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List of figures M87C257
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List of figures
Figure 1. Logic diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Figure 2. DIP connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Figure 3. LCC connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Figure 4. Programming flowchart. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Figure 5. AC testing input output waveform. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 6. AC testing load circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 7. Read mode AC waveforms. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 8. Programming and Verify modes AC waveforms. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Figure 9. FDIP28W - 28 pin Ceramic Frit-seal DIP, with window, package outline . . . . . . . . . . . . . . 18
Figure 10. PLCC32 - 32 pin Rectangular Plastic Leaded Chip Carrier, package outline. . . . . . . . . . . 19
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M87C257 Description
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1 Description
The M87C257 is a 256 Kbit EPROM offered in the two ranges UV (ultra violet erase) and
OTP (one time programmable). It incorporates latches for all address inputs to minimize chip
count, reduce cost, and simplify the design of multiplexed bus systems and is organized as
32,768 by 8 bits.
The FDIP28W (window ceramic frit-seal package) has a transparent lid which allows the
user to expose the chip to ultraviolet light to erase the bit pattern. A new pattern can then be
written to the device by following the programming procedure.
For applications where the content is programmed only one time and erasure is not
required, the M87C257 is offered in PLCC32 package.
In order to meet environmental requirements, ST offers the M87C257 in ECOPACK®
packages.
ECOPACK packages are Lead-free. The category of second Level Interconnect is marked
on the package and on the inner box label, in compliance with JEDEC Standard JESD97.
The maximum ratings related to soldering conditions are also marked on the inner box label.
ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
Figure 1. Logic diagram
AI00928B
15
A0-A14
ASV
PP
Q0-Q7
V
CC
M87C257
G
E
V
SS
8
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Description M87C257
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Figure 2. DIP connections
Figure 3. LCC connections
Table 1. Signal names
A0-A14 Address Inputs
Q0-Q7 Data Outputs
E
Chip Enable
G
Output Enable
AS
V
PP
Address Strobe / Program Supply
V
CC
Supply Voltage
V
SS
Ground
NC Not Connected Internally
DU Don’t Use
A1
A0
Q0
A7
A4
A3
A2
A6
A5
A13
A10
A8
A9
Q7
A14
A11
G
E
Q5Q1
Q2
Q3V
SS
Q4
Q6
A12
ASV
PP
V
CC
AI00929
M87C257
8
1
2
3
4
5
6
7
9
10
11
12
13
14
16
15
28
27
26
25
24
23
22
21
20
19
18
17
AI00930
A13
A8
A10
Q4
17
A0
NC
Q0
Q1
Q2
DU
Q3
A6
A3
A2
A1
A5
A4
9
A14
A9
1
ASV
PP
A11
Q6
A7
Q7
32
DU
V
CC
M87C257
A12
NC
Q5
G
E
25
V
SS
Obsolete Product(s) - Obsolete Product(s)

M87C257-90C1

Mfr. #:
Manufacturer:
STMicroelectronics
Description:
EPROM 256K (32Kx8) 90ns
Lifecycle:
New from this manufacturer.
Delivery:
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Payment:
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