Darlington Transistors for Audio Amplifiers
STD01N and
STD01P
6
Sanken Electric Co., Ltd.
3-6-3 Kitano, Niiza-shi, Saitama-ken
352-8666, Japan
Phone:+81-48-472-1111
http://www.sanken-ele.co.jp
WARNING — These devices are designed to be operated at lethal voltages and energy levels. Circuit designs
that embody these components must conform with applicable safety requirements. Pre cau tions must be
taken to prevent accidental contact with power-line potentials. Do not connect ground ed test equipment.
The use of an isolation transformer is recommended during circuit development and breadboarding.
Because reliability can be affected adversely by improper storage environments and handling methods, please
observe the following cautions.
Cautions for Storage
• Ensure that storage conditions comply with the standard temperature (5°C to 35°C) and the standard relative
humidity (around 40 to 75%); avoid storage locations that experience extreme changes in temperature or
humidity.
• Avoid locations where dust or harmful gases are present and avoid direct sunlight.
• Reinspect for rust in leads and solderability of products that have been stored for a long time.
Cautions for Testing and Handling
When tests are carried out during inspection testing and other standard test periods, protect the products from
power surges from the testing device, shorts between adjacent products, and shorts to the heatsink.
Remarks About Using Silicone Grease with a Heatsink
• When silicone grease is used in mounting this product on a heatsink, it shall be applied evenly and thinly. If more
silicone grease than required is applied, it may produce stress.
• Volatile-type silicone greases may produce cracks after long periods of time, resulting in reduced heat radiation
effect. Silicone grease with low consistency (hard grease) may cause cracks in the mold resin when screwing the
product to a heatsink.
• Our recommended silicone greases for heat radiation purposes, which will not cause any adverse effect on the
product life, are indicated below:
Type Suppliers
G746 Shin-Etsu Chemical Co., Ltd.
YG6260 Toshiba Silicone Co., Ltd.
SC102 Dow Corning Toray Silicone Co., Ltd.
Heatsink Mounting Method
• Torque When Tightening Mounting Screws. Thermal resistance increases when tightening torque is low, and radiation
effects are decreased. When the torque is too high, the screw can strip, the heatsink can be deformed, and distortion
can arise in the product frame. To avoid these problems, observe the recommended tightening torques for this product
package type, TO-3P (MT-100): 0.686 to 0.882 N•m (7 to 9 kgf•cm).
• Diameter of Heatsink Hole: < 4 mm. The defl ection of the press mold when making the hole may cause the case material
to crack at the joint with the heatsink. Please pay special attention for this effect.
Soldering
• When soldering the products, please be sure to minimize the working time, within the following limits:
260±5°C 10 s
350±5°C 3 s
• Soldering iron should be at a distance of at least 1.5 mm from the body of the products
Electrostatic Discharge
• When handling the products, operator must be grounded. Grounded wrist straps worn should have at least 1 MΩ
of resistance to ground to prevent shock hazard.
• Workbenches where the products are handled should be grounded and be provided with conductive table and
floor mats.
• When using measuring equipment such as a curve tracer, the equipment should be grounded.
• When soldering the products, the head of soldering irons or the solder bath must be grounded in other to prevent
leak voltages generated by them from being applied to the products.
• The products should always be stored and transported in our shipping containers or conductive containers, or be
wrapped in aluminum foil.
