Data Sheet ADG708/ADG709
APPLICATIONS INFORMATION
POWER SUPPLY SEQUENCING
When using CMOS devices, take care to ensure correct power
supply sequencing. Incorrect power supply sequencing can
result in the device being subjected to stresses beyond the
maximum ratings listed in Figure 4.
Always apply digital and analog inputs after power supplies and
ground. For single-supply operation, tie V
SS
to GND as close to
the device as possible.
Rev. E | Page 19 of 20
ADG708/ADG709 Data Sheet
OUTLINE DIMENSIONS
16
9
81
PIN 1
SEATING
PLANE
4.50
4.40
4.30
6.40
BSC
5.10
5.00
4.90
0.65
BSC
0.15
0.05
1.20
MAX
0.20
0.09
0.75
0.60
0.45
0.30
0.19
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MO-153-AB
Figure 31. 16-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-16)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1, 2
Temperature Range Package Description Package Option
ADG708BRU −40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG708BRU-REEL −40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG708BRU-REEL7 −40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG708BRUZ −40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG708BRUZ-REEL −40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG708BRUZ-REEL7 −40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG708CRU −40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG708CRUZ −40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG708CRUZ-REEL −40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG708CRUZ-REEL7 −40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADW54008-0REEL7 −40°C to +105°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG709BRU −40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG709BRU-REEL7 −40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG709BRUZ −40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG709BRUZ-REEL −40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG709BRUZ-REEL7 −40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG709CRUZ −40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG709CRUZ-REEL7 −40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
1
Z = RoHS Compliant Part.
2
W = Qualified for Automotive Applications.
AUTOMOTIVE PRODUCTS
The ADW54008 models are available with controlled manufacturing to support the quality and reliability requirements of automotive
applications. Note that these automotive models may have specifications that differ from the commercial models; therefore, designers
should review the Specifications section of this data sheet carefully. Only the automotive grade products shown are available for use in
automotive applications. Contact your local Analog Devices account representative for specific product ordering information and to
obtain the specific Automotive Reliability reports for these models.
©20002014 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D00041-0-9/14(E)
Rev. E | Page 20 of 20

ADG709BRUZ-REEL7

Mfr. #:
Manufacturer:
Analog Devices Inc.
Description:
Multiplexer Switch ICs 4:1 200MHz 4 Ohm CMOS
Lifecycle:
New from this manufacturer.
Delivery:
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