WM8761 Production Data
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PD, Rev 4.6, October 2011
19
APPLICATIONS INFORMATION
RECOMMENDED EXTERNAL COMPONENTS
VDD
GND
CAP
C
6
C
5
AGND
8
7
Hardware Control
WM8761
Notes:
1. C2, C5 should be positioned as close to the WM8761 as possible.
2. Capacitor types should be carefully chosen. Capacitors with very low ESR are
recommended for optimum performance.
3. C3 and C4 not required if using the recommended low pass filter in Figure 20.
C
2
VDD
C
1
13
FORMAT
12
DEEMPH
VOUTR
9
C
3
VOUTL
C
4
AC-Coupled
VOUTR/L
to External LPF
10
MUTE
6
14
MCLK
3
BCKIN
2
DIN
Audio Serial Data I/F
AGND
1
LRCIN
+ +
5
+
+
Figure 22 External Component Diagram
RECOMMENDED EXTERNAL COMPONENTS VALUES
COMPONENT
REFERENCE
SUGGESTED
VALUE
DESCRIPTION
C1 10F
De-coupling for VDD
C2 0.1F
De-coupling for VDD
C3 and C4 10F
Output AC coupling caps to remove midrail DC level from outputs
C5 0.1F
Reference de-coupling capacitors for CAP pin
C6 10F
Table 7 External Components Description
WM8761 Production Data
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PD, Rev 4.6, October 2011
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RECOMMENDED ANALOGUE LOW PASS FILTER
+
_
+
+VS
-VS
10uF
51
7.5K
680pF
1.8k
47k
4.7k
4.7k
1.0nF
Figure 23 Recommended 2
nd
Order Low Pass Filter
An external low pass filter is recommended (see Figure 20) if the device is driving a wideband
amplifier. In some applications, a passive RC filter may be adequate.
PCB LAYOUT RECOMMENDATIONS
Care should be taken in the layout of the PCB that the WM8761 is to be mounted to. The
following notes will help in this respect:
1. The VDD supply to the device should be as noise free as possible. This can be
accomplished to a large degree with a 10uF bulk capacitor placed locally to the device and a
0.1uF high frequency decoupling capacitor placed as close to the VDD pin as possible. It is
best to place the 0.1uF capacitor directly between the VDD and GND pins of the device on
the same layer to minimize track inductance and thus improve device decoupling
effectiveness.
2. The CAP pin should be as noise free as possible. This pin provides the decoupling for
the on chip reference circuits and thus any noise present on this pin will be directly coupled
to the device outputs. In a similar manner to the VDD decoupling described in 1. above, this
pin should be decoupled with a 10uF bulk capacitor local to the device and a 0.1uF capacitor
as close to the CAP pin as possible.
3. Separate analogue and digital track routing from each other. The device is split into
analogue (pins 5 – 9) and digital (pins 1 – 4 & pins 10 – 14) sections that allow the routing of
these signals to be easily separated. By physically separating analogue and digital signals,
crosstalk from the PCB can be minimized.
4. Use an unbroken solid GND plane. To achieve best performance from the device, it is
advisable to have either a GND plane layer on a multilayer PCB or to dedicate one side of a
2 layer PCB to be a GND plane. For double sided implementations it is best to route as
many signals as possible on the device mounted side of the board, with the opposite side
acting as a GND plane. The use of a GND plane greatly reduces any electrical emissions
from the PCB and minimizes crosstalk between signals.
An evaluation board is available for the WM8761 that demonstrates the above techniques and the
excellent performance achievable from the device. This can be ordered or the User manual
downloaded from the Wolfson web site at www.wolfsonmicro.com
WM8761 Production Data
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PD, Rev 4.6, October 2011
21
PACKAGE DRAWING
NOTES:
A. ALL LINEAR DIMENSIONS ARE IN MILLIMETERS (INCHES).
B. THIS DRAWING IS SUBJECT TO CHANGE WITHOUT NOTICE.
C. BODY DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSION, NOT TO EXCEED 0.25MM (0.010IN).
D. MEETS JEDEC.95 MS-012, VARIATION = AB. REFER TO THIS SPECIFICATION FOR FURTHER DETAILS.
Symbols
Dimensions
(MM)
Dimensions
(Inches)
MIN MAX MIN MAX
A
1.35 1.75 0.0532 0.0688
A1
0.10 0.25 0.0040 0.0098
B
0.33 0.51 0.0130 0.0200
C
0.19 0.25 0.0075 0.0098
D
8.55 8.75 0.3367 0.3444
E
3.80 4.00 0.1497 0.1574
e
1.27 BSC 0.05 BSC
H
5.80 6.20 0.2284 0.2440
h
0.25 0.50 0.0099 0.0196
L
0.40 1.27 0.0160 0.0500
0
o
8
o
0
o
8
o
REF:
JEDEC.95, MS-012
0.10 (0.004)
SEATING PLANE
DM001.C
E
D: 14 PIN SOIC 3.9mm Wide Body
H
B
D
A
A1
C
h x 45
o
-C-
8
71
14
L
e

WM8761CBGED/R

Mfr. #:
Manufacturer:
Cirrus Logic
Description:
Audio D/A Converter ICs Stereo DAC
Lifecycle:
New from this manufacturer.
Delivery:
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