DFE18SANR24MG0L Datasheet DFE18SAN1R0MG0L, DFE18SANR24MG0L | P1-P3

Spec No. JETE243A-0036C-01 P 1/7

MURATA MFG.CO., LTD

Reference Only

CHIP COIL（CHIP INDUCTORS）DFE18SAN□□□MG0L REFERENCE SPECIFICATION

1. Scope

This reference specification applies to DFE18SAN_G0 series, Chip coil (Chip Inductors).

2.Part Numbering

(ex) DF E 18 SA N 1R0 M G 0 L

Product ID

Structure

Dimension

Applications

Category

Inductance

Tolerance

Dimension

Other Packaging

(L×W)

and

(T)

Characteristics

3.Rating

Operating Temperature Range

(Ambient temperature; Self-temperature rise is not included)

-40 to +85°C

(Product temperature; Self- temperature rise is included)

-40 to +125°C

Storage Temperature Range.

-40 to +85°C

Absolute maximum voltage

20V DC

Customer

Part Number

Murata

Part Number

Inductance

Resistance

(Ω)

*3 Rated Current

(Max.) (mA)

∗1 Based on

inductance

change

∗2 Based on

Temperatur

e rise

(µH)

Tolerance

(%)

DFE18SANR24MG0L 0.24

±20%

0.030

4900

3500

DFE18SANR47MG0L 0.47

0.054

3600

2600

DFE18SAN1R0MG0L 1.0

0.128

2100

1700

∗1:When applied Rated current to the Products , Inductance will be within ±30% of initial inductance value range.

*2: When applied Rated current to the Products, temperature rise caused by self-generated heat shall be limited to

40°C max.

.∗3:Keep the temperature (ambient temperature plus self-generation of heat) under 125.

4. Testing Conditions (Standard atmospheric conditions)

Temperature

: Ordinary Temperature (15 to 35°C) Temperature : 20 ± 2°C

Humidity

: Ordinary Humidity (25 to 85 %(RH)) Humidity : 60 to 70 %(RH)

Atmospheric Pressure : 86 to 106 kPa

5.Appearance and Dimensions

Marking

■Unit Mass (Typical value)

0.009 g

(in mm)

Spec No. JETE243A-0036C-01 P 2/7

MURATA MFG.CO., LTD

Reference Only

6. Electrical Performance

No. No. Item Specification

6.1 Inductance

Inductance shall meet item 3.

Measuring Equipment:

Agilent 4287A or equivalent

(0.5V)

Measuring Frequency: 1MHz

6.2 DC Resistance

Measuring Equipment: Digital multi meter

6.3 Rated Current Self temperature rise shall be

limited to 40°C max.

The rated current is applied.

7.Mechanical Performance

No. Item Specification Test Method

7.1 Bonding

Strength

Chip coil shall not be damaged. It shall be soldered on the substrate.

Applying Force(F) : 10N

Hold Duration: 5s

7.2 Bending

Strength

Substrate: Glass-epoxy substrate

(100×40×1.0mm)

Speed of Applying Force: 0.5mm / s

Deflection: 2mm

Hold Duration: 20s

(in mm)

7.3 Vibration It shall be soldered on the substrate.

Oscillation Frequency : 10 to 55 to 10Hz for 1m

Total amplitude : 1.5 mm or Acceleration amplitude

98m/s

whichever is smaller.

Testing Time: A period of 2 h in each of 3 mutually

perpendicular directions. (Total 6 h)

7.4 Solderability The wetting area of the electrode shall

be at least 90% covered with new

solder coating.

Flux:Ethanol solution of rosin,25(wt)%

(Immersed for 5 to 10s)

Solder : Sn-3.0Ag-0.5Cu

Pre-Heating:150±10°C / 60 to 90s

Solder Temperature:245±5°C

Immersion Time:3 s

7.5 Resistance to

Soldering

Heat

Appearance:No damage

Inductance Change : within ±10%

Reflow soldering method

Flux: Ethanol solution of rosin,25(wt)%

Solder: Sn-3.0Ag-0.5Cu

Pre-Heating: 150 to 180°C / 60 to 120s

Solder Temperature: 230°C min. / 20 to 40s

Peak Temperature: 250+5/-0°C

Reflow times: 2 times max.

Test board shall be 0.8 mm thick. Base material shall

be glass epoxy resin.

Then measured after exposure Standard atmospheric

conditions for 1~2 h.

Spec No. JETE243A-0036C-01 P 3/7

MURATA MFG.CO., LTD

Reference Only

8.Environmental Performance (It shall be soldered on the substrate.)

No. Item Specification Test Method

8.1 Heat

Resistance

Appearance:No damage

Inductance Change : within ±10%

Temperature: 125±2°C

Time: 500h (±12h)

Then measured after exposure Standard atmospheric

conditions for 1~2 h.

8.2 Cold

Resistance

Temperature: -40±2°C

Time: 500h (±12h)

Then measured after exposure Standard atmospheric

conditions for 1~2 h.

8.3 Humidity Temperature: 40±2°C

Humidity: 90 to 95%(RH)

Time: 500h (±12h)

Then measured after exposure Standard atmospheric

conditions for 1~2 h.

8.4 Temperature

Cycle

1 cycle:

1 step: -40±2°C / 30±3 m

2 step: Ordinary temp. / 3m max.

3 step: +125±2°C / 30±3 m

4 step: Ordinary temp. / 3m max.

Total of 100 cycles

Then measured after exposure Standard atmospheric

conditions for 1~2 h.

9. Specification of Packaging

9.1 Appearance and Dimensions of plastic tape

Unreeling direction

(in mm)

9.2 Specification of Taping

(1) Packing quantity (standard quantity)

3,000 pcs / reel

(2) Packing Method

Products shall be packed in the each embossed cavity of plastic tape and sealed by cover tape.

(3) Sprocket hole

The sprocket holes are to the right as the tape is pulled toward the user.

(4) Spliced point

Plastic tape and Cover tape has no spliced point.

(5) Missing components number

Missing components number within 0.1 % of the number per reel or 1 pc., whichever is greater, and

are not continuous. The specified quantity per reel is kept.

9.3 Pull Strength

Embossed carrier tape 9.8N min.

Cover tape 10N min.

9.4 Peeling off force of cover tape

Speed of Peeling off 300mm/min

Peeling off force

0.1 to 0.7N

(minimum value is typical)

165 to 180 degree

Cover tape

Plastic tape

P1-P3 P4-P6 P7-P7

DFE18SANR24MG0L

Mfr. #:

Buy DFE18SANR24MG0L

Manufacturer:

Description:

FIXED IND 240NH 3.5A 30 MOHM SMD

Lifecycle:

New from this manufacturer.

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DFE18SANR24MG0L

DFE18SANR24MG0L

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