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MASW-003100-11920W

P1-P3P4-P6P7-P9
V6
MASW-001100-1190
MASW-002100-1191
MASW-003100-1192
HMIC™ Silicon PIN Diode Switches
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
• India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
4
Typical Performance Curves @ TA = +25°C, 20mA Bias Current
MASW-001100-1190
ISOLATION vs. FREQUENCY
-80
-75
-70
-65
-60
-55
-50
-45
-40
-35
0 5 10 15 20 25 30
FREQUENCY (GHz)
ISOLATION (dB
)
INPUT RETURN LOSS vs. BIAS CURRENT @ 10 GHz
-34
-32
-30
-28
-26
-24
-22
0 5 10 15 20 25 30 35 40 45 50 55
CURRENT (mA)
INPUT RETURN LOSS (d
B
MASW-003100
MASW-002100
M A S W- 0 0 110 0
MASW-003100-1192
ISOLATION vs. FREQUENCY
-80
-75
-70
-65
-60
-55
-50
-45
-40
-35
0 5 10 15 20 25 30
FREQUENCY (GHz)
ISOLATION (dB
)
MASW-002100-1191
ISOLATION vs. FREQUENCY
-80
-75
-70
-65
-60
-55
-50
-45
-40
-35
0 5 10 15 20 25 30
FREQUENCY (GHz)
ISOLATION (dB
OUTPUT RETURN LOSS vs. BIAS CURRENT@ 10 GHz
-25.5
-25
-24.5
-24
-23.5
-23
-22.5
-22
-21.5
0 5 10 15 20 25 30 35 40 45 50 55
CURRENT (mA)
OUTPUT RETURN LOSS (d
B
MASW-003100
MASW-002100
M A S W- 0 0 110 0
INSERTION LOSS vs. BIAS CURRENT @ 10 GHz
-0.7
-0.65
-0.6
-0.55
-0.5
-0.45
-0.4
-0.35
0 5 10 15 20 25 30 35 40 45 50 55
CURRENT (mA)
INSERTION LOSS (d
B
MASW-003100
MASW-002100
MASW-001100
ISOLATION vs. BIAS CURRENT @ 10 GHz
-54
-53
-52
-51
-50
-49
-48
-47
-46
0 5 10 15 20 25 30 35 40 45 50 55
CURRENT (mA)
ISOLATION (dB
)
MASW-003100
MASW-002100
MASW-001100
V6
MASW-001100-1190
MASW-002100-1191
MASW-003100-1192
HMIC™ Silicon PIN Diode Switches
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
• India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
5
Operation of the MASW Series Switches
Operation of the MASW series of PIN switches is achieved
by simultaneous application of negative DC current to the
low loss switching arm J1, J2, or J3, and positive DC
current to the remaining switching arms as shown in the
bias connection circuits. DC return is achieved via J1. The
control currents should be supplied by constant current
sources. The voltages at these points will not exceed
+
1.5 volts (1.2V typical) at currents up to +20mA. In the low
loss state, the series diode must be forward biased and the
shunt diode reverse biased. In the isolated arm, the shunt
diode is forward biased and the series diode is reverse
biased.
Driver Connections
MASW-001100-1190
MASW-002100-1191
MASW-003100-1192
Handling Considerations
Cleanliness: These chips should be handled in a clean
environment.
Electro-Static Sensitivity: The MASW series PIN switches
are ESD, Class 1A sensitive (HBM). The proper ESD
handling procedures should be used.
Control Level
(DC Current) at
Condition of
RF Output
J2 J1-J2
-20mA Low Loss
+20mA Isolation
Control Level
(DC Current) at
Condition of
RF Output
Condition of
RF Output
J2 J3 J1-J2 J1-J3
-20mA +20mA
Low Loss
Isolation
+20mA -20mA Isolation
Low Loss
Control Level
(DC Current) at
Cond. of
RF Output
Cond. of
RF Output
Cond. of RF
Output
J2 J3 J4 J1-J2 J1-J3 J1-J4
-20mA +20mA +20mA
Low Loss
Isolation Isolation
+20mA -20mA +20mA Isolation
Low Loss
Isolation
+20mA +20mA -20mA Isolation Isolation
Low Loss
MASW-001100-1190 and Bias Connections
1
20nH
20nH
20pF
20pF
20pF
20pF
100Ω
J2 BIAS
RF OUTPUT
J2
J1 RF INPUT
Switch
Chip
MASW-002100-1191 and Bias Connections
1
J1 RF INPUT
J2 BIAS
J2
RF OUTPUT
J3 BIAS
J3
RF OUTPUT
Switch
Chip
20pF
20pF
20pF
20pF
20pF
20pF
20nH
20nH
20nH
100Ω
MASW-003100-1192 and Bias Connections
1
J2 BIAS
J2
RF OUTPUT
J4
RF OUTPUT
J1 RF INPUT
J4 BIAS
J3 BIAS
J3
RF OUTPUT
20pF
20pF
20
p
F
20pF
20pF
20pF
20pF
20
p
F
20nH
20nH
20nH
20nH
100Ω
Notes:
1. RLC values are for an operation frequency of 2-18GHz and
bias current of ± 20mA per diode.
V6
MASW-001100-1190
MASW-002100-1191
MASW-003100-1192
HMIC™ Silicon PIN Diode Switches
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
• India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
6
Wire Bonding
Thermosonic wedge bonding using 0.003” x 0.00025” ribbon or 0.001” diameter gold wire is recommended.
A stage temperature of 150°C and a force of 18 to 22 grams should be used. Ultrasonic energy, if
necessary, should be adjusted to the minimum power required to achieve a good bond. RF wire and ribbon
lengths should be kept as short as possible to minimize parasitic inductance.
Mounting
These chips have Ti-Pt-Au back metal and can be mounted using 80Au/20Sn eutectic solder or electrically
conductive Ag epoxy. Mounting surface must be flat and clean of oils and contaminants.
Eutectic Die Attachment: An 80/20 gold-tin eutectic solder preform is recommended with a work surface
temperature of 255
o
C and a tool tip temperature of 265
o
C. When hot gas is applied, the tool tip temperature
should be 290
o
C. The chip should not be exposed to temperatures greater than 320
o
C for more than 20
seconds. No more than three seconds should be required for attachment. Solders containing tin should not be
used.
Epoxy Die Attachment: A controlled thickness of no more than 2 mils is recommended for the best
electrical and thermal conductivity. A thin epoxy fillet should be visible around the perimeter of the chip after
placement to ensure complete coverage. Cure epoxy per manufacturer’s recommended schedule. Typically
+150°C for 1 hour.
Chip Outline Drawing
1
,
2
DIM INCHES MM
MIN. MAX. MIN. MAX.
A
0.014 0.018 0.35 0.45
B
0.025 0.029 0.64 0.74
C
0.008 REF 0.20 REF
D
0.004 0.006 0.10 0.15
E
0.004 REF 0.10 REF
F
0.003 REF 0.08 REF
G
0.003 REF 0.08 REF
H
0.020 REF 0.52 REF
Notes:
1. Topside and backside surface metallization is gold, 2.5μm thick typical.
2. Yellow areas indicate wire bonding pads.
P1-P3P4-P6P7-P9

MASW-003100-11920W

Mfr. #:
Buy MASW-003100-11920W
Manufacturer:
MACOM
Description:
RF Switch ICs 50-26500MHz 2W -65C +125C Iso 65dB
Lifecycle:
New from this manufacturer.
Delivery:
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