www.ams.com/LED-Driver-ICs/AS1110 Revision 1.6 18 - 24
AS1110
Datasheet - Application Information
The last pattern written into the shift register will be saved before starting low-current diagnosis mode and can be displayed immediately after the
test has been performed.
Low-current diagnostic mode is started with 3 clock pulses during error detection mode. Then OEN should be enabled for 2µs for testing. With
the rising edge of OEN the LED test is stopped, and while LD is high the desired error mode can be selected with the corresponding clock
pulses. After LD and OEN go low again the previously saved pattern can be displayed at the outputs.
With the next data input the detailed error code will be clocked out at pin SDO.
Note: See Figure 21 for use of an external test pattern.
Figure 21. Low-Current Diagnosis Mode with External Test Pattern – 64 Cascaded AS1110s
9.2 Cascading Devices
To cascade multiple AS1110 devices, pin SDO must be connected to pin SDI of the next AS1110 (see Figure 22). At each rising edge of CLK the
LSB of the shift register will be written into the shift register SDI of the next AS1110 in the chain.
Note: When n*AS1110 devices are in one chain, n*16 clock pulses are needed to latch-in the input data.
Figure 22. Cascading AS1110 Devices
Temperature Error Code
Data2
Data1
GEF GEF
T/O or S Error Code
Data0
Rising Edge of OEN
Acquisition of Error Status
Display
SDI
SDO
CLK
OEN
LD
1024x
1024x
3x Clocks
Low-Current
Mode
Clock for Error
Mode 1x/2x
Falling Edge of LD; Error Register is cop-
ied into Shift Register
O or S Error Code
from Test Pattern
1024x
GEF = Global Error Flag
Low-Current Diagnosis Mode
100mA 100mA
Current
0.8mA
Data2 Data3
External all 1s Test Pattern
AS1110 #n-1
SDI SDO
CLK LD OEN
SDI
CLK
LD
OEN
AS1110 #1
SDI SDO
CLK LD OEN
AS1110 #2
SDI SDO
CLK LD OEN
www.ams.com/LED-Driver-ICs/AS1110 Revision 1.6 19 - 24
AS1110
Datasheet - Application Information
9.3 Constant Current
In LED display applications, the AS1110 provides virtually no current variations from channel-to-channel and from AS1110-to-AS1110. This is
mostly due to 2 factors:
While IOUT 10mA, the maximum current skew is less than ±3% between channels and less than ±6% between AS1110 devices.
In the saturation region, the characteristic curve of the output stage is flat (see Figure 5 on page 7). Thus, the output current can be kept
constant regardless of the variations of LED forward voltages (V
F).
9.4 Adjusting Output Current
The AS1110 scales up the reference current (IREF) set by external resistor (REXT) to sink a current (IOUT) at each output port. As shown in
Figure 3 on page 7 the output current in the saturation region is extremely flat so that it is possible to define it as target current (I
OUT TARGET).
I
OUT TARGET can be calculated by:
V
REXT = 1.253V (EQ 1)
IREF = VREXT/REXT (if the other end of REXT is connected to ground) (EQ 2)
I
OUT TARGET = IREF*15 = (1.253V/REXT)*15 (EQ 3)
Where:
R
EXT is the resistance of the external resistor connected to pin REXT.
VREXT is the voltage on pin REXT.
The magnitude of current (as a function of R
EXT) is around 50.52mA at 372Ω and 25.26mA at 744Ω. Figure 3 on page 7 shows the relationship
curve between the I
OUT TARGET of each channel and the corresponding external resistor (REXT).
9.5 Package Power Dissipation
The maximum allowable package power dissipation (PD) is determined as:
P
D(MAX) = (TJ-TAMB)/RTH(J-A) (EQ 4)
When 16 output channels are turned on simultaneously, the actual package power dissipation is:
P
D(ACT) = (IDD*VDD) + (IOUT*Duty*VDS*16) (EQ 5)
Therefore, to keep PD(ACT) PD(MAX), the maximum allowed output current as a function of duty cycle is:
I
OUT = {[(TJ-TAMB)/RTH(J-A)]-(IDD*VDD)}/VDS/Duty/16 (EQ 6)
Where:
T
J = 150ºC
9.6 Delayed Outputs
The AS1110 has graduated delay circuits between outputs. These delay circuits can be found between OUTNn and constant current block.
The fixed delay time is 20 ns (typ) where OUTN0 has no delay, OUTN1 has 20ns delay, OUTN2 has 40ns delay ... OUTN15 has 300ns delay.
This delay prevents large inrush currents, which reduce power supply bypass capacitor requirements when the outputs turn on (see Figure 11 on
page 10)
9.7 Switching-Noise Reduction
LED drivers are frequently used in switch-mode applications which normally exhibit switching noise due to parasitic inductance on the PCB.
9.8 Load Supply Voltage
Considering the package power dissipation limits (see EQ 4:6), the AS1110 should be operated within the range of
VDS = 0.4 to 1.0V.
For example, if V
LED is higher than 5V, VDS may be so high that PD(ACT) > PD(MAX) where VDS = VLED - VF. In this case, the lowest possible
supply voltage or a voltage reducer (V
DROP) should be used. The voltage reducer allows
V
DS = (VLED -VF) - VDROP.
Note: Resistors or zener diodes can be used as a voltage reducer as shown in Figure 23.
www.ams.com/LED-Driver-ICs/AS1110 Revision 1.6 20 - 24
AS1110
Datasheet - Application Information
Figure 23. Voltage Reducer using Resistor (Left) and Zener Diode (Right)
AS1110
VDS
VF
Voltage Supply
}
VLED
VDROP
AS1110
VDS
VF
VLED
VDROP
Voltage Supply
{

AS1110-BSST

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LED Display Drivers AS1110-BSST QSOP24 LF T&R
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