NCP336, NCP337
http://onsemi.com
9
PACKAGE DIMENSIONS
WLCSP6, 1.00x1.50
CASE 567FH
ISSUE O
SEATING
PLANE
0.05 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
2X
DIM
A
MIN MAX
0.54
MILLIMETERS
A1
D 1.00 BSC
E
b 0.29 0.34
e 0.50 BSC
0.63
D
E
A
B
PIN A1
REFERENCE
eD
A0.05 BC
0.03
C
0.05 C
6X
b
123
C
B
A
0.05 C
A
A1
A2
C
0.22 0.28
1.50 BSC
0.50
0.25
6X
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
0.05 C
2X
TOP VIEW
SIDE VIEW
BOTTOM VIEW
NOTE 3
eE
A2 0.33 REF
RECOMMENDED
A1
PACKAGE
OUTLINE
eD/2
PITCH
0.50
PITCH
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