MAX9996ETP+TD

MAX9996
Exposed Pad RF/Thermal Considerations
The exposed paddle (EP) of the MAX9996’s 20-pin thin
QFN-EP package provides a low thermal-resistance
path to the die. It is important that the PC board on
which the MAX9996 is mounted be designed to con-
duct heat from the EP. In addition, provide the EP with a
low-inductance path to electrical ground. The EP MUST
be soldered to a ground plane on the PC board, either
directly or through an array of plated via holes.
Chip Information
TRANSISTOR COUNT: 1414
PROCESS: SiGe BiCMOS
SiGe High-Linearity, 1700MHz to 2200MHz
Downconversion Mixer with LO Buffer/Switch
10 ______________________________________________________________________________________
COMPONENT VALUE DESCRIPTION
L1, L2 470nH Wire-wound high-Q inductors (0805)
L3 10nH Wire-wound high-Q inductor (0603)
C1 4pF Microwave capacitor (0603)
C4 10pF Microwave capacitor (0603)
C2, C6, C7, C8, C10, C12 22pF Microwave capacitors (0603)
C3, C5, C9, C11 0.01µF Microwave capacitors (0603)
C13, C14 150pF Microwave capacitors (0603)
C15 150pF Microwave capacitor (0402)
R1 806Ω±1% resistor (0603)
R2 549Ω±1% resistor (0603)
R3 7.15Ω±1% resistor (1206)
T1 4:1 balun IF balun
U1 MAX9996 Maxim IC
Table 1. Component List Referring to the Typical Application Circuit
Pin Configuration/Functional Diagram
MAX9996
1
2
3
4
5
15
14
13
12
11
6
7
8910
20
19
18
17
16
GND
LOSEL
LOBIAS
TAP
RF
V
CC
V
CC
V
CC
V
CC
GND
GND
LO2
GND
LEXT
IFBIAS
IF-
IF+
GND
LO1
GND
MAX9996
SiGe High-Linearity, 1700MHz to 2200MHz
Downconversion Mixer with LO Buffer/Switch
______________________________________________________________________________________ 11
Typical Application Circuit
MAX9996
1
2
3
4
5
15
14
13
12
11
6
7
8
9
10
20
19
18
17 16
GND
C4
C11
C6 C7
R2
C3
C14
C13
C15
C5
C1
RF
INPUT
C10
C12
LO1
INPUT
LO2
INPUT
IF
OUTPUT
LOSEL
LOBIAS
C2
C8
C9
TAP
RF
V
CC
V
CC
V
CC
LOSEL
INPUT
V
CC
V
CC
V
CC
V
CC
R1
R3
L2
L1
L3
1
3
2
6
4
T1
V
CC
V
CC
GND
GND
LO2
GND
LEXT
IFBIAS
IF-
IF+
GND
LO1
GND
MAX9996
SiGe High-Linearity, 1700MHz to 2200MHz
Downconversion Mixer with LO Buffer/Switch
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
12 ____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600
© 2004 Maxim Integrated Products Printed USA is a registered trademark of Maxim Integrated Products, Inc.
Package Information
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information
go to www.maxim-ic.com/packages
.)
QFN THIN.EPS
D2
(ND-1) X e
e
D
C
PIN # 1
I.D.
(NE-1) X e
E/2
E
0.08 C
0.10 C
A
A1
A3
DETAIL A
E2/2
E2
0.10 M C A B
PIN # 1 I.D.
b
0.35x45
D/2
D2/2
L
C
L
C
e e
L
CC
L
k
LL
DETAIL B
L
L1
e
XXXXX
MARKING
G
1
2
21-0140
PACKAGE OUTLINE,
16, 20, 28, 32L THIN QFN, 5x5x0.8mm
-DRAWING NOT TO SCALE-
L
COMMON DIMENSIONS
3.353.15
T2855-1 3.25 3.353.15 3.25
MAX.
3.20
EXPOSED PAD VARIATIONS
3.00T2055-2 3.10
D2
NOM.MIN.
3.203.00 3.10
MIN.
E2
NOM. MAX.
NE
ND
PKG.
CODES
1. DIMENSIONING & TOLERANCING CONFORM TO ASME Y14.5M-1994.
2. ALL DIMENSIONS ARE IN MILLIMETERS. ANGLES ARE IN DEGREES.
3. N IS THE TOTAL NUMBER OF TERMINALS.
4. THE TERMINAL #1 IDENTIFIER AND TERMINAL NUMBERING CONVENTION SHALL
CONFORM TO JESD 95-1 SPP-012. DETAILS OF TERMINAL #1 IDENTIFIER ARE
OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE TERMINAL #1
IDENTIFIER MAY BE EITHER A MOLD OR MARKED FEATURE.
5. DIMENSION b APPLIES TO METALLIZED TERMINAL AND IS MEASURED BETWEEN 0.25 mm AND 0.30 mm
FROM TERMINAL TIP.
6. ND AND NE REFER TO THE NUMBER OF TERMINALS ON EACH D AND E SIDE RESPECTIVELY.
7. DEPOPULATION IS POSSIBLE IN A SYMMETRICAL FASHION.
8. COPLANARITY APPLIES TO THE EXPOSED HEAT SINK SLUG AS WELL AS THE TERMINALS.
9. DRAWING CONFORMS TO JEDEC MO220, EXCEPT EXPOSED PAD DIMENSION FOR T2855-1,
T2855-3 AND T2855-6.
NOTES:
SYMBOL
PKG.
N
L1
e
E
D
b
A3
A
A1
k
10. WARPAGE SHALL NOT EXCEED 0.10 mm.
JEDEC
T1655-1
3.203.00 3.10 3.00 3.10 3.20
0.70 0.800.75
4.90
4.90
0.25
0.25
0
--
4
WHHB
4
16
0.350.30
5.10
5.105.00
0.80 BSC.
5.00
0.05
0.20 REF.
0.02
MIN. MAX.NOM.
16L 5x5
3.10
T3255-2
3.00
3.20
3.00 3.10 3.20
2.70
T2855-2 2.60 2.602.80 2.70 2.80
L
0.30 0.500.40
---
---
WHHC
20
5
5
5.00
5.00
0.30
0.55
0.65 BSC.
0.45
0.25
4.90
4.90
0.25
0.65
--
5.10
5.10
0.35
20L 5x5
0.20 REF.
0.75
0.02
NOM.
0
0.70
MIN.
0.05
0.80
MAX.
---
WHHD-1
28
7
7
5.00
5.00
0.25
0.55
0.50 BSC.
0.45
0.25
4.90
4.90
0.20
0.65
--
5.10
5.10
0.30
28L 5x5
0.20 REF.
0.75
0.02
NOM.
0
0.70
MIN.
0.05
0.80
MAX.
---
WHHD-2
32
8
8
5.00
5.00
0.40
0.50 BSC.
0.30
0.25
4.90
4.90
0.50
--
5.10
5.10
32L 5x5
0.20 REF.
0.75
0.02
NOM.
0
0.70
MIN.
0.05
0.80
MAX.
0.20 0.25 0.30
DOWN
BONDS
ALLOWED
NO
YES3.103.00 3.203.103.00 3.20T2055-3
3.103.00 3.203.103.00 3.20T2055-4
T2855-3 3.15 3.25 3.35 3.15 3.25 3.35
T2855-6 3.15 3.25 3.35 3.15 3.25 3.35
T2855-4 2.60 2.70 2.80 2.60 2.70 2.80
T2855-5 2.60 2.70 2.80 2.60 2.70 2.80
T2855-7 2.60 2.70
2.80
2.60 2.70 2.80
3.203.00 3.10T3255-3 3.203.00 3.10
3.203.00 3.10T3255-4 3.203.00 3.10
NO
NO
NO
NO
NO
NO
NO
NO
YES
YES
YES
YES
3.203.00T1655-2 3.10 3.00 3.10 3.20 YES
NO3.203.103.003.10T1655N-1 3.00 3.20
3.353.15T2055-5 3.25 3.15 3.25 3.35
Y
3.35
3.15T2855N-1 3.25 3.15 3.25 3.35
N
3.35
3.15T2855-8 3.25 3.15 3.25 3.35
Y
3.203.10T3255N-1 3.00
NO
3.203.103.00
L
0.40
0.40
**
**
**
**
**
**
**
**
**
**
**
**
**
**
**
**
**
**
**
SEE COMMON DIMENSIONS TABLE
±0.15
11. MARKING IS FOR PACKAGE ORIENTATION REFERENCE ONLY.
G
2
2
21-0140
PACKAGE OUTLINE,
16, 20, 28, 32L THIN QFN, 5x5x0.8mm
-DRAWING NOT TO SCALE-
12. NUMBER OF LEADS SHOWN ARE FOR REFERENCE ONLY.

MAX9996ETP+TD

Mfr. #:
Manufacturer:
Maxim Integrated
Description:
Up-Down Converters SiGe 1700-2200MHz Downconversion Mixer
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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