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AT30TS75-MA8-T

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P30P31-P33P34-P36P37-P37
31
AT30TS75 [DATASHEET]
Atmel-8748E-DTS-AT30TS75-Datasheet_092013
10. Part Marking Detail
DRAWING NO. REV. TITLE
30TS75SM A
1/18/13
AT30TS75SM, AT30TS75 Package Marking Information
Package Mark Contact:
DL-CSO-Assy_eng@atmel.com
AAAAAAAA
T75 @
ATML8YWW
8-lead SOIC
8-lead UDFN
T3
8 @
YXX
2.0 x 3.0 mm Body
Note 2: Package drawings are not to scale
Note 1: designates pin 1
AT30TS75: Package Marking Information
Catalog Number Truncation
AT30TS75 Truncation Code ###: T3 or T75
Date Codes Voltages
Y = Year M = Month WW = Work Week of Assembly % = Minimum Voltage
3: 2013 7: 2017 A: January 02: Week 2 Blank: 2.7V min
4: 2014 8: 2018 B: February 04: Week 4
5: 2015 9: 2019 ... ...
6: 2016 0: 2020 L: December 52: Week 52
Country of Assembly Lot Number Grade/Lead Finish Material
@ = Country of Assembly AAA...A = Atmel Wafer Lot Number
8: Industrial (C)
(-40°C to 125°C)/NiPdAu
Trace Code Atmel Truncation
XX = Trace Code (Atmel Lot Numbers Correspond to Code) AT: Atmel
Example: AA, AB.... YZ, ZZ ATM: Atmel
ATML: Atmel
YWW@
8 XX
T75
8-lead MSOP
AT30TS75 [DATASHEET]
Atmel-8748E-DTS-AT30TS75-Datasheet_092013
32
11. Packaging Information
11.1 8S1 — 8-lead JEDEC SOIC
DRAWING NO. REV. TITLE GPC
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
MIN
NOM
MAX
NOTE
A1 0.10 – 0.25
A 1.35 – 1.75
b 0.31 – 0.51
C 0.17 – 0.25
D 4.80 – 5.05
E1 3.81 – 3.99
E 5.79 – 6.20
e 1.27 BSC
L 0.40 – 1.27
Ø
Ø
0° – 8°
Ø
E
1
N
TOP VIEW
C
E1
END VIEW
A
b
L
A1
e
D
SIDE VIEW
Package Drawing Contact:
packagedrawings@atmel.com
8S1 G
6/22/11
Notes: This drawing is for general information only.
Refer to JEDEC Drawing MS-012, Variation AA
for proper dimensions, tolerances, datums, etc.
8S1, 8-lead (0.150” Wide Body), Plastic Gull Wing
Small Outline (JEDEC SOIC)
SWB
33
AT30TS75 [DATASHEET]
Atmel-8748E-DTS-AT30TS75-Datasheet_092013
11.2 8XM — 8-lead MSOP
TITLE
DRAWING NO. GPC
REV.
Package Drawing Contact:
packagedrawings@atmel.com
8XMTZD A
8XM, 8-lead, 3.0x3.0mm Body, Plastic Thin
Shrink Small Outline Package (TSSOP/MSOP)
3/1/11
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
MIN
NOM
MAX
NOTE
A - - 1.10
A
1
0.05 0.10 0.15
A
2
0.75 0.85 0.95
b 0.22 - 0.38
D 2.90 3.00 3.10 1
E 4.90 BSC
E
1
2.90 3.00 3.10 1
e 0.65 BSC
L 0.40 0.55 0.80 2
A
e
O
C
C
A
1
N
Pin 1
E
1
1
A
2
3
SIDE VIEW
END VIEW
DETAIL 'A'
TOP VIEW
SEATING
PLANE
123
SEE
DETAIL "A"
2
L
4
1.
ONE ANOTHER WITHIN 0.10mm AT SEATING PLANE.
4.
3.
2.
FORMED LEADS SHALL BE PLANAR WITH RESPECT TO
TERMINAL POSITIONS ARE SHOWN FOR REFERENCE ONLY.
FOR SOLDERING TO A SUBSTRATE.
DIMENSION IS THE LENGTH OF TERMINAL
PROTRUSIONS SHALL NOT EXCEED 0.15mm PER SIDE.
AT DATUM PLANE -H- , MOLD FLASH OR
FLASH OR PROTRUSIONS, AND ARE MEASURED
DIMENSIONS "D" & "E1" DO NOT INCLUDE MOLD
NOTES:
C0.10
C
L
BSC
0.25
D
C
0.20 B A
2X
(N/2 TIPS)
E
1
0.07 R. MIN
2 PLACES
-C-
SEATING PLANE
-H-
-A-
-B-
S0.05
5. DATUMS -A- AND -B- TO BE DETERMINED BY DATUM
PLANE -H- .
BOTTOM VIEW
N
321
8°
0°
C
C
O
4°
b
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P30P31-P33P34-P36P37-P37

AT30TS75-MA8-T

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Buy AT30TS75-MA8-T
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Description:
Board Mount Temperature Sensors TMP SENSOR
Lifecycle:
New from this manufacturer.
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