MC74LVXT4052
http://onsemi.com
3
MAXIMUM RATINGS
Symbol Parameter Value Unit
V
EE
Negative DC Supply Voltage (Referenced to GND) 7.0 to 0.5 V
V
CC
Positive DC Supply Voltage (Referenced to GND)
(Referenced to V
EE
)
0.5 to 7.0
0.5 to 7.0
V
V
IS
Analog Input Voltage V
EE
0.5 to V
CC
0.5 V
V
IN
Digital Input Voltage (Referenced to GND) 0.5 to 7.0 V
I DC Current, Into or Out of Any Pin 20 mA
T
STG
Storage Temperature Range 65 to 150 C
T
L
Lead Temperature, 1 mm from Case for 10 Seconds 260 C
T
J
Junction Temperature under Bias 150 C
JA
Thermal Resistance SOIC
TSSOP
143
164
°C/W
P
D
Power Dissipation in Still Air, SOIC
TSSOP
500
450
mW
MSL Moisture Sensitivity Level 1
F
R
Flammability Rating Oxygen Index: 30% − 35% UL 94−V0 @ 0.125 in
V
ESD
ESD Withstand Voltage Human Body Model (Note 1)
Machine Model (Note 2)
Charged Device Model (Note 3)
2000
200
1000
V
I
LATCHUP
Latchup Performance Above V
CC
and Below GND at 125°C (Note 4) 300 mA
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
1. Tested to EIA/JESD22−A114−A.
2. Tested to EIA/JESD22−A115−A.
3. Tested to JESD22−C101−A.
4. Tested to EIA/JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol Parameter Min Max Unit
V
EE
Negative DC Supply Voltage (Referenced to GND) 6.0 GND V
V
CC
Positive DC Supply Voltage (Referenced to GND)
(Referenced to V
EE
)
2.5
2.5
6.0
6.0
V
V
IS
Analog Input Voltage V
EE
V
CC
V
V
IN
Digital Input Voltage (Note 5) (Referenced to GND) 0 6.0 V
T
A
Operating Temperature Range, All Package Types 55 125 C
t
r
, t
f
Input Rise/Fall Time V
CC
= 3.0 V 0.3 V
(Channel Select or Enable Inputs) V
CC
= 5.0 V 0.5 V
0
0
100
20
ns/V
5. Unused inputs may not be left open. All inputs must be tied to a high−logic voltage level or a low−logic input voltage level.
DEVICE JUNCTION TEMPERATURE VERSUS
TIME TO 0.1% BOND FAILURES
Junction
Temperature °C
Time, Hours Time, Years
80 1,032,200 117.8
90 419,300 47.9
100 178,700 20.4
110 79,600 9.4
120 37,000 4.2
130 17,800 2.0
140 8,900 1.0
1
1 10 100
1000
FAILURE RATE OF PLASTIC = CERAMIC
UNTIL INTERMETALLICS OCCUR
Figure 3. Failure Rate vs. Time Junction Temperature
NORMALIZED FAILURE RATE
TIME, YEARS
T
J
= 130C
T
J
= 120C
T
J
= 110C
T
J
= 100C
T
J
= 90C
T
J
= 80C
