCC
= 5V,
EN_PH = 5V; SYNC = 0V
-2.20- mA
F
PWM
= 300kHz, V
VCC
= V
PVCC
= 5V,
EN_PH = 5V; SYNC = 5V
-2.50- mA
BOOTSTRAP DIODE
Forward Voltage V
F
Forward bias current = 2mA
T
A
= 0°C to +70°C
0.30 0.60 0.70 V
Forward bias current = 2mA
T
A
= -40°C to +85°C
0.30 0.60 0.75 V
POWER-ON RESET
POR Rising -3.44.2V
POR Falling 2.5 3.0 - V
Hysteresis - 400 - mV
EN_PH INPUT
EN_PH Minimum LOW Threshold --0.8V
EN_PH Maximum HIGH Threshold 2.0 - - V
SYNC INPUT
SYNC Minimum LOW Threshold --0.8V
SYNC Maximum HIGH Threshold 2.0 - - V
ISL6611A
8
FN6881.1
August 28, 2012
Minimum SYNC Pulse --40ns
Synchronization Delay -50-ns
Interleaving Mode Phase Shift SYNC = 5V, PWM = 300kHz, 10% Width - 180 - °
Synchronization Mode Phase Shift SYNC = 0V, PWM = 300kHz, 10% Width - 0 - °
PWM INPUT
Sinking Impedance R
PWM_SNK
-8.5-kΩ
Source Impedance R
PWM_SRC
-10-kΩ
Tri-State Rising Threshold V
VCC
= V
PVCC
= 5V (250mV Hysteresis) 1.00 1.20 1.40 V
Tri-State Falling Threshold V
VCC
= V
PVCC
= 5V (300mV Hysteresis) 3.10 3.40 3.70 V
PWM Pulled High Threshold EN_PH = LOW, Ramping PWM low - 3.4 - V
SWITCHING TIME (Note 6, See Figure 1 on Page 9)
UGATE Rise Time t
RU
3nF Load - 8.0 - ns
LGATE Rise Time t
RL
3nF Load - 8.0 - ns
UGATE Fall Time t
FU
3nF Load - 8.0 - ns
LGATE Fall Time t
FL
3nF Load - 4.0 - ns
UGATE Turn-Off Propagation Delay t
PDLU
Unloaded, Excluding Balance Extension - 40 - ns
LGATE Turn-Off Propagation Delay t
PDLL
Unloaded, Excluding Balance Extension - 40 - ns
UGATE Turn-On Propagation Delay t
PDHU
Outputs Unloaded - 25 - ns
LGATE Turn-On Propagation Delay t
PDHL
Outputs Unloaded - 20 - ns
Tri-state to UG/LG Rising Propagation Delay t
PTS
Outputs Unloaded - 25 - ns
Tri-State Shutdown Holdoff Time t
TSSHD
Excluding Propagation Delay (t
PDLU,
t
PDLL
) - 25 - ns
OUTPUT (Note 6)
Upper Drive Source Resistance R
UG_SRC
50mA Source Current - 1.0 - Ω
Upper Drive Sink Resistance R
UG_SNK
50mA Sink Current - 1.0 - Ω
Lower Drive Source Resistance R
LG_SRC
50mA Source Current - 1.0 - Ω
Lower Drive Sink Resistance R
LG_SNK
50mA Sink Current - 0.4 - Ω
NOTE:
6. Limits established by characterization and are not production tested.
Electrical Specifications These specifications apply for recommended ambient temperature, unless otherwise noted. Parameters with
MIN and/or MAX limits are 100% tested at +25°C, unless otherwise specified. Temperature limits established
by characterization and are not production tested. (Continued)
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
ISL6611A
9
FN6881.1
August 28, 2012
Timing Diagram
Operation and Adaptive Shoot-Through Protection
Designed for high speed switching, the ISL6611A MOSFET
driver controls two-phase power trains’ high-side and low-side
N-Channel FETs from one externally provided PWM signal.
A rising transition on PWM initiates the turn-off of the lower
MOSFET (see Figure 1). After a short propagation delay
[t
PDLL
], the lower gate begins to fall. Typical fall times [t
FL
]
are provided in the “Electrical Specifications” on page 8.
Adaptive shoot-through circuitry monitors the LGATE voltage
and turns on the upper gate following a short delay time
[t
PDHU
] after the LGATE voltage drops below ~1V. The
upper gate drive then begins to rise [t
RU
] and the upper
MOSFET turns on.
A falling transition on PWM indicates the turn-off of the upper
MOSFET and the turn-on of the lower MOSFET. The upper
gate begins to fall [t
FU
] after a propagation delay [t
PDLU
],
which is modulated by the current balance circuits. The
adaptive shoot-through circuitry monitors the UGATE-PHASE
voltage and turns on the lower MOSFET a short delay time,
t
PDHL
, after the upper MOSFET’s gate voltage drops below
1V. The lower gate then rises [t
RL
], turning on the lower
MOSFET. These methods prevent both the lower and upper
MOSFETs from conducting simultaneously (shoot-through),
while adapting the dead time to the gate charge
characteristics of the MOSFETs being used.
This driver is optimized for voltage regulators with large step
down ratio. The lower MOSFET is usually sized larger
compared to the upper MOSFET because the lower
MOSFET conducts for a longer time during a switching
period. The lower gate driver is therefore sized much larger
to meet this application requirement. The 0.4Ω
ON-resistance and 4A sink current capability enable the
lower gate driver to absorb the current injected into the lower
gate through the drain-to-gate capacitor (C
GD
) of the lower
MOSFET and help prevent shoot through caused by the self
turn-on of the lower MOSFET due to high dV/dt of the
switching node.
Tri-State PWM Input
A unique feature of the ISL6611A is the adaptable tri-state
PWM input. Once the PWM signal enters the shutdown
window, either MOSFET previously conducting is turned off.
If the PWM signal remains within the shutdown window for
longer than 25ns of the previously conducting MOSFET, the
output drivers are disabled and both MOSFET gates are
pulled and held low. The shutdown state is removed when
the PWM signal moves outside the shutdown window. The
PWM Tri-state rising and falling thresholds outlined in the
“Electrical Specifications” on page 8 determine when the
lower and upper gates are enabled. During normal operation
in a typical application, the PWM rise and fall times through
the shutdown window should not exceed either output’s
turn-off propagation delay plus the MOSFET gate discharge
time to ~1V. Abnormally long PWM signal transition times
through the shutdown window will simply introduce
additional dead time between turn off and turn on of the
synchronous bridge’s MOSFETs. For optimal performance,
no more than 100pF parasitic capacitive load should be
present on the PWM line of ISL6611A (assuming an Intersil
PWM controller is used).
Bootstrap Considerations
This driver features an internal bootstrap diode. Simply
adding an external capacitor across the BOOT and PHASE
PWM
UGATE
LGATE
t
PDLL
t
PDHU
t
RU
t
PDLU
t
PDHL
t
RL
1V
2.5V
t
RU
t
FU
t
FL
1V
t
PTS
t
TSSHD
t
TSSHD
t
PTS
FIGURE 1. TIMING DIAGRAM
ISL6611A

ISL6611ACRZ-T

Mfr. #:
Manufacturer:
Renesas / Intersil
Description:
Gate Drivers PHS DOUBLER INTEGRTD 5V DRVRS 3OHM R BOOT
Lifecycle:
New from this manufacturer.
Delivery:
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