TCP−4127UB
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5
ASSEMBLY CONSIDERATIONS AND REFLOW PROFILE
The following assembly considerations should be observed:
Cleanliness
These chips should be handled in a clean environment.
Electro-static Sensitivity
ON Semiconductor’s PTICs are ESD Class 1B sensitive.
The proper ESD handling procedures should be used.
Mounting
The WLCSP PTIC is fabricated for Flip Chip solder
mounting. Connectivity to the RF and Bias terminations on
the PTIC die is established through SAC305 solder balls
with 65 mm nominal height (45 mm to 85 mm height
variation). The PTIC die is RoHS-compliant and compatible
with lead-free soldering profile.
Molding
The PTIC die is compatible for over-molding or
under-fill.
Figure 6. Reflow Profile
ORIENTATION OF THE PTIC FOR OPTIMUM LOSSES
When configuring the PTIC in your specific circuit
design, at least one of the RF terminals must be connected
to DC ground. If minimum transition times are required, DC
ground on both RF terminals is recommended. To minimize
losses, the PTIC should be oriented such that RF2
is at the
lower RF impedance of the two RF nodes. A shunt PTIC, for
example, should have RF2
connected to RF ground.
Figure 7. PTIC Orientation Functional Block
Diagram
Bias
RF ANT
RF1
(PTIC Pad)
RF2
(PTIC Pad)
