NXP Semiconductors
BUK7880-55A
N-channel TrenchMOS standard level FET
BUK7880-55A All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved
Product data sheet 19 June 2015 3 / 12
Symbol Parameter Conditions Min Max Unit
T
stg
storage temperature -55 150 °C
T
j
junction temperature -55 150 °C
Source-drain diode
I
S
source current T
sp
= 25 °C - 7 A
I
SM
peak source current pulsed; t
p
≤ 10 µs; T
sp
= 25 °C - 30 A
Avalanche ruggedness
E
DS(AL)S
non-repetitive drain-source
avalanche energy
I
D
= 7 A; V
sup
≤ 55 V; R
GS
= 50 Ω;
V
GS
= 10 V; T
j(init)
= 25 °C; unclamped
- 53 mJ
E
DS(AL)R
repetitive drain-source
avalanche energy
Fig. 4 [1][2][3][4]- - J
[1] Maximum value not quoted. Repetitive rating defined in avalanche rating figure.
[2] Single-pulse avalanche rating limited by maximum junction temperature of 150 °C.
[3] Repetitive avalanche rating limited by an average junction temperature of 150 °C
[4] Refer to application note AN10273 for further information.
T
sp
(°C)
0 20015050 100
03aa17
40
80
120
P
der
(%)
0
Fig. 1. Normalized total power dissipation as a
function of solder point temperature
003aab532
0
2
4
6
8
0 50 100 150
T
sp
(
°
C)
I
D
(A)
Fig. 2. Continuous drain current as a function of solder
point temperature