MAX9996ETP+TD

MAX9996
SiGe High-Linearity, 1700MHz to 2200MHz
Downconversion Mixer with LO Buffer/Switch
_______________________________________________________________________________________ 7
40
30
60
35
50
45
55
1500 1700 1900 2100 2300
RF-TO-IF ISOLATION
vs. RF FREQUENCY
MAX9996 toc28
RF FREQUENCY (MHz)
RF-TO-IF ISOLATION (dB)
T
C
= +85°C
T
C
= +25°C
T
C
= -25°C
40
30
60
35
50
45
55
1500 1700 1900 2100 2300
RF-TO-IF ISOLATION
vs. RF FREQUENCY
MAX9996 toc29
RF FREQUENCY (MHz)
RF-TO-IF ISOLATION (dB)
P
LO
= -3dBm, 0dBm, +3dBm
40
30
60
35
50
45
55
1500 1700 1900 2100 2300
RF-TO-IF ISOLATION
vs. RF FREQUENCY
MAX9996 toc30
RF FREQUENCY (MHz)
RF-TO-IF ISOLATION (dB)
V
CC
= 4.75V, 5.0V, 5.25V
30
40
0
35
20
25
10
15
5
1500 1700 1900 2100 2300 2500
RF PORT RETURN LOSS
vs. RF FREQUENCY
MAX9996 toc31
RF FREQUENCY (MHz)
RF PORT RETURN LOSS (dB)
P
LO
= -3dBm, 0dBm, +3dBm
30
50
0
40
45
35
20
25
10
15
5
50 150 200100 250 300 350
IF PORT RETURN LOSS
vs. IF FREQUENCY
MAX9996 toc32
IF FREQUENCY (MHz)
IF PORT RETURN LOSS (dB)
V
CC
= 4.75V, 5.0V, 5.25V
30
0
40
35
20
25
10
15
5
1500 1700 1900 2100 2300 2500
LO SELECTED RETURN LOSS
vs. LO FREQUENCY
MAX9996 toc33
LO FREQUENCY (MHz)
LO SELECTED RETURN LOSS (dB)
P
LO
= +3dBm
P
LO
= -3dBm
P
LO
= 0dBm
30
0
40
35
20
25
10
15
5
1500 1700 1900 2100 2300 2500
LO UNSELECTED RETURN LOSS
vs. LO FREQUENCY
MAX9996 toc34
LO FREQUENCY (MHz)
LO UNSELECTED RETURN LOSS (dB)
P
LO
= -3dBm, 0dBm, +3dBm
190
230
170
180
210
220
200
-30 -10 10 30 50 70 90
SUPPLY CURRENT
vs. TEMPERATURE (T
C
)
MAX9996 toc35
TEMPERATURE (°C)
SUPPLY CURRENT (mA)
V
CC
= 5.25V
V
CC
= 5.0V
V
CC
= 4.75V
Typical Operating Characteristics (continued)
(MAX9996 Typical Application Circuit, V
CC
= +5.0V, P
LO
= 0dBm, P
RF
= -5dBm, f
LO
> f
RF
, f
IF
= 200MHz, unless otherwise noted.)
MAX9996
Detailed Description
The MAX9996 high-linearity downconversion mixer pro-
vides 8.3dB of conversion gain and 26.5dBm of IIP3,
with a typical 9.7dB noise figure. The integrated baluns
and matching circuitry allow for 50 single-ended inter-
faces to the RF and the two LO ports. A single-pole, dou-
ble-throw (SPDT) switch provides 50ns switching time
between the two LO inputs with 43dB of LO-to-LO isola-
tion. Furthermore, the integrated LO buffer provides a
high drive level to the mixer core, reducing the LO drive
required at the MAX9996’s inputs to a -3dBm to +3dBm
range. The IF port incorporates a differential output,
which is ideal for providing enhanced IIP2 performance.
Specifications are guaranteed over broad frequency
ranges to allow for use in UMTS, cdma2000, and
2G/2.5G/3G DCS1800 and PCS1900 base stations. The
MAX9996 is specified to operate over a 1700MHz to
2200MHz RF frequency range, a 1900MHz to 2400MHz
LO frequency range, and a 40MHz to 350MHz IF fre-
quency range. Operation beyond these ranges is pos-
sible; see the Typical Operating Characteristics for
additional details.
This device can operate in low-side LO injection appli-
cations with an extended LO range, but performance
degrades as f
LO
continues to decrease. The
MAX9994—a variant of the MAX9996—provides better
low-side performance since it is tuned for a lower LO
range of 1400MHz to 2000MHz.
RF Input and Balun
The MAX9996 RF input is internally matched to 50,
requiring no external matching components. A DC-
blocking capacitor is required because the input is
internally DC shorted to ground through the on-chip
balun. Input return loss is typically 15dB over the entire
1700MHz to 2200MHz RF frequency range.
LO Inputs, Buffer, and Balun
The MAX9996 can be used for either high-side or low-
side injection applications with a 1900MHz to 2400MHz
LO frequency range. For a device with a 1400MHz to
2000MHz LO frequency range, refer to the MAX9994
data sheet. As an added feature, the MAX9996 includes
an internal LO SPDT switch that can be used for fre-
quency-hopping applications. The switch selects one of
the two single-ended LO ports, allowing the external
oscillator to settle on a particular frequency before it is
SiGe High-Linearity, 1700MHz to 2200MHz
Downconversion Mixer with LO Buffer/Switch
8 _______________________________________________________________________________________
Pin Description
PIN NAME FUNCTION
1, 6, 8, 14 V
CC
Power-Supply Connection. Bypass each V
CC
pin to GND with capacitors as shown in the Typical
Application Circuit.
2RF
Single-Ended 50 RF Input. This port is internally matched and DC shorted to GND through a balun.
Requires an external DC-blocking capacitor.
3 TAP
Center Tap of the Internal RF Balun. Bypass to GND with capacitors close to the IC, as shown in the
Typical Application Circuit.
4, 5, 10, 12,
13, 17
GND Ground
7 LOBIAS Bias Resistor for Internal LO Buffer. Connect a 549 ±1% resistor from LOBIAS to the power supply.
9 LOSEL Local Oscillator Select. Logic control input for selecting LO1 or LO2.
11 LO1 Local Oscillator Input 1. Drive LOSEL low to select LO1.
15 LO2 Local Oscillator Input 2. Drive LOSEL high to select LO2.
16 LEXT
External Inductor Connection. Connect a low-ESR, 10nH inductor from LEXT to GND. This inductor
carries approximately 100mA DC current.
18, 19 IF-, IF+
Differential IF Outputs. Each output requires external bias to V
CC
through an RF choke (see the
Typical Application Circuit).
20 IFBIAS IF Bias Resistor Connection for IF Amplifier. Connect an 806 resistor from IFBIAS to GND.
EP GND Exposed Ground Paddle. Solder the exposed paddle to the ground plane using multiple vias.
switched in. LO switching time is typically less than
50ns, which is more than adequate for virtually all GSM
applications. If frequency hopping is not employed, set
the switch to either of the LO inputs. The switch is con-
trolled by a digital input (LOSEL): logic-high selects
LO2, logic-low selects LO1. To avoid damage to the
part, voltage must be applied to V
CC
before digital logic
is applied to LOSEL. LO1 and LO2 inputs are internally
matched to 50, requiring only a 22pF DC-
blocking capacitor.
A two-stage internal LO buffer allows a wide input
power range for the LO drive. All guaranteed specifica-
tions are for an LO signal power from -3dBm to +3dBm.
The on-chip low-loss balun, along with an LO buffer,
drives the double-balanced mixer. All interfacing and
matching components from the LO inputs to the IF out-
puts are integrated on-chip.
High-Linearity Mixer
The core of the MAX9996 is a double-balanced, high-
performance passive mixer. Exceptional linearity is pro-
vided by the large LO swing from the on-chip LO
buffer. When combined with the integrated IF ampli-
fiers, the cascaded IIP3, 2LO-2RF rejection, and NF
performance is typically 26.5dBm, 72dBc, and 9.7dB,
respectively.
Differential IF Output Amplifier
The MAX9996 mixer has a 40MHz to 350MHz IF fre-
quency range. The differential, open-collector IF output
ports require external pullup inductors to V
CC
. Note that
these differential outputs are ideal for providing
enhanced 2LO-2RF rejection performance. Single-
ended IF applications require a 4:1 balun to transform
the 200 differential output impedance to a 50 single-
ended output. After the balun, the IF return loss is bet-
ter than 15dB.
Applications Information
Input and Output Matching
The RF and LO inputs are internally matched to 50.
No matching components are required. Return loss at
the RF port is typically 15dB over the entire input range
(1700MHz to 2200MHz) and return loss at the LO ports
is typically better than 16dB (1900MHz to 2400MHz).
RF and LO inputs require only DC-blocking capacitors
for interfacing.
The IF output impedance is 200 (differential). For
evaluation, an external low-loss 4:1 (impedance ratio)
balun transforms this impedance down to a 50 single-
ended output (see the Typical Application Circuit).
Bias Resistors
Bias currents for the LO buffer and the IF amplifier are
optimized by fine tuning resistors R1 and R2. If
reduced current is required at the expense of perfor-
mance, contact the factory for details. If the ±1% bias
resistor values are not readily available, substitute stan-
dard ±5% values.
LEXT Inductor
LEXT serves to improve the LO-to-IF and RF-to-IF leak-
age. The inductance value can be adjusted by the user to
optimize the performance for a particular frequency
band. Since approximately 100mA flows through this
inductor, it is important to use a low-DCR wire-wound coil.
If the LO-to-IF and RF-to-IF leakage are not critical
parameters, the inductor can be replaced by a short
circuit to ground.
Layout Considerations
A properly designed PC board is an essential part of
any RF/microwave circuit. Keep RF signal lines as short
as possible to reduce losses, radiation, and induc-
tance. For the best performance, route the ground pin
traces directly to the exposed pad under the package.
The PC board exposed pad MUST be connected to the
ground plane of the PC board. It is suggested that mul-
tiple vias be used to connect this pad to the lower level
ground planes. This method provides a good RF/ther-
mal conduction path for the device. Solder the exposed
pad on the bottom of the device package to the PC
board. The MAX9996 Evaluation Kit can be used as a
reference for board layout. Gerber files are available
upon request at www.maxim-ic.com.
Power-Supply Bypassing
Proper voltage-supply bypassing is essential for high-
frequency circuit stability. Bypass each V
CC
pin and
TAP with the capacitors shown in the Typical Application
Circuit; see Table 1. Place the TAP bypass capacitor to
ground within 100 mils of the TAP pin.
MAX9996
SiGe High-Linearity, 1700MHz to 2200MHz
Downconversion Mixer with LO Buffer/Switch
_______________________________________________________________________________________ 9

MAX9996ETP+TD

Mfr. #:
Manufacturer:
Maxim Integrated
Description:
Up-Down Converters SiGe 1700-2200MHz Downconversion Mixer
Lifecycle:
New from this manufacturer.
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