CY7C1355C
CY7C1357C
Document #: 38-05539 Rev. *E Page 7 of 28
Pin Definitions
Name I/O Description
A
0
, A
1
, A Input-
Synchronous
Address Inputs used to select one of the address locations. Sampled at the rising edge
of the CLK. A
[1:0]
are fed to the two-bit burst counter.
BW
A
, BW
B
BW
C
, BW
D
Input-
Synchronous
Byte Write Inputs, active LOW. Qualified with WE to conduct Writes to the SRAM. Sampled
on the rising edge of CLK.
WE
Input-
Synchronous
Write Enable Input, active LOW. Sampled on the rising edge of CLK if CEN is active LOW.
This signal must be asserted LOW to initiate a write sequence.
ADV/LD Input-
Synchronous
Advance/Load Input. Used to advance the on-chip address counter or load a new address.
When HIGH (and CEN
is asserted LOW) the internal burst counter is advanced. When LOW,
a new address can be loaded into the device for an access. After being deselected, ADV/LD
should be driven LOW in order to load a new address.
CLK Input-
Clock
Clock Input. Used to capture all synchronous inputs to the device. CLK is qualified with
CEN
. CLK is only recognized if CEN is active LOW.
CE
1
Input-
Synchronous
Chip Enable 1 Input, active LOW. Sampled on the rising edge of CLK. Used in conjunction
with CE
2
, and CE
3
to select/deselect the device.
CE
2
Input-
Synchronous
Chip Enable 2 Input, active HIGH. Sampled on the rising edge of CLK. Used in conjunction
with CE
1
and CE
3
to select/deselect the device.
CE
3
Input-
Synchronous
Chip Enable 3 Input, active LOW. Sampled on the rising edge of CLK. Used in conjunction
with CE
1
and
CE
2
to select/deselect the device.
OE
Input-
Asynchronous
Output Enable, asynchronous input, active LOW. Combined with the synchronous logic
block inside the device to control the direction of the I/O pins. When LOW, the I/O pins are
allowed to behave as outputs. When deasserted HIGH, I/O pins are tri-stated, and act as
input data pins. OE
is masked during the data portion of a write sequence, during the first
clock when emerging from a deselected state, when the device has been deselected.
CEN Input-
Synchronous
Clock Enable Input, active LOW. When asserted LOW the Clock signal is recognized by
the SRAM. When deasserted HIGH the Clock signal is masked. Since deasserting CEN
does not deselect the device, CEN
can be used to extend the previous cycle when required.
ZZ Input-
Asynchronous
ZZ “Sleep” Input. This active HIGH input places the device in a non-time critical “sleep”
condition with data integrity preserved. For normal operation, this pin has to be LOW or left
floating. ZZ pin has an internal pull-down.
DQ
s
I/O-
Synchronous
Bidirectional Data I/O lines. As inputs, they feed into an on-chip data register that is
triggered by the rising edge of CLK. As outputs, they deliver the data contained in the
memory location specified by the addresses presented during the previous
clock rise of the
Read cycle. The direction of the pins is controlled by OE
. When OE is asserted LOW, the
pins behave as outputs. When HIGH, DQ
s
and DQP
X
are placed in a tri-state condition.The
outputs are automatically tri-stated during the data portion of a Write sequence, during the
first clock when emerging from a deselected state, and when the device is deselected,
regardless of the state of OE
.
DQP
X
I/O-
Synchronous
Bidirectional Data Parity I/O Lines. Functionally, these signals are identical to DQ
s
.
During
Write sequences, DQP
X
is controlled by BW
X
correspondingly.
MODE Input Strap Pin Mode Input. Selects the burst order of the device. When tied to Gnd selects linear burst
sequence. When tied to V
DD
or left floating selects interleaved burst sequence.
V
DD
Power Supply Power supply inputs to the core of the device.
V
DDQ
I/O Power
Supply
Power supply for the I/O circuitry.
V
SS
Ground Ground for the device.
TDO JTAG serial output
Synchronous
Serial data-out to the JTAG circuit. Delivers data on the negative edge of TCK. If the JTAG
feature is not being utilized, this pin should be left unconnected. This pin is not available on
TQFP packages.
TDI JTAG serial input
Synchronous
Serial data-In to the JTAG circuit. Sampled on the rising edge of TCK. If the JTAG feature
is not being utilized, this pin can be left floating or connected to V
DD
through a pull up resistor.
This pin is not available on TQFP packages.
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CY7C1355C
CY7C1357C
Document #: 38-05539 Rev. *E Page 8 of 28
Functional Overview
The CY7C1355C/CY7C1357C is a synchronous flow-through
burst SRAM designed specifically to eliminate wait states
during Write-Read transitions. All synchronous inputs pass
through input registers controlled by the rising edge of the
clock. The clock signal is qualified with the Clock Enable input
signal (CEN
). If CEN is HIGH, the clock signal is not recog-
nized and all internal states are maintained. All synchronous
operations are qualified with CEN
. Maximum access delay
from the clock rise (t
CDV
) is 6.5 ns (133-MHz device).
Accesses can be initiated by asserting all three Chip Enables
(CE
1
, CE
2
, CE
3
) active at the rising edge of the clock. If Clock
Enable (CEN
) is active LOW and ADV/LD is asserted LOW,
the address presented to the device will be latched. The
access can either be a Read or Write operation, depending on
the status of the Write Enable (WE
). BW
X
can be used to
conduct Byte Write operations.
Write operations are qualified by the Write Enable (WE
). All
writes are simplified with on-chip synchronous self-timed Write
circuitry.
Three synchronous Chip Enables (CE
1
, CE
2
, CE
3
) and an
asynchronous Output Enable (OE
) simplify depth expansion.
All operations (Reads, Writes, and Deselects) are pipelined.
ADV/LD
should be driven LOW once the device has been
deselected in order to load a new address for the next
operation.
Single Read Accesses
A read access is initiated when the following conditions are
satisfied at clock rise: (1) CEN
is asserted LOW, (2) CE
1
, CE
2
,
and CE
3
are ALL asserted active, (3) the Write Enable input
signal WE
is deasserted HIGH, and 4) ADV/LD is asserted
LOW. The address presented to the address inputs is latched
into the address register and presented to the memory array
and control logic. The control logic determines that a read
access is in progress and allows the requested data to
propagate to the output buffers. The data is available within 7.5
ns (133-MHz device) provided OE
is active LOW. After the first
clock of the read access, the output buffers are controlled by
OE and the internal control logic. OE must be driven LOW in
order for the device to drive out the requested data. On the
subsequent clock, another operation (Read/Write/Deselect)
can be initiated. When the SRAM is deselected at clock rise
by one of the chip enable signals, its output will be tri-stated
immediately.
Burst Read Accesses
The CY7C1355C/CY7C1357C has an on-chip burst counter
that allows the user the ability to supply a single address and
conduct up to four Reads without reasserting the address
inputs. ADV/LD
must be driven LOW in order to load a new
address into the SRAM, as described in the Single Read
Access section above. The sequence of the burst counter is
determined by the MODE input signal. A LOW input on MODE
selects a linear burst mode, a HIGH selects an interleaved
burst sequence. Both burst counters use A0 and A1 in the
burst sequence, and will wrap around when incremented suffi-
ciently. A HIGH input on ADV/LD
will increment the internal
burst counter regardless of the state of chip enable inputs or
WE. WE is latched at the beginning of a burst cycle. Therefore,
the type of access (Read or Write) is maintained throughout
the burst sequence.
Single Write Accesses
Write access are initiated when the following conditions are
satisfied at clock rise: (1) CEN
is asserted LOW, (2) CE
1
, CE
2
,
and CE
3
are ALL asserted active, and (3) the Write signal WE
is asserted LOW. The address presented to the address bus
is loaded into the address register. The write signals are
latched into the Control Logic block. The data lines are
automatically tri-stated regardless of the state of the OE
input
signal. This allows the external logic to present the data on
DQs and DQP
X
.
On the next clock rise the data presented to DQs and DQP
X
(or a subset for byte write operations, see Truth Table for
details) inputs is latched into the device and the write is
complete. Additional accesses (Read/Write/Deselect) can be
initiated on this cycle.
The data written during the Write operation is controlled by
BW
X
signals. The CY7C1355C/CY7C1357C provides byte
write capability that is described in the Truth Table. Asserting
the Write Enable input (WE) with the selected Byte Write
Select input will selectively write to only the desired bytes.
Bytes not selected during a byte write operation will remain
unaltered. A synchronous self-timed Write mechanism has
been provided to simplify the Write operations. Byte Write
capability has been included in order to greatly simplify
Read/Modify/Write sequences, which can be reduced to
simple Byte Write operations.
Because the CY7C1355C/CY7C1357C is a common I/O
device, data should not be driven into the device while the
outputs are active. The Output Enable (OE
) can be deasserted
HIGH before presenting data to the DQs and DQP
X
inputs.
Doing so will tri-state the output drivers. As a safety
TMS JTAG serial input
Synchronous
Serial data-In to the JTAG circuit. Sampled on the rising edge of TCK. If the JTAG feature
is not being utilized, this pin can be disconnected or connected to V
DD
. This pin is not
available on TQFP packages.
TCK JTAG
Clock
Clock input to the JTAG circuitry. If the JTAG feature is not being utilized, this pin must
be connected to V
SS
. This pin is not available on TQFP packages.
NC No Connects. Not internally connected to the die. 18 Mbit, 36 Mbit, 72 Mbit, 144 Mbit, 288
Mbit, 576 Mbit and 1G are address expansion pins and are not internally connected to the
die.
V
SS
/DNU Ground/DNU This pin can be connected to Ground or should be left floating.
Pin Definitions (continued)
Name I/O Description
[+] Feedback
CY7C1355C
CY7C1357C
Document #: 38-05539 Rev. *E Page 9 of 28
precaution, DQs and DQP
X
are automatically tri-stated during
the data portion of a write cycle, regardless of the state of OE
.
Burst Write Accesses
The CY7C1355C/CY7C1357C has an on-chip burst counter
that allows the user the ability to supply a single address and
conduct up to four Write operations without reasserting the
address inputs. ADV/LD
must be driven LOW in order to load
the initial address, as described in the Single Write Access
section above. When ADV/LD is driven HIGH on the subse-
quent clock rise, the Chip Enables (CE
1
, CE
2
, and CE
3
) and
WE
inputs are ignored and the burst counter is incremented.
The correct BW
X
inputs must be driven in each cycle of the
burst write, in order to write the correct bytes of data.
Sleep Mode
The ZZ input pin is an asynchronous input. Asserting ZZ
places the SRAM in a power conservation “sleep” mode. Two
clock cycles are required to enter into or exit from this “sleep”
mode. While in this mode, data integrity is guaranteed.
Accesses pending when entering the “sleep” mode are not
considered valid nor is the completion of the operation
guaranteed. The device must be deselected prior to entering
the “sleep” mode. CE
1
, CE
2
, and CE
3
, must remain inactive
for the duration of t
ZZREC
after the ZZ input returns LOW.
.
.
Interleaved Burst Address Table
(MODE = Floating or VDD)
First
Address
A1: A0
Second
Address
A1: A0
Third
Address
A1: A0
Fourth
Address
A1: A0
00 01 10 11
01 00 11 10
10 11 00 01
11 10 01 00
Linear Burst Address Table (MODE = GND)
First
Address
A1: A0
Second
Address
A1: A0
Third
Address
A1: A0
Fourth
Address
A1: A0
00 01 10 11
01 10 11 00
10 11 00 01
11 00 01 10
ZZ Mode Electrical Characteristics
Parameter Description Test Conditions Min. Max. Unit
I
DDZZ
Sleep mode standby current ZZ > V
DD
– 0.2V 50 mA
t
ZZS
Device operation to ZZ ZZ > V
DD
– 0.2V 2t
CYC
ns
t
ZZREC
ZZ recovery time ZZ < 0.2V 2t
CYC
ns
t
ZZI
ZZ active to sleep current This parameter is sampled 2t
CYC
ns
t
RZZI
ZZ Inactive to exit sleep current This parameter is sampled 0 ns
Truth Table
[2, 3, 4, 5, 6, 7, 8]
Operation
Address
Used CE
1
CE
2
CE
3
ZZ ADV/LD WE BW
X
OE CEN CLK DQ
Deselect Cycle None H X X L L X X X L L->H Tri-State
Deselect Cycle None X X H L L X X X L L->H Tri-State
Deselect Cycle None X L X L L X X X L L->H Tri-State
Continue Deselect Cycle None X X X L H X X X L L->H Tri-State
READ Cycle (Begin Burst) External L H L L L H X L L L->H Data Out (Q)
READ Cycle (Continue Burst) Next X X X L H X X L L L->H Data Out (Q)
NOP/DUMMY READ (Begin Burst) External L H L L L H X H L L->H Tri-State
DUMMY READ (Continue Burst) Next X X X L H X X H L L->H Tri-State
WRITE Cycle (Begin Burst) External L H L L L L L X L L->H Data In (D)
WRITE Cycle (Continue Burst) Next X X X L H X L X L L->H Data In (D)
Notes:
2. X = “Don't Care.” H = Logic HIGH, L = Logic LOW. BW
x = L signifies at least one Byte Write Select is active, BWx = Valid signifies that the desired Byte Write
Selects are asserted, see Truth Table for details.
3. Write is defined by BW
X
, and WE. See Truth Table for Read/Write.
4. When a Write cycle is detected, all I/Os are tri-stated, even during Byte Writes.
5. The DQs and DQP
X
pins are controlled by the current cycle and the OE signal. OE is asynchronous and is not sampled with the clock.
6. CEN
= H, inserts wait states.
7. Device will power-up deselected and the I/Os in a tri-state condition, regardless of OE
.
8. OE
is asynchronous and is not sampled with the clock rise. It is masked internally during Write cycles. During a Read cycle DQs and DQP
X
= Tri-state when OE
is inactive or when the device is deselected, and DQs and DQP
X
= data when OE is active.
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CY7C1357C-133AXIT

Mfr. #:
Manufacturer:
Cypress Semiconductor
Description:
IC SRAM 9M PARALLEL 100TQFP
Lifecycle:
New from this manufacturer.
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