Data Sheet
October 5, 2009
KW0006-010 Series Power Modules:
36 – 75Vdc Input; 3.3 to 5.0Vdc Output; 6 to 10A Output Current
LINEAGE POWER 11
Surface Mount Information
Pick and Place
The KW006/010 modules use an open frame
construction and are designed for a fully automated
assembly process. The pick and place location on the
module is the larger magnetic core as shown in Figure
23. The modules are fitted with a label which meets all
the requirements for surface mount processing, as well
as safety standards, and is able to withstand reflow
temperatures of up to 300
o
C. The label also carries
product information such as product code, serial
number and the location of manufacture.
Figure 23. Pick and Place Location.
Nozzle Recommendations
The module weight has been kept to a minimum by
using open frame construction. Even so, these
modules have a relatively large mass when compared
to conventional SMT components. Variables such as
nozzle size, tip style, vacuum pressure and placement
speed should be considered to optimize this process.
The recommended nozzle diameter for reliable
operation is 6mm. Oblong or oval nozzles up to 11 x 6
mm may also be used within the space available.
Tin Lead Soldering
The KW006/010 power modules (both non-Z and –Z
codes) can be soldered either in a conventional
Tin/Lead (Sn/Pb) process. The non-Z version of the
KW006/010 modules are RoHS compliant with the lead
exception. Lead based solder paste is used in the
soldering process during the manufacturing of these
modules. These modules can only be soldered in
conventional Tin/lead (Sn/Pb) process. It is
recommended that the customer review data sheets in
order to customize the solder reflow profile for each
application board assembly. The following instructions
must be observed when soldering these units. Failure
to observe these instructions may result in the failure of
or cause damage to the modules, and can adversely
affect long-term reliability.
In a conventional Tin/Lead (Sn/Pb) solder process peak
reflow temperatures are limited to less than 235
o
C.
Typically, the eutectic solder melts at 183
o
C, wets the
land, and subsequently wicks the device connection.
Sufficient time must be allowed to fuse the plating on
the connection to ensure a reliable solder joint. There
are several types of SMT reflow technologies currently
used in the industry. These surface mount power
modules can be reliably soldered using natural forced
convection, IR (radiant infrared), or a combination of
convection/IR. For reliable soldering the solder reflow
profile should be established by accurately measuring
the modules CP connector temperatures.
REFLOW TEMP (°C)
0
50
10 0
15 0
200
250
300
Preheat zone
max 4
o
Cs
-1
Soak zone
30-240s
Heat zone
max 4
o
Cs
-1
Peak Temp 235
o
C
Coo ling
zo ne
1- 4
o
Cs
-1
T
lim
above
205
o
C
REFLOW TIME (S)
Figure 24. Reflow Profile for Tin/Lead (Sn/Pb)
process
MAX TEMP SOLDER (°C)
200
205
210
215
220
225
230
235
240
0 102030405060
Figure 25. Time Limit Curve Above 205
o
C for
Tin/Lead (Sn/Pb) process
Lead Free Soldering
The –Z version of the KW006/010 modules are lead-
free (Pb-free) and RoHS compliant and are both
forward and backward compatible in a Pb-free and a
SnPb soldering process. The non-Z version of the
KW006/010 modules are RoHS compliant with the lead
exception. Lead based solder paste is used in the
soldering process during the manufacturing of these
modules. These modules can only be soldered in
