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CY7C1357C-133AXIT

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CY7C1355C
CY7C1357C
Document #: 38-05539 Rev. *E Page 13 of 28
TAP Timing
TAP AC Switching Characteristics
Over the Operating Range
[10, 11]
Parameter Description Min. Max. Unit
Clock
t
TCYC
TCK Clock Cycle Time 50 ns
t
TF
TCK Clock Frequency 20 MHz
t
TH
TCK Clock HIGH Time 20 ns
t
TL
TCK Clock LOW Time 20 ns
Output Times
t
TDOV
TCK Clock LOW to TDO Valid 10 ns
t
TDOX
TCK Clock LOW to TDO Invalid 0 ns
Set-up Times
t
TMSS
TMS Set-Up to TCK Clock Rise 5 ns
t
TDIS
TDI Set-Up to TCK Clock Rise 5 ns
t
CS
Capture Set-Up to TCK Rise 5 ns
Hold Times
t
TMSH
TMS Hold after TCK Clock Rise 5 ns
t
TDIH
TDI Hold after Clock Rise 5 ns
t
CH
Capture Hold after Clock Rise 5 ns
Notes:
10. t
CS
and t
CH
refer to the set-up and hold time requirements of latching data from the boundary scan register.
11. Test conditions are specified using the load in TAP AC Test Conditions. t
R
/t
F
= 1 ns.
t
TL
Test Clock
(TCK)
est Mode Select
(TMS)
t
TH
Test Data-Out
(TDO)
t
CYC
Test Data-In
(TDI)
t
TMSH
t
TMSS
t
TDIH
t
TDIS
t
TDOX
t
TDOV
DON’T CARE UNDEFINED
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CY7C1355C
CY7C1357C
Document #: 38-05539 Rev. *E Page 14 of 28
3.3V TAP AC Test Conditions
Input pulse levels ................................................ V
SS
to 3.3V
Input rise and fall times................................................... 1 ns
Input timing reference levels...........................................1.5V
Output reference levels...................................................1.5V
Test load termination supply voltage...............................1.5V
3.3V TAP AC Output Load Equivalent
2.5V TAP AC Test Conditions
Input pulse levels.................................................V
SS
to 2.5V
Input rise and fall time .....................................................1 ns
Input timing reference levels......................................... 1.25V
Output reference levels ................................................ 1.25V
Test load termination supply voltage ............................1.25V
2.5V TAP AC Output Load Equivalent
T
DO
1.5V
20p
F
Z = 50Ω
O
50Ω
T
DO
1.25V
20p
F
Z = 50Ω
O
50Ω
TAP DC Electrical Characteristics And Operating Conditions (0°C < T
A
< +70°C; V
DD
= 3.3V ± 0.165V unless
otherwise noted)
[12]
Parameter Description Conditions Min. Max. Unit
V
OH1
Output HIGH Voltage I
OH
= –4.0 mA, V
DDQ
= 3.3V
I
OH
= –1.0 mA, V
DDQ
= 2.5V
2.4 V
2.0 V
V
OH2
Output HIGH Voltage I
OH
= –100 µA V
DDQ
= 3.3V 2.9 V
V
DDQ
= 2.5V 2.1 V
V
OL1
Output LOW Voltage I
OL
= 8.0 mA V
DDQ
= 3.3V 0.4 V
I
OL
= 8.0 mA V
DDQ
= 2.5V 0.4 V
V
OL2
Output LOW Voltage I
OL
= 100 µA V
DDQ
= 3.3V 0.2 V
V
DDQ
= 2.5V 0.2 V
V
IH
Input HIGH Voltage V
DDQ
= 3.3V 2.0 V
DD
+ 0.3 V
V
DDQ
= 2.5V 1.7 V
DD
+ 0.3 V
V
IL
Input LOW Voltage V
DDQ
= 3.3V –0.5 0.7 V
V
DDQ
= 2.5V –0.3 0.7 V
I
X
Input Load Current GND < V
IN
< V
DDQ
–5 5 µA
Identification Register Definitions
Instruction Field
CY7C1355C
(256Kx36)
CY7C1357C
(512Kx18) Description
Revision Number (31:29) 010 010 Describes the version number
Device Depth (28:24) 01010 01010 Reserved for Internal Use
Device Width (23:18) 001001 001001 Defines memory type and architecture
Cypress Device ID (17:12) 100110 010110 Defines width and density
Cypress JEDEC ID Code (11:1) 00000110100 00000110100 Allows unique identification of SRAM vendor
ID Register Presence Indicator (0) 1 1 Indicates the presence of an ID register
Note:
12.All voltages referenced to V
SS
(GND).
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CY7C1355C
CY7C1357C
Document #: 38-05539 Rev. *E Page 15 of 28
Scan Register Sizes
Register Name Bit Size (x36) Bit Size (x18)
Instruction 3 3
Bypass 1 1
ID 32 32
Boundary Scan Order (119-ball BGA package) 69 69
Boundary Scan Order (165-ball FBGA package) 69 69
Identification Codes
Instruction Code Description
EXTEST 000 Captures I/O ring contents. Places the boundary scan register between TDI and TDO.
Forces all SRAM outputs to High-Z state. This instruction is not 1149.1 compliant.
IDCODE 001 Loads the ID register with the vendor ID code and places the register between TDI and
TDO. This operation does not affect SRAM operations.
SAMPLE Z 010 Captures I/O ring contents. Places the boundary scan register between TDI and TDO.
Forces all SRAM output drivers to a High-Z state.
RESERVED 011 Do Not Use: This instruction is reserved for future use.
SAMPLE/PRELOAD 100 Captures I/O ring contents. Places the boundary scan register between TDI and TDO.
Does not affect SRAM operation. This instruction does not implement 1149.1 preload
function and is therefore not 1149.1 compliant.
RESERVED 101 Do Not Use: This instruction is reserved for future use.
RESERVED 110 Do Not Use: This instruction is reserved for future use.
BYPASS 111 Places the bypass register between TDI and TDO. This operation does not affect SRAM
operations.
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CY7C1357C-133AXIT

Mfr. #:
Buy CY7C1357C-133AXIT
Manufacturer:
Cypress Semiconductor
Description:
IC SRAM 9M PARALLEL 100TQFP
Lifecycle:
New from this manufacturer.
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