TCP−4127UB
www.onsemi.com
7
PACKAGE DIMENSIONS
WLCSP4, 0.626x0.609
CASE 567LN
ISSUE O
SEATING
PLANE
0.05 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
4. BACKSIDE TAPE (OPTIONAL) APPLIED TO
IMPROVE PIN 1 MARKING.
2X
DIM
A
MIN MAX
0.275
MILLIMETERS
A1
D 0.626 BSC
E
b1 0.044 0.094
0.345
E
D
A B
PIN A1
REFERENCE
0.05 C
B
A
0.06 C
A1
C
0.045 0.085
0.609 BSC
0.05 C
2X
TOP VIEW
SIDE VIEW
BOTTOM VIEW
NOTE 3
e
12
b 0.079 0.129
A
DETAIL A
e 0.420 BSC
e1 0.400 BSC
DETAIL A
A0.05 BC
0.03
C
4X
b
e1
4X
b1
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
RECOMMENDED
PACKAGE
OUTLINE
A1
0.13
4X
0.55
0.55
0.15
4X
DETAIL C
DETAIL C
NOTE 4
TAPE
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