NCP336, NCP337
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3
Table 2. MAXIMUM RATINGS
Rating Symbol Value Unit
IN, OUT, EN, Pins: (Note 1) V
EN,
V
IN,
V
OUT
−0.3 to + 7.0 V
From IN to OUT Pins: Input/Output (Note 1) V
IN,
V
OUT
0 to + 7.0 V
Maximum Junction Temperature T
J
−40 to + 125 °C
Storage Temperature Range T
STG
−40 to + 150 °C
Moisture Sensitivity (Note 2) MSL Level 1
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
Table 3. OPERATING CONDITIONS
Symbol Parameter Conditions Min Typ Max Unit
V
IN
Operational Power Supply 1.2 5.5 V
V
EN
Enable Voltage 0 5.5
T
A
Ambient Temperature Range −40 25 +85 °C
T
J
Junction Temperature Range −40 25 +125 °C
C
IN
Decoupling input capacitor 1
mF
C
OUT
Decoupling output capacitor 1
mF
R
q
JA
Thermal Resistance Junction to Air WLCSP package (Note 3) 100 °C/W
I
OUT
Maximum DC current 3 A
P
D
Power Dissipation Rating (Note 4)
T
A
≤ 25°C WLCSP package 0.66 W
T
A
= 85°C WLCSP package 0.26 W
1. According to JEDEC standard JESD22−A108.
2. Moisture Sensitivity Level (MSL): 1 per IPC/JEDEC standard: J−STD−020.
3. The R
q
JA
is dependent of the PCB heat dissipation and thermal via.
4. The maximum power dissipation (
PD
) is given by the following formula:
P
D
+
T
JMAX
* T
A
R
qJA
