5
Absolute Maximum Ratings
No derating required up to +125°C.
Parameter Symbol Min. Max. Units
Storage Temperature T
S
-65 +150 °C
Operating Temperature T
A
-55 +125 °C
Case Temperature T
C
+170 °C
Junction Temperature T
J
+175 °C
Lead Solder Temperature 260 for 10 sec °C
Peak Forward Input Current
(each channel, ≤1 ms duration)
I
F(PEAK)
40 mA
Average Input Forward Current (each channel) I
F(AVG)
20 mA
Input Power Dissipation (each channel) 35 mW
Reverse Input Voltage (each channel V
R
5V
Supply Voltage (1 minute maximum) V
CC
7.0 V
Output Current (each channel) I
O
25 mA
Output Voltage (each channel) V
O
7V
Output Power Dissipation (each channel) P
O
40 mW
Package Power Dissipation (each channel) P
D
200 mW
Single Channel Product Only
Enable Input Voltage V
E
3.6 V
Note enable pin 7. An external 0.01 μF to 0.1 μF bypass capacitor must
be connected between V
CC
and ground for each package type.
8 Pin Ceramic DIP Single Channel Schematic
ESD Classi cation
MIL-PRF-38534 and MIL-STD-883, Method 3015
ACPL-560L/01L/0KL, 5962-0824201 (B), Class 1B
ACPL-5630L/31L/3KL, 5962-0824202 (A), Class 3A
ACPL-2670L/72L/268KL, 5962-0824203 (), Class 2
Recommended Operating Conditions
Parameter Symbol Min. Max. Units
Input Current, Low Level, Each Channel I
FL
0 250 μA
Input Current, High Level, Each Channel I
FH
10 20 mA
Supply Voltage, Output V
CC
3.0 3.6 V
Fan Out (TTL Load) Each Channel N 6
