BUK7607-30B All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 02 — 21 February 2011 6 of 14
NXP Semiconductors
BUK7607-30B
N-channel TrenchMOS standard level FET
6. Characteristics
Table 6. Characteristics
Symbol Parameter Conditions Min Typ Max Unit
Static characteristics
V
(BR)DSS
drain-source breakdown
voltage
I
D
= 0.25 mA; V
GS
=0V; T
j
=25°C30--V
I
D
= 0.25 mA; V
GS
=0V; T
j
= -55 °C 27 - - V
V
GS(th)
gate-source threshold voltage I
D
=1mA; V
DS
=V
GS
; T
j
=17C;
see Figure 10
1--V
I
D
=1mA; V
DS
=V
GS
; T
j
=2C;
see Figure 10
234V
I
D
=1mA; V
DS
=V
GS
; T
j
=-5C;
see Figure 10
--4.4V
I
DSS
drain leakage current V
DS
=30V; V
GS
=0V; T
j
= 175 °C - - 500 µA
V
DS
=30V; V
GS
=0V; T
j
= 25 °C - 0.02 1 µA
I
GSS
gate leakage current V
GS
=20V; V
DS
=0V; T
j
= 25 °C - 2 100 nA
V
GS
=-20V; V
DS
=0V; T
j
= 25 °C - 2 100 nA
R
DSon
drain-source on-state
resistance
V
GS
=10V; I
D
=25A; T
j
=17C;
see Figure 11; see Figure 12
- - 13.3 m
V
GS
=10V; I
D
=25A; T
j
=2C;
see Figure 11
; see Figure 12
-5.97m
Dynamic characteristics
Q
G(tot)
total gate charge I
D
=25A; V
DS
=24V; V
GS
=10V;
T
j
= 25 °C; see Figure 13
-36-nC
Q
GS
gate-source charge - 9 - nC
Q
GD
gate-drain charge - 12 - nC
C
iss
input capacitance V
GS
=0V; V
DS
=25V; f=1MHz;
T
j
= 25 °C; see Figure 14
- 1820 2427 pF
C
oss
output capacitance - 632 758 pF
C
rss
reverse transfer capacitance - 256 351 pF
t
d(on)
turn-on delay time V
DS
=25V; R
L
=1.2; V
GS
=10V;
R
G(ext)
=10; T
j
=2C
-20-ns
t
r
rise time - 51 - ns
t
d(off)
turn-off delay time - 51 - ns
t
f
fall time - 44 - ns
L
D
internal drain inductance from drain lead 6 mm from package
to centre of die ; T
j
=2C
-4.5-nH
from upper edge of drain mounting
base to centre of die ; T
j
=2C
-2.5-nH
L
S
internal source inductance from source lead 6 mm from package
to source bond pad ; T
j
=2C
-7.5-nH
Source-drain diode
V
SD
source-drain voltage I
S
=25A; V
GS
=0V; T
j
=2C;
see Figure 15
- 0.85 1.2 V
t
rr
reverse recovery time I
S
=20A; dI
S
/dt = -100 A/µs;
V
GS
=-10V; V
DS
=20V; T
j
=2C
-46-ns
Q
r
recovered charge - 28 - nC
BUK7607-30B All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 02 — 21 February 2011 7 of 14
NXP Semiconductors
BUK7607-30B
N-channel TrenchMOS standard level FET
Fig 5. Output characteristics: drain current as a
function of drain-source voltage; typical values
Fig 6. Drain-source on-state resistance as a function
of gate-source voltage; typical values
Fig 7. Sub-threshold drain current as a function of
gate-source voltage
Fig 8. Forward transconductance as a function of
drain current; typical values
03nm89
0
100
200
300
0246810
V
DS
(V)
I
D
(A)
10
20
9.5
9
8.5
8
7.5
7
6.5
6
5.5
5
4.5
Label V
GS
(V)
03nk83
4
6
8
10
12
5101520
V
GS
(V)
R
DSon
(mΩ)
03aa35
V
GS
(V)
0642
10
4
10
5
10
2
10
3
10
1
I
D
(A)
10
6
min typ max
03nm86
0
10
20
30
40
0 25 50 75 100
I
D
(A)
g
fs
(S)
BUK7607-30B All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 02 — 21 February 2011 8 of 14
NXP Semiconductors
BUK7607-30B
N-channel TrenchMOS standard level FET
Fig 9. Transfer characteristics: drain current as a
function of gate-source voltage; typical values
Fig 10. Gate-source threshold voltage as a function of
junction temperature
Fig 11. Drain-source on-state resistance as a function
of drain current; typical values
Fig 12. Normalized drain-source on-state resistance
factor as a function of junction temperature
03nm87
0
25
50
75
100
02468
V
GS
(V)
I
D
(A)
T
j
= 175
°
C T
j
= 25
°
C
T
j
(°C)
60 180120060
03aa32
2
3
1
4
5
V
GS(th)
(V)
0
max
typ
min
03nm90
0
5
10
15
20
0 100 200 300
I
D
(A)
R
DSon
(mΩ)
Label is V
GS
(V)
6
6.5
7
7.5
8
9
10
03aa27
0
0.5
1
1.5
2
60 0 60 120 180
T
j
(
°
C)
a

BUK7607-30B,118

Mfr. #:
Manufacturer:
Nexperia
Description:
RF Bipolar Transistors MOSFET HIGH PERF TRENCHMOS
Lifecycle:
New from this manufacturer.
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