13
LTC1649
resume normal operation. The CP
OUT
pin remains regu-
lated at 5V in shutdown, and can be used as a keep-alive
supply for external circuitry if desired. Note that any
current drawn from the CP
OUT
pin adds to the quiescent
current in shutdown, and subtracts from the current
available to drive the external MOSFETs if the load remains
connected while the LTC1649 is active.
External Clock Synchronization
The LTC1649 SHDN pin can double as an external clock
input for applications that require a synchronized clock or
a faster switching speed. The SHDN pin terminates the
internal sawtooth wave and resets the oscillator immedi-
ately when it goes low, but waits 50µs before shutting
down the rest of the internal circuitry. A clock signal
applied directly to the SHDN pin will force the LTC1649
internal oscillator to lock to its frequency as long as the
external clock runs faster than the internal oscillator
frequency. The LTC1649 can be synchronized to frequen-
cies between 250kHz and about 350kHz.
Frequencies above 350kHz can cause erratic current limit
operation and are not recommended.
Setting the Output Voltage
The LTC1649 feedback loop senses the output voltage at
the FB pin. The loop regulates FB to 1.265V; to set the
output voltage, FB should be connected to the output node
through a resistor divider, set up so the voltage at FB is
1.265V when the output is at the desired voltage (see
Figure 8). The upper end of R1 should be connected to the
output voltage as close to the load as possible, to minimize
errors caused by resistance in the output leads. The
bottom of R2 should be connected to the high power
ground node, at the GND pin of the LTC1649.
R1 and R2 should be chosen so that:
V
OUT
= V
REF
=
R
1
+ R
2
R2
(1.265V)
R
1
+ R
2
R2
An easy way to simplify the math is to choose
R2 = 12.65k. This simplifies the equation to:
V
OUT
=
R
1
10k
+ 1.265V
A typical 2.5V output application might use R1 = 12.35k,
R2 = 12.65k. The nearest standard 1% values are
R1 = 12.4k, R2 = 12.7k, which gives an output voltage
of 2.5001V—pretty close to 2.5V.
Note that using 1% resistors can cause as much as 1%
error in the output voltage in a typical LTC1649 applica-
tion—a significant fraction of the total output error. 0.1%
or 0.25% feedback resistors are recommended for appli-
cations which require the output voltage to be controlled
to better than 3%.
APPLICATIONS INFORMATION
WUU
U
LTC1649
GND
FB
1659 F08
R1
V
OUT
R2
C
OUT
+
Figure 8. Resistor Divider at FB Pin
LAYOUT CONSIDERATIONS
Grounding
Proper grounding is critical for the LTC1649 to obtain
specified output regulation. Extremely high peak currents
(as high as several amps) can flow between the bypass
capacitors and the PV
CC1
, PV
CC2
and GND pins. These
currents can generate significant voltage differences be-
tween two points that are nominally both “ground.” As a
general rule, power and signal grounds should be totally
separated on the layout, and should be brought together
at only one point, right at the LTC1649 GND pin. This helps
minimize internal ground disturbances in the LTC1649,
while preventing excessive current flow from disrupting
the operation of the circuits connected to GND. The high
power GND node should be as compact and low imped-
ance as possible, with the negative terminals of the input
14
LTC1649
APPLICATIONS INFORMATION
WUU
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Figure 9. Typical Schematic Showing Layout Considerations
1649 F09
Q1
PV
CC1
PV
CC2
V
CC
CP
OUT
C
COMP
C
+
SS
SHDN
V
IN
GND
R
C
22
C
C
C
SS
G1
I
FB
G2
FB
I
MAX
LTC1649
SHDN
+
1µF
1µF
10µF
+
10µF
C1
Q2
0.1µF
R
IMAX
1k
L1
+
C
IN
V
IN
+
C
OUT
V
OUT
R2
R1
D
CP
and output capacitors, the source of Q2, the LTC1649 GND
pin, the output return and the input supply return all
clustered at one point. Figure 9 is a modified schematic
showing the common connections in a proper layout. Note
that at 10A current levels or above, current density in the
PC board itself can become a concern; traces carrying high
currents should be as wide as possible.
Power Component Hook-Up/Heat Sinking
As current levels rise much above 1A, the power compo-
nents supporting the LTC1649 start to become physically
large (relative to the LTC1649, at least) and can require
special mounting considerations. Input and output ca-
pacitors need to carry high peak currents and must have
low ESR; this mandates that the leads be clipped as short
as possible and PC traces be kept wide and short. The
power inductor will generally be the most massive single
component on the board; it can require a mechanical hold-
down in addition to the solder on its leads, especially if it
is a surface mount type.
The power MOSFETs used require some care to ensure
proper operation and reliability. Depending on the current
levels and required efficiency, the MOSFETs chosen may
be as large as TO-220s or as small as SO-8s. High
efficiency circuits may be able to avoid heat sinking the
power devices, especially with TO-220 type MOSFETs. As
an example, a 90% efficient converter working at a steady
2.5V/10A output will dissipate only (25W/90%)10% =
2.8W. The power MOSFETs generally account for the
majority of the power lost in the converter; even assuming
that they consume 100% of the power used by the
converter, that’s only 2.8W spread over two or three
devices. A typical SO-8 MOSFET with a R
ON
suitable to
provide 90% efficiency in this design can commonly
dissipate 2W when soldered to an appropriately sized
piece of copper trace on a PC board. Slightly less efficient
or higher output current designs can often get by with
standing a TO-220 MOSFET straight up in an area with
some airflow; such an arrangement can dissipate as much
as 3W without a heat sink. Designs which must work in
high ambient temperatures or which will be routinely
overloaded will generally fare best with a heat sink.
15
LTC1649
0.016 – 0.050
(0.406 – 1.270)
0.010 – 0.020
(0.254 – 0.508)
× 45°
0
°
– 8
°
TYP
0.008 – 0.010
(0.203 – 0.254)
1
2
3
4
5
6
7
8
0.150 – 0.157**
(3.810 – 3.988)
16
15
14
13
0.386 – 0.394*
(9.804 – 10.008)
0.228 – 0.244
(5.791 – 6.197)
12
11
10
9
S16 1098
0.053 – 0.069
(1.346 – 1.752)
0.014 – 0.019
(0.355 – 0.483)
TYP
0.004 – 0.010
(0.101 – 0.254)
0.050
(1.270)
BSC
DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE
DIMENSION DOES NOT INCLUDE INTERLEAD FLASH. INTERLEAD
FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE
*
**
PACKAGE DESCRIPTIO
U
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
S Package
16-Lead Plastic Small Outline (Narrow .150 Inch)
(Reference LTC DWG # 05-08-1610)

LTC1649CS#PBF

Mfr. #:
Manufacturer:
Analog Devices / Linear Technology
Description:
Switching Voltage Regulators 3.3V In Hi Pwr Buck Sw Reg Cntr
Lifecycle:
New from this manufacturer.
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